It is an object of the present invention to provide a semiconductor chip which is hard to be damaged when the semiconductor chip is cut out from a sheet of wafer for semiconductor and a method for manufacturing thereof. Cutting grooves 26 having a wider width than scribing lines (lines for carrying out...http://www.google.ca/patents/US6107161?utm_source=gb-gplus-sharePatent US6107161 - Semiconductor chip and a method for manufacturing thereof
