Probes for electronic devices are described. The probe is formed by ball bonding a plurality of wires to contact locations on a fan out substrate surface. The wires are cut off leaving stubs. A patterned polymer sheet having electrical conductor patterns therein is disposed over the stubs which extend...http://www.google.ca/patents/US5914614?utm_source=gb-gplus-sharePatent US5914614 - High density cantilevered probe for electronic devices
