A method for packaging a semiconductor die includes the steps of; attaching the die to a lead-on-chip (LOC) leadframe; electrically connecting bond pads on the die to lead fingers on the leadframe; forming a glob top on the bond pads and a portion of the lead fingers; and then trimming and ...http://www.google.ca/patents/US5789803?utm_source=gb-gplus-sharePatent US5789803 - Semiconductor package
