Electronic assemblies and methods for forming assemblies are described. One embodiment includes a method of forming an electronic assembly, including forming a plurality of first solder bumps on one of a substrate and an interposer. The substrate and interposer are positioned so that the first solder...http://www.google.ca/patents/US7160757?utm_source=gb-gplus-sharePatent US7160757 - Gap control between interposer and substrate in electronic assemblies
