A micro inertia sensor fabrication method in which thick silicon bonded to glass is processed at a high sectional ratio, is provided. In this method, silicon is bonded to a glass substrate, the bonded silicon is polished to have a desired thickness, a silicon structure is formed by etching the polished...http://www.google.ca/patents/US6242276?utm_source=gb-gplus-sharePatent US6242276 - Method for fabricating micro inertia sensor
