WO2014190483A1

WO2014190483A1 - Method and apparatus for managing laser process parameters in a robotic laser cell

Info

Publication number: WO2014190483A1
Application number: PCT/CN2013/076314
Authority: WO
Inventors: Peng KONG; Shaojie Cheng
Original assignee: Abb Technology Ltd
Priority date: 2013-05-28
Filing date: 2013-05-28
Publication date: 2014-12-04
Also published as: EP3003650A4; EP3003650A1; CN105163913B; CN105163913A

Abstract

A method and apparatus for managing laser process parameters in a robotic laser cell (100). The method may comprise displaying, in a teach pendant unit TPU (113) of the robotic laser cell (100), the laser process parameters, wherein the laser process parameters are stored in a table process parameter table at a robot controller (112) of the robotic laser cell (100); and performing an operation on the laser process parameters in the TPU (113). All laser process parameters may be collectively managed in the TPU (113). Thus, task such as setting laser process parameters, which would have been rather difficult, may become an easy job, due to reuse of verified parameters in a parameter table that is created by laser expert or programmer.

Description

METHOD AND APPARATUS FOR MANAGING LASER PROCESS PARAMETERS IN A ROBOTIC LASER CELL FIELD OF THE INVENTION

[0001] Embodiments of the present disclosure generally relate to a robotic laser cell and more particularly relate to a method and apparatus for managing laser process parameters in a robotic laser cell. BACKGROUND OF THE INVENTION

[0002] Laser machining technology is a machining process for processing a work piece by directing a beam of laser towards the work piece. As a precision machining technology, the laser machining has been widely used in various applications, such as cutting, welding, surface treatment, perforating, micro-machining and etc. Moreover, the laser machining may be performed on various materials such as metal material, nonmetal material, metal base or nonmetal base composite material, leather, woods, fibers and so on. Conventionally, the laser machining is performed by a laser process tool or machine under control of a machining program. However, with the development of technologies, there was emerged an industrial robot unit, which may be used to perform laser machining.

[0003] Generally, the industrial robot unit may be programmed to carry out work along an operation path. In order to program or teach the robot unit to work, the robot unit is manipulated to position along the desired operation path. The industrial robot unit can be operated in different operating modes. For example, when the robot unit is put into manual operating mode, the robot unit is controlled by means of a portable operator control device, generally denoted a Teach Pendant Unit (TPU). On the other hand, when the robot unit is switched into automatic mode, the robot controller will control the robot unit.

[0004] The portable operator control device TPU is used for manually controlling the industrial robot unit, for example, to teach or program the robot unit to following a predetermined operations path. The TPU may also be used for monitoring the robot program, change certain variables in the programs, starting, stopping and editing program, and so on.

[0005] Taking a laser cutting as an example, a robotic laser cell for laser machining may normally comprise a robot for performing laser cutting, a cutting head carried by an arm of the robot, a laser source for providing the laser, and a laser directing means for directing the laser towards the work piece to be cut.

[0006] However, in the existing robot laser cell, use of the robotic laser cell, specifically in terms of laser process parameter management, is quite inconvenient, and has a low efficiency. Therefore, in the art, there is a need for improving the robot laser cell.

SUMMARY OF THE INVENTION

[0007] In view of the foregoing, the present disclosure provides an improved solution for managing laser process parameters in a robotic laser cell so as to solve or at least partially mitigate at least a part of problems in the prior art.

[0008] According to a first aspect of the present disclosure, there is provided a method for managing laser process parameters in a robotic laser cell. The method may comprise: displaying, in a teach pendant unit TPU of the robotic laser cell, the laser process parameters, wherein the laser process parameters are stored in a laser process parameter table at a robot controller of the robotic laser cell; and performing an operation on the laser process parameters in the TPU.

[0009] In an embodiment of the present disclosure, the laser process parameter table may be stored separately from a robot program, at the robot controller of the robotic laser cell

[0010] In another embodiment of the present disclosure, the method may further comprise: transmitting at least one of the laser process parameters, which is related to laser process control to a laser head and/or a laser source of the robotic laser cell during a laser processing, so as to control the laser head and the laser source.

[0011] In still another embodiment of the present disclosure, the method may further comprise loading laser process parameters in an activated table into a robot program so as to control a laser processing.

[0012] In a further embodiment of the present disclosure, the operation may comprise at least one of: checking; activating; creating; deleting; editing; saving and copying.

