A cooling apparatus for an electronics assembly having a substrate and one or more electronics devices includes an enclosure sealably engaging the substrate to form a cavity, with the electronics devices and a heat exchange assembly being disposed within the cavity. The heat exchange assembly defines...http://www.google.ca/patents/US7184269?utm_source=gb-gplus-sharePatent US7184269 - Cooling apparatus and method for an electronics module employing an integrated heat exchange assembly
