A heat dissipation system and method for extracting heat from an integrated circuit device includes, in one example embodiment, a thermally conductive base plate. The heat dissipation system and method further includes an array of substantially parallel fin structures having top and bottom portions....http://www.google.ca/patents/US6501655?utm_source=gb-gplus-sharePatent US6501655 - High performance fin configuration for air cooled heat sinks