[0013] In a still further embodiment of the present disclosure, the laser process parameters associated with a laser processing may be displayed in a tab with tags, and wherein the tags are configured to display laser process parameters for laser sub-processes individually.

[0014] In a yet further embodiment of the present disclosure, the laser process parameters may be displayed in response to opening a laser parameter table referenced in a robot program.

[0015] In a still yet further embodiment of the present disclosure, the laser process parameters may be displayed in a table list comprising at least one parameter table having cutting parameters associated therewith.

[0016] According to a second aspect of the present disclosure, there is provided an apparatus for managing laser process parameters in a robotic laser cell. The apparatus may comprise a parameter display unit configured to display, in a teach pendant unit TPU of the robotic laser cell, the laser process parameters, wherein the laser process parameters are stored in a laser process parameter table at a robot controller of the robotic laser cell; and a parameter operation unit configured to perform an operation on the laser process parameters in the TPU.

[0017] According to a third aspect of the present disclosure, there is also provided a teach pendant unit in a robotic laser cell. The teach pendant unit may comprise an apparatus according to the second aspect of the present disclosure.

[0018] According to a fourth aspect of the present disclosure, there is further provided a robotic laser cell. The robotic laser cell may comprise a teach pendant unit according to the third aspect of the present disclosure.

[0019] With embodiments of the present disclosure, laser process parameters are stored in a laser process parameter table at the robot controller, and thus all laser process parameters may be collectively managed in the TPU. Thus, critical tasks such as setting laser process parameters, which would have been rather difficult, may become an easy job, due to reuse of verified parameters in a parameter table that is created by laser expert or programmer. Accordingly, for an operator, it may save operation time and keep a high machining quality; for a factory, it may improve the programming efficiency, keep high quality, reduce demands of the expert operators and save training for freshmen; and for system integrator, it can help build up a laser machining knowledge library and extend best practices.

BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The above and other features of the present disclosure will become more apparent through detailed explanation on the embodiments as illustrated in the description with reference to the accompanying drawings, throughout which like reference numbers represent same or similar components and wherein:

[0021] Fig. 1 schematically illustrates a system configuration of an exemplary robotic laser cell according to an embodiment of the present disclosure;

[0022] Fig. 2 schematically illustrates a flow chart of a method for managing laser process parameters in a robotic laser cell according to an embodiment of the present disclosure;

[0023] Fig. 3 schematically illustrates a diagram showing a robot program with a laser parameter table as an argument;

[0024] Fig. 4 schematically illustrates a diagram of a laser cutting parameter table in an edit view in TPU according to an embodiment of the present disclosure;

[0025] Fig. 5 schematically illustrates a diagram of cutting groups in the laser cutting parameter table according to an embodiment of the present disclosure.

[0026] Fig. 6 schematically illustrates a diagram of a cutting table list view in

TPU according to an embodiment of the present disclosure.

[0027] Fig. 7 schematically illustrates a diagram of laser parameter tables management according to an embodiment of the present disclosure;

[0028] Fig. 8 schematically illustrates of a diagram of synchronization between the robot movement and the laser process control according to an embodiment of the present disclosure; and

[0029] Fig. 9 schematically illustrates a block diagram of an apparatus for managing laser process parameters in a robotic laser cell according to an embodiment of the present disclosure.

DETAILED DESCRIPTION OF EMBODIMENTS

[0030] Hereinafter, a method and apparatus for managing laser process parameters in a robotic laser cell, a TPU and a robotic laser cell will be described in details through embodiments with reference to the accompanying drawings. It should be appreciated that these embodiments are presented only to enable those skilled in the art to better understand and implement the present disclosure, not intended to limit the scope of the present disclosure in any manner.

[0031] In the accompanying drawings, various embodiments of the present disclosure are illustrated in block diagrams, flow charts and other diagrams. Each block in the flowcharts or block may represent a module, a program, or a part of code, which contains one or more executable instructions for performing specified logic functions and indispensible step, operation, or block is illustrated in a dotted line. Besides, although these blocks are illustrated in particular sequences for performing the steps of the methods, as a matter of fact, they may not necessarily be performed strictly according to the illustrated sequence. For example, they might be performed in reverse sequence or simultaneously, which is dependent on natures of respective operations. It should also be noted that block diagrams and/or each block in the flowcharts and a combination of thereof may be implemented by a dedicated hardware-based system for performing specified functions/operations or by a combination of dedicated hardware and computer instructions.

