In a semiconductor device and a method for manufacturing the same according to the present invention, a bonding wire is bonded to an electrode pad of a semiconductor element by ball bonding. The bonding wire is cut to have a predetermined length, and compressed and crushed into a bump. By doing so, a...http://www.google.ca/patents/US5536973?utm_source=gb-gplus-sharePatent US5536973 - Semiconductor device including a semiconductor element mounted on a substrate using bump-shaped connecting electrodes
