There is a process for producing a semiconductor wafer having a front surface and a back surface and a polished edge, in which the semiconductor wafer is subjected to polishing on both sides. The process includes the following temporal sequence of steps: (a) polishing of the edge of the semiconductor...http://www.google.ca/patents/US20010014570?utm_source=gb-gplus-sharePatent US20010014570 - Process for producing a semiconductor wafer with polished edge