[0032] Generally, all terms used in the claims are to be interpreted according to their ordinary meaning in the technical field, unless explicitly defined otherwise herein. All references to "a/an/the/said [element, device, component, means, step, etc]" are to be interpreted openly as referring to at least one instance of said element, device, component, means, unit, step, etc., without excluding a plurality of such devices, components, means, units, steps, etc., unless explicitly stated otherwise. Besides, the indefinite article "a/an" as used herein does not exclude a plurality of such steps, units, modules, devices, and objects, and etc.

[0033] For a better understanding of the present disclosure, the following description will be made to embodiments of the present disclosure by taking a laser cutting as an example. However, as can be appreciated by those skilled in the art, the present disclosure could be applied to any other laser machining, for example, laser welding, surface treatment, micro-machining, etc.

[0034] First, reference will made to Fig. 1 to describe a system configuration of an exemplary robotic laser cell according to an embodiment of the present disclosure. As is illustrated in Fig. 1, the robotic laser cell 100 may comprise a robot 110, a laser head 120, a control box 130 for the laser head 120, and a laser source 140. The robot 110 includes a robot arm 111, a robot controller 112 and a TPU 113. The robot arm 111 is a key mechanical component of the robot 110, which will position along the desired operation path under control of the robot controller 112. The robot controller 112 is a core control component in the robotic laser cell 100, which will issue commands to the robot arm, the control box of the laser head and the laser source so as to control the machining process. In the robot controller 112, there is stored a robot program 114 and a laser parameter table 115. The robot program 114 is a program for controlling detailed operations of the laser machining process and in the laser parameter table 155 are stored all parameters that are to be used in laser machining process. Just by means of the robot program and the laser parameter table loaded therein, the robot controller 112 controls the whole laser machining process. The TPU 113 is used for manually controlling the industrial robot unit, for example, so as to teach or program the robot unit. The TPU 113 may comprise a control means such as operation keys, a joystick, etc., and a display unit for displaying data or information, such as a liquid crystal display (LCD), a thin-film transistor display (TFT), a light-emitting diode (LED) display, and etc. Actually, the solution as provided in the present disclosure is implemented by means of the TPU 113.

[0035] The laser head 120, for example, a laser cutting head is a machining component for processing work pieces, and there is provided a control box 130 for the laser head 120, so as to control operations of the laser head 120. The laser source 140 is a source for emitting a laser beam under control of the robot controller 112 and the laser beam will be directed towards the work piece to be machined. Under control of the robot controller 112, the robot arm 111 will carry the laser head long the desired operation path and the laser emitted from the laser source will be directed to desired location of a work piece, thereby performing desired laser machining operations.

[0036] Next, detailed operations of the method as proposed in the present disclosure will be described with reference to Figs. 2 to 8.

[0037] As illustrated in Fig. 2, first as step S201, the laser process parameters are displayed in TPU of the robotic laser cell, wherein the laser process parameters are stored in a laser process parameter table at a robot controller of the robotic laser cell.

[0038] In existing robotic laser cells, some of the laser process parameters are set at the laser source, some of the laser process parameters are set at the laser head, and other laser process parameters are managed in the robot. That means, if to set laser process parameter for a laser process, it required operators to set at three different components. Such parameter setting is quite inconvenience and has a low efficiency. In the present disclosure, it conceives to manage all laser process parameters at the TPU of the robotic laser cell, or in other word, the management of laser process parameters are centralized in the robotic laser cell. Specifically, these parameters may be stored in a parameter table at the robot controller of the robotic laser cell and be managed by means of the TPU of the robotic laser cell.

[0039] Fig. 3 illustrates a diagram showing a robot program with a laser parameter table as an argument. The diagram of the robot program is that displayed in the TPU of the robotic laser cell, it is used for laser cutting and includes many instructions as illustrated in Fig. 3. A cut instruction moves the robot and uses the laser parameters table as an argument to control the laser process. In Fig. 3, there is illustrated a highlighted instruction, wherein "TableConf31" that is a laser process parameter table, is referenced in the instruction as an argument. The operator, for example, may select the robot instruction, and, in response to this, the parameter table may be opened and the laser process parameter in the laser table may be displayed accordingly, for example as illustrated in Fig. 4.

