Integrated circuit (IC) packages employing two-phase microchannel heat exchangers for cooling the packages' IC dies and cooling systems employing the same are disclosed. The heat exchangers include thermal masses having a plurality of microchannels formed therein. In one set of configurations, the IC...http://www.google.ca/patents/US6903929?utm_source=gb-gplus-sharePatent US6903929 - Two-phase cooling utilizing microchannel heat exchangers and channeled heat sink
