Polishing compositions for metal CMP with reduced dishing and overpolish insensitivity are formulated to have a low static etching rate at high temperatures, e.g., higher than 50 C. Embodiments include abrasive-free polishing compositions comprising one or more chelating agents, one or more oxidizers,...http://www.google.ca/patents/US20020148169?utm_source=gb-gplus-sharePatent US20020148169 - Composition for metal CMP with low dishing and overpolish insensitivity
