Embodiments of a closed-contact electroplating cup are disclosed. One embodiment comprises a cup bottom comprising an opening, and a seal disposed on the cup bottom around the opening. The seal comprises a wafer-contacting peak located substantially at an inner edge of the seal. The embodiment also comprises...http://www.google.ca/patents/US7985325?utm_source=gb-gplus-sharePatent US7985325 - Closed contact electroplating cup assembly