[0040] Fig. 4 schematically illustrates a diagram of a laser cutting parameter table in an edit view in TPU according to an embodiment of the present disclosure. As illustrated in Fig. 4, the laser process parameters associated with a laser process are displayed in a tab. The tab may contain a plurality of tags, and the tags are configured to display laser process parameters for laser sub-processes individually, i.e., one tag displays laser process parameters for one laser sub-process. In Fig. 4, in a first tag, it may also display summary or key information of the laser process parameters, for example, a cut power, a focal length, a focal point, a laser type, material, nozzle, thickness and etc. In subsequent tags, there are respectively displayed laser process parameters for different sub-processes such as Cutl, Cut2, Cut4, Cut4, Cut 5, Pierl, Pier2 and etc. Laser process parameters for a sub-process may be called as a laser parameter group. That is to say, the laser process parameter table may have several laser parameter groups and each of the laser parameter groups has different parameter values which are used for different cutting features in a work piece such as a big shape, a small shape, a piercing hole, or the like.

[0041] Fig. 5 schematically illustrates a diagram of one of cutting groups in the laser cutting parameter table according to an embodiment of the present disclosure. As illustrated in Fig. 5, a laser parameter group relating to cut 1 is illustrated, which includes value of parameters such as a cut speed, a power level, a minimum power level, a critical speed, acceleration, a cut program, type of gas and so on.

[0042] Referring back to Fig. 2, at Step S202, an operation may be performed on the laser process parameters in the TPU. For example, as illustrated in Figs. 4 and 5, in the displayed laser process parameters table, experts or operators may edit the parameter based on the knowledge they have and save the edited parameters or save a table as another table (i.e. copying).

[0043] Additionally, Fig. 6 schematically illustrates a diagram of a cutting table list view in TPU according to an embodiment of the present disclosure. As illustrated, in the cutting table list, there are two tables, i.e., a first one with a table name of newTable and a second one with a table name of (*)defaultLscuttingParameterTable. Through the illustrated view, experts or operators may search all cutting parameter tables in the controller and shows each table as a line with its key attributes such as robot type, max cutting power, part material, part thickness, focal point, and so on. Based on those key attributes as illustrated in Fig. 6, operator can, for example, select and active a proper cutting table for a cutting process. Then, corresponding parameter values will be applied to all cutting instructions in this cutting process. Thus, in an embodiment of the present disclosure, the laser process parameters in an activated table will be loaded into a robot program so as to control a laser processing (Step S203). Additionally, experts or operators may also cancel the activated table parameters.

[0044] Additionally, Fig. 7 schematically illustrates a diagram of laser parameter table management according to an embodiment of the present disclosure. As illustrated in Fig. 7, laser process parameters will be stored in a laser process parameter table at the robot controller 112 and these parameters will be managed collectively in the robot system, specifically by means of the TPU. Especially, in the robot controller, the laser process parameter tables are stored separately from the robot programs so that they can be reused between different robot programs. That is to say, the operator may activate a parameter table for a current robot program, which is a robot program that has been loaded from stored robot programs, by selecting a parameter table displayed in the TPU and then the activated parameter table may be loaded into the robot program, for example as an argument of the robot instruction in the robot program.

[0045] Additionally, in the TPU, experts and operators may also check or review a laser process parameter table, create a new laser process parameter table, delete a laser process parameter table, editing a laser process parameter table, saving an edited laser process parameter table, copying a laser process parameter table, or performing any other operations on the laser process parameters, etc.

[0046] Fig. 8 schematically illustrates of a diagram of synchronization between the robot movement and the laser process control according to an embodiment of the present disclosure. During running of the robot program 114, i.e., during laser processing, the laser process control should be synchronized with the robot movement. As illustrated, parameters of the laser process table 115 will be used in different phase of process according to the predetermined sequence. For example, in phases 0 and 1, piercing parameters will be used; at phases 2 and 3, cutting parameters will be used. By the way, the piercing parameters used in phases 0 and 1 may be different and the cutting parameters used in phases 2 and 3 may be different also.

[0047] Thus, as step S204 as illustrated in Fig. 2, at least one of the laser process parameters, which is related to laser process control, will be transmitted to a laser head and/or a laser source of the robotic laser cell during a laser processing, so as to control the laser head and the laser source.

[0048] Additionally, there is further provided an apparatus for managing laser process parameters in a robotic laser cell. Reference will be made to Fig. 9 to describe the apparatus as provided in the present disclosure in detail.

[0049] Fig. 9 schematically illustrates a block diagram of an apparatus for managing laser process parameters in a robotic laser cell according to an embodiment of the present disclosure. As illustrated in Fig. 9, the apparatus 900 may comprise a parameter display unit 910 and a parameter operation unit 920. The parameter display unit 910 may be configured to display, in a teach pendant unit TPU of the robotic laser cell, the laser process parameters, wherein the laser process parameters are stored in a laser process parameter table at a robot controller of the robotic laser cell. The parameter operation unit 920 may be configured to perform an operation on the laser process parameters in the TPU. Particularly, the laser process parameter table for storing the laser process parameters may be stored separately from a robot program, at the robot controller of the robotic laser cell.

