In a method and system for fabricating a semiconductor device (100) having a package-on-package structure, a base laminate substrate (BLS) (110) is formed to include a base center portion (112) and a peripheral portion (114) separated by a barrier element (120). The barrier element (120) forms a peripheral...http://www.google.ca/patents/US7883936?utm_source=gb-gplus-sharePatent US7883936 - Multi layer low cost cavity substrate fabrication for PoP packages
