Apparatus and concomitant method for simulating a chemical mechanical polishing (CMP) system containing a polishing pad, a chuck for supporting a substrate, a positioner for positioning the polishing pad with respect to the substrate, a chuck rotator for rotating the chuck, and a polishing pad rotator...http://www.google.ca/patents/US5599423?utm_source=gb-gplus-sharePatent US5599423 - Apparatus and method for simulating and optimizing a chemical mechanical polishing system
