Methods are provided for hermetically sealing the reservoirs of microchip devices and for hermetically sealing the substrate assemblies in a hermetic packaging structure. In one embodiment, the method comprises (1) providing a primary substrate having a front side and a back side, the substrate comprising...http://www.google.ca/patents/US6827250?utm_source=gb-gplus-sharePatent US6827250 - Methods for hermetically sealing microchip reservoir devices
