Devices using a metal layer with an array of vias to reduce degradation

US007940249B2

(12) Ullltfild States Patent (10) Patent No.: US 7,940,249 B2 Perreault (45) Date of Patent: May 10, 2011 (54) DEVICES USINGA METAL LAYER WITH AN 5,639,235 A 11/1997 Asher ~~~~~~~~~~~~~~~~~~~~~~~~~ ~- 345/161 ARRAYT0 21215582‘ 13/1338 iii/53.8 DEGRADATION 5:825:352 A 10/1998 Bisset et al. 345/173 5,825,907 A 10/1998 R ....... .. 382/124 (75) Inventor: George Perreault, Campbell, CA (US) 5,862,248 A 1/ 1999 Sal:1St(i)no et al. 382/124 5,880,411 A 3/1999 Gillespie et al. 178/18.01 (73) Assignee: Authentec, Inc., Melboume, FL (US) 5,907,327 A 5/ I999 Ogum et aI~ ~~~~~~~~~~~~~~~~ ~~ 345/339 (Continued) ( * ) Notice: Subject to any disclaimer, the term of this patent is extended or adjusted under 35 FOREIGN PATENT DOCUMENTS U-SC 15401) by 1224 <1aYS~ JP 2000-056877 A 2/2000 (21) Appl. No.: ii/591,242 QTHER PUBLICATIQNS _ Xudong Jiang et al., “Fingerprint Minutiae Matching Based on the (22) Flledi 0°“ 311 2006 Local and Global slitlmm->3,” Sep. 2000, pp. 1038-1041, IEEE. (65) Prior Publication Data (Continued) Us 2007/0098228 A1 May 3’ 2007 Primary Examiner — Bipin Shalwala Related U.S. Application Data ‘(47S:§SZ1”ZExamiZer T SteVe11;E Holtgllll D D 1 ttorney, gent, or irm — en, yer, oppe t, (60) Provisional application No. 60/732,595, filed on Nov. Milbrath & Gilchrist’ p_A_ 1, 2005. (57) ABSTRACT (51) Int. Cl. _ _ _ _ _ G06F 3/041 (200601) A device in accordance with the present invention has a top G061;-3/044 (200601) metlal layler that shows increagedhreiiséance to d€gI'2l((112lI1OI1 (52) U.S. Cl. .................... .. 345/173; 178/18.06; 382/124 S“? as 2‘ "‘S‘°n2 °r°S‘.°n’ .°r ° " °Y‘°° 1° *‘°°°r we 58 F, Id f Cl _fi t, S h 345/173 178_ with the present invention includes a device layer and a top ( ) le 0 asslncg/1 eéllgcl 600 148/T33 2f metal layer. The device layer includes contact sensing ele' T ' ’ ’ ' ’ ments and has a plurality of depressions that extend into the 324/686-688; 382/124, 312, 316 - - - S 1. . fil f 1 h h. device layer. The first metal layer overlies or is adjacent to the ee app lcanon e or Comp ete Seam lstory contact sensing elements and extends into the depressions. (56) References Cited Preferably, a surface of the metal layer opposed to the device

layer is contoured to the depressions. In some embodiments the top metal layer makes electrical comiections to the contact sensor, but in other embodiments it does not. Preferably, the device fonns a finger swipe sensor, and the contact sensing elements are coupled to linger swipe processing electronics.

39 Claims, 9 Drawing Sheets

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