In an interconnection film cutting method and apparatus therefor according to the present invention, a laser beam having a pulse width of 10.sup.-9 second or less is illuminated on a desired portion of the interconnection pattern of a semiconductor device, such as a link used for redundant operation...http://www.google.ca/patents/US5208437?utm_source=gb-gplus-sharePatent US5208437 - Method of cutting interconnection pattern with laser and apparatus thereof