[0050] As illustrated in Fig. 9, the apparatus may further comprise a parameter transmitting unit 930. The parameter transmitting unit 930 may be configured to transmit at least one of the laser process parameters, which is related to laser process control, to a laser head and/or a laser source of the robotic laser cell during a laser processing, so as to control the laser head and the laser source. Additionally, as illustrated in Fig.9, the apparatus may further comprise a parameter loading unit 940. The parameter loading unit 940 may be configured to load laser process parameters in an activated table into a robot program so as to control a laser processing.

[0051] In embodiments of the present disclosure, the operation may comprise at least one of checking; activating; creating; deleting; editing; saving and copying.

[0052] Besides, the parameter display unit 910 may be further configured to display the laser process parameters associated with a laser processing in a tab with tags, wherein the tags are configured to display laser process parameters for laser sub-processes individually. Additionally or alternatively, the parameter display unit 910 may also be further configured to display the laser process parameters in response to open of a laser parameter table referenced in a robot program. As another alternative, the parameter display unit 910 may also be configured to display the laser process parameters in a table list comprising at least one parameter table having cutting parameters associated therewith.

[0053] Furthermore, the present disclosure also presents a teach pendant unit TPU in a robotic laser cell, which may comprise an apparatus as described hereinbefore, for example with reference to Fig. 9. Actually, in the present invention, the parameter display unit 910 may be implemented by, for example, a display unit of the TPU or is an additional display, and the parameter operation unit 920 may be implemented by the control means of the TPU or any additional control means. [0054] Moreover, there is also provided, in the present disclosure, a robotic laser cell which comprises the robotic laser cell as proposed in the present disclosure.

[0055] It should be noted that the apparatus 900 may be configured to implement functionalities as described with reference to Fig. 1 to Fig. 8. Therefore, for details about the operations of modules in these apparatus, one may refer to those descriptions made with respect to the respective steps of the methods with reference to Fig. 1 to 8.

[0056] It is further noted that the components of the apparatus 900 may be embodied in hardware, software, firmware, and/or any combination thereof. For example, the components of apparatus 900 may be respectively implemented by a circuit, a processor or any other appropriate device with sufficient data processing power. Those skilled in the art will appreciate that the aforesaid examples are only for illustration instead of limitation.

[0057] In some embodiment of the present disclosure, the apparatus 900 may comprise at least one processor. The at least one processor suitable for use with embodiments of the present disclosure may include, by way of example, both general and special purpose processors already known or developed in the future. The apparatus 900 may further comprise at least one memory. The at least one memory may include, for example, semiconductor memory devices, e.g., RAM, ROM, EPROM, EEPROM, and flash memory devices. The at least one memory may be used to store program of computer executable instructions. The program can be written in any high-level and/or low-level compilable or interpretable programming languages. In accordance with embodiments, the computer executable instructions may be configured, with the at least one processor, to cause apparatus 900 to at least perform operations according to the method as discussed with reference to Figs. 1 to 8.

[0058] With embodiments of the present disclosure, it may combine all laser process parameters may be managed in the TPU without performing parameter management at several different locations. Thus, task such as setting laser process parameters, which would have been difficult but import, may become an easy job, due to reuse of verified parameters in a table that is created by laser expert or programmer. Thus, for an operator, it may save operation time and keep a high machining quality; for a factory, it may improve the programming efficiency, keep high quality, reduce demands of the expert operators and saving training for freshmen; and for system integrator, it can help build up a laser machining knowledge library and extend best practices.

[0059] Additionally, based on the above description, the skilled in the art would appreciate that the present disclosure may be embodied in an apparatus, a method, or a computer program product. In general, the various exemplary embodiments may be implemented in hardware or special purpose circuits, software, logic or any combination thereof. For example, some aspects may be implemented in hardware, while other aspects may be implemented in firmware or software which may be executed by a controller, microprocessor or other computing device, although the disclosure is not limited thereto. While various aspects of the exemplary embodiments of this disclosure may be illustrated and described as block diagrams, flowcharts, or using some other pictorial representation, it is well understood that these blocks, apparatus, systems, techniques or methods described herein may be implemented in, as non-limiting examples, hardware, software, firmware, special purpose circuits or logic, general purpose hardware or controller or other computing devices, or some combination thereof.

