An integrated circuit device package of this invention includes a flexible substrate having an upper patterned insulative layer, and a lower patterned conductive layer including a plurality of package leads. An integrated circuit die is fixed within a void of the upper surface of the flexible substrate,...http://www.google.ca/patents/US5386342?utm_source=gb-gplus-sharePatent US5386342 - Rigid backplane formed from a moisture resistant insulative material used to protect a semiconductor device
