A method for processing semiconductor wafers is disclosed. A solution is applied to a semiconductor wafer to prevent dendrites and electrolytic reactions at the surface of metal interconnects. The solution can be applied during a CMP process or during a post CMP cleaning process. The solution may include...http://www.google.ca/patents/US7579279?utm_source=gb-gplus-sharePatent US7579279 - Method to passivate conductive surfaces during semiconductor processing
