An IC package is provided that has a flexible wiring sheet, including an upper portion, a lower portion and a side portion which is wound around a base member over an upper surface, side surfaces and a lower surface of the base member. An IC is loaded on an upper surface of the upper flexible wiring...http://www.google.ca/patents/US5973395?utm_source=gb-gplus-sharePatent US5973395 - IC package having a single wiring sheet with a lead pattern disposed thereon
