Cost is reduced and reliability is improved with a BGA (Ball Grid Array) type semiconductor device which has ball-shaped conductive terminals. A first wiring is formed on an insulation film which is formed on a surface of a semiconductor die. A glass substrate is bonded over the surface of the semiconductor...http://www.google.ca/patents/US20030230805?utm_source=gb-gplus-sharePatent US20030230805 - Semiconductor device and manufacturing method thereof
