In one aspect, the invention includes a method of encapsulating a semiconductor device, comprising: a) providing a semiconductor device; b) providing a dispensing apparatus having a plurality of dispensing orifices proximate the semiconductor device; and c) dispensing a liquid encapsulating material...http://www.google.ca/patents/US6383292?utm_source=gb-gplus-sharePatent US6383292 - Semiconductor device encapsulators
