An embodiment may comprise a test probe to measure electrical properties of a semiconductor package having ball-shaped terminals. The probe may include a signal tip and a ground tip. The signal tip may have a spherical lower surface allowing good contact with a ball-shaped signal terminal. The ground...http://www.google.ca/patents/US7471097?utm_source=gb-gplus-sharePatent US7471097 - Test probe with planar ground tip extending transversely from the ground barrel for a semiconductor package
