A module of electrically interconnected integrated circuit packages and methods of making the module are disclosed. The module includes at least first and second integrated circuit packages, each of which are comprised of a package body formed of an encapsulant material. A plurality of leads extend from...http://www.google.ca/patents/US6404046?utm_source=gb-gplus-sharePatent US6404046 - Module of stacked integrated circuit packages including an interposer
