IC PACKAGE HAVING A SINGLE WIRING SHEET WITH A LEAD PATTERN DISPOSED THEREON
 Inventors: Etsuji Suzuki, Yokohama; Akira
Yonezawa, Tokyo; Hidehisa Yamazaki,
Okayama-ken; Hiroshi Odaira,
Chigasaki, all ol Japan
 Assignee: Yamaichi Electronics Co., Ltd., Tokyo, Japan
 Appl. No.: 08/848,585
 Filed: Apr. 29, 1997
 Foreign Application Priority Data
Apr. 30, 1996 [JP] Japan 8-109767
 Int. CI.6 H01L 23/48; H01L 23/52
 U.S. CI 257/692; 257/693; 257/696;
 Field of Search 257/701, 702,
257/703, 700, 706, 707, 664, 778, 786, 776, 773, 692, 693, 696
 References Cited
U.S. PATENT DOCUMENTS
3,641,401 2/1972 Lynch .
3,838,443 9/1974 Laighton .
3,908,186 9/1975 Anazawa et al. .
3,930,115 12/1975 Uden et al. .
An IC package is provided that has a flexible wiring sheet, including an upper portion, a lower portion and a side portion which is wound around a base member over an upper surface, side surfaces and a lower surface ol the base member. An IC is loaded on an upper surface ol the upper flexible wiring sheet covering the upper surface ol the base member. The IC is connected to an electrode provided on an upper lead pattern portion laid along the upper surface ol the flexible wiring sheet. The lead pattern is extended from the upper flexible wiring sheet to the lower flexible wiring sheet via the side surfaces ol the flexible wiring sheet covering side surfaces ol the base member. An electrode to be connected with an object is arranged on the lower lead pattern portion which is formed on the lower flexible wiring sheet, and overall the IC or an IC connection portion is sealed on the upper surface ol the upper flexible wiring sheet.
28 Claims, 3 Drawing Sheets