Some embodiments of the present invention relate to an electronic assembly that includes a substrate and a die. The electronic assembly further includes an alignment bump on one of the die and the substrate and a group of mating bumps on the other of the die and the substrate. The group of mating bumps...http://www.google.ca/patents/US7135771?utm_source=gb-gplus-sharePatent US7135771 - Self alignment features for an electronic assembly
