A rerouting element for a semiconductor device that includes a dielectric film that carries conductive vias, conductive elements, and contact pads. The conductive vias are positioned at locations that correspond to the locations of bond pads of a semiconductor device with which the rerouting element...http://www.google.ca/patents/US6987325?utm_source=gb-gplus-sharePatent US6987325 - Bond pad rerouting element and stacked semiconductor device assemblies including the rerouting element
