Semiconductor device, RFID tag and label-like object

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(12) United States Patent

Yamazaki

(io) Patent No.: (45) Date of Patent:

US 7,405,665 B2 Jul. 29, 2008

(54) SEMICONDUCTOR DEVICE, RFID TAG AND LABEL-LIKE OBJECT

(75) Inventor: Shunpei Yamazaki, Setagaya (JP)

(73) Assignee: Semiconductor Energy Laboratory Co., Ltd., Kanagawa-ken (JP)

( * ) Notice: Subject to any disclaimer, the term of this patent is extended or adjusted under 35 U.S.C. 154(b) by 202 days.

(21) Appl.No.: 11/013,370

(22) Filed: Dec. 17, 2004

(65) Prior Publication Data

US 2005/0134463 Al Jun. 23, 2005

(30) Foreign Application Priority Data

Dec. 19,2003 (JP) 2003-423872

(51) Int. CI.

G08B 13/14 (2006.01)

(52) U.S. CI 340/572.8; 340/572.1; 235/492;

257/679

(58) Field of Classification Search 340/572.8,

340/572.1, 572.5, 572.7, 571, 568.1; 235/492, 235/383, 385; 29/825, 843, 845; 257/679, 257/678, 666, 773, 674 See application file for complete search history.

An object of the present invention is to supply a semiconductor device capable of communicating data through radio communication, such as an RFID tag or a label-like object, with high productivity at low cost. In the invention, a memory portion, a signal control circuit portion and a communication circuit portion are formed with the use of a TFT formed over an insulating substrate, and the insulating substrate is fixed opposite to a support provided with an antenna so that the antenna is connected to a terminal portion connected to a communication circuit. The invention is an RFID tag and a label-like object including an ID chip whose memory portion, signal control portion and communication circuit portion are formed with the use of TFTs formed over an insulating substrate and an antenna formed to connect to a terminal portion of the ID chip, in which data stored in a memory portion or data to be stored in a memory portion can be communicated through a communication circuit by radio communication.

16 Claims, 19 Drawing Sheets

Page 2

U.S. PATENT DOCUMENTS

OTHER PUBLICATIONS

Nikkei Electronics, Sesame-Grain Sized Chip as Source, Feb. 25, 2002, pp. 109-137.

B. Lee et al., "A CPU on a Glass Substrate Using CG-Silicon TFTs,"
ISSCC Digest of Technical Papers, pp. 164-165, 2003.
T. Ikedaetal., "Full-Functional System Liquid Crystal Display Using
CG-Silicon Technology," SID Digest of Technical Papers, pp. 860-
863, 2004.

T. Takayama et al., "A CPU on a plastic film substrate," VLSI Tech-
nology Digest of Technical Papers, pp. 230-231, 2004.
M. Usami, A. Sato, K. Sameshima, K. Watanabe, H. Yoshigi, R.
Imura, "22.7 Powder LSI: An Ultra Small RF Identification Chip for
Individual Recognition Applications," ISSCC Digest of Technical
Papers, 2003, 3 pages.

* cited by examiner