A method for forming barrier layers comprises steps of providing a conductive layer, forming a first dielectric layer on the conductive layer, the first dielectric layer having a via therein, forming a first metal layer covering the first dielectric layer and the conductive layer, forming a layer of...http://www.google.ca/patents/US20070105367?utm_source=gb-gplus-sharePatent US20070105367 - Method for forming barrier layer
