A multi-layered dielectric layer wherein the adhesion characteristic of an insulating layer including a SiCH3 bond is improved, and a method of forming the same are provided. The multi-layered dielectric layer is formed on conductive patterns and includes a first insulating layer formed of a layer having...http://www.google.ca/patents/US6485815?utm_source=gb-gplus-sharePatent US6485815 - Multi-layered dielectric layer including insulating layer having Si-CH3 bond therein and method for fabricating the same
