A plurality of multi-chip modules are stacked and bonded around the perimeter by sold-bump bonds to adjacent modules on, for instance, three sides of the perimeter. The fourth side can be used for coolant distribution, for more interconnect structures, or other features, depending on particular design...http://www.google.ca/patents/US5241450?utm_source=gb-gplus-sharePatent US5241450 - Three dimensional, multi-chip module
