Int. CI.
52] U.S. CI 165/1*443; 361/700; 257/715
58] Field of Search 165/10433; 361/700;
1151258 6/1989 Japan
2-078256 3/1990 Japan.
5-326774 12/1993 Japan.
1261029 9/1986 U.S.S.R
Sen No. 08497950, Jul. 1995, Osakabe et al. Sen No. 08504025, Jul. 1995, Osakabe et al. Sen No. 08503862, Jul. 1995, Osakabe et al. Sen No. 08524437, Sep. 1995, Osakabe et al.
Primary Examiner—John Rivell
Assistant Examiner—Christopher Atkinson
Attorney Agent, or Fi>m—Cushman, Darby & Cushman IP
Group of Pillsbury Madison & Sutro UUP
According to the present invention, a cooling apparatus includes a refrigerant tank composed of at least a couple of thin plate materials f acing each other and bonded together at bonding parts thereof, a heating body mounted on an outer surface of the thin plates, refrigerant sealed in the refrigerant tank for absorbing heat generated by the heating body, the refrigerant vaporizing in the refrigerant tank, a heat radiator mounted on the refrigerant tank in fluid cominunkation therewith for condensing and liquefying boiling vapor ascending from the refrigerant tank, and a refrigerant flow control plate composed of a plate material and disposed in an upper part of the refrigerant tank in contact with the thin plate materials facing each other. The refrigerant flow control plate partitions an inside of the refrigerant tank into a vapor outlet and a liquid inlet. The vapor outlet is defined by one surface of the refrigerant flow control plate and the thin plate materials facing each other to flow out the boiling vapor boiled and ascending within the refrigerant tank into the heat radiator, and the liquid inlet is defined by the other surface of me refrigerant flow control plate and me thin plate materials facing each other to introduce the condensed liquid into the refrigerant tank.
19 Claims, 18 Drawing Sheets