A plurality of electrodes are formed on one surface of a semiconductor integrated circuit chip. A plurality of leads are arranged around the chip. Each of the electrodes and one end of each of the leads are connected. The electrodes and the chip are sandwiched between two films. One of the films is in...http://www.google.ca/patents/US5448106?utm_source=gb-gplus-sharePatent US5448106 - Thin semiconductor integrated circuit device assembly
