There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a MEMS device, and technique of fabricating or manufacturing a MEMS device, having mechanical structures encapsulated in a chamber prior to final packaging. An embodiment further includes a...http://www.google.ca/patents/US20070042521?utm_source=gb-gplus-sharePatent US20070042521 - Microelectromechanical devices and fabrication methods
