There is provided an improved stacking scheme for micro-BGA packages so as to provide a high density integrated circuit package. The integrated circuit package assembly (300) includes a sheet-like interposer (312) which is formed of a main portion (312a) and an extension (312b) extending outwardly from...http://www.google.ca/patents/US5598033?utm_source=gb-gplus-sharePatent US5598033 - Micro BGA stacking scheme