[0060] The various blocks shown in the companying drawings may be viewed as method steps, and/or as operations that result from operation of computer program code, and/or as a plurality of coupled logic circuit elements constructed to carry out the associated function(s). At least some aspects of the exemplary embodiments of the disclosures may be practiced in various components such as integrated circuit chips and modules, and that the exemplary embodiments of this disclosure may be realized in an apparatus that is embodied as an integrated circuit, FPGA or ASIC that is configurable to operate in accordance with the exemplary embodiments of the present disclosure.

[0061] While this specification contains many specific implementation details, these should not be construed as limitations on the scope of any disclosure or of what may be claimed, but rather as descriptions of features that may be specific to particular embodiments of particular disclosures. Certain features that are described in this specification in the context of separate embodiments can also be implemented in combination in a single embodiment. Conversely, various features that are described in the context of a single embodiment can also be implemented in multiple embodiments separately or in any suitable sub-combination. Moreover, although features may be described above as acting in certain combinations and even initially claimed as such, one or more features from a claimed combination can in some cases be excised from the combination, and the claimed combination may be directed to a sub-combination or variation of a sub-combination.

[0062] Similarly, while operations are depicted in the drawings in a particular order, this should not be understood as requiring that such operations be performed in the particular order shown or in sequential order, or that all illustrated operations be performed, to achieve desirable results. In certain circumstances, multitasking and parallel processing may be advantageous. Moreover, the separation of various system components in the embodiments described above should not be understood as requiring such separation in all embodiments, and it should be understood that the described program components and systems can generally be integrated together in a single software product or packaged into multiple software products.

[0063] Various modifications, adaptations to the foregoing exemplary embodiments of this disclosure may become apparent to those skilled in the relevant arts in view of the foregoing description, when read in conjunction with the accompanying drawings. Any and all modifications will still fall within the scope of the non-limiting and exemplary embodiments of this disclosure. Furthermore, other embodiments of the disclosures set forth herein will come to mind to one skilled in the art to which these embodiments of the disclosure pertain having the benefit of the teachings presented in the foregoing descriptions and the associated drawings.

[0064] Therefore, it is to be understood that the embodiments of the disclosure are not to be limited to the specific embodiments disclosed and that modifications and other embodiments are intended to be included within the scope of the appended claims. Although specific terms are used herein, they are used in a generic and descriptive sense only and not for purposes of limitation.

Claims

WHAT IS CLAIMED IS:

1. A method for managing laser process parameters in a robotic laser cell, comprising:

displaying, in a teach pendant unit TPU of the robotic laser cell, the laser process parameters, wherein the laser process parameters are stored in a laser process parameter table at a robot controller of the robotic laser cell; and

performing an operation on the laser process parameters in the TPU.

2. The method according to Claim 1, wherein the laser process parameter table is stored separately from a robot program, at the robot controller of the robotic laser cell.

3. The method according to Claim 1 or 2, further comprising:

transmitting at least one of the laser process parameters, which is related to laser process control to a laser head and/or a laser source of the robotic laser cell during a laser processing, so as to control the laser head and the laser source.

4. The method according to any one Claim 1 to 3, further comprising:

loading the laser process parameters in an activated table into a robot program so as to control a laser processing.

5. The method according to any one of Claims 1 to 4, wherein the operation comprises at least one of: checking; activating; creating; deleting; editing; saving and copying.

6. The method according to any one of Claims 1 to 5, wherein the laser process parameters associated with a laser processing are displayed in a tab with tags, and wherein the tags are configured to display laser process parameters for laser sub-processes individually.

7. The method according to any one of Claims 1 to 6, wherein the laser process parameters are displayed in response to opening a laser parameter table referenced in a robot program.

8. The method according to any one of Claims 1 to 7, wherein the laser process parameters are displayed in a table list comprising at least one parameter table having cutting parameters associated therewith.

9. An apparatus for managing laser process parameters in a robotic laser cell, comprising:

a parameter display unit configured to display, in a teach pendant unit TPU of the robotic laser cell, the laser process parameters, wherein the laser process parameters are stored in a laser process parameter table at a robot controller of the robotic laser cell; and

a parameter operation unit configured to perform an operation on the laser process parameters in the TPU.

10. The apparatus according to Claim 9, wherein the laser process parameter table is stored separately from a robot program, at the robot controller of the robotic laser cell.

11. The apparatus according to Claim 9 or 10, further comprising:

a parameter transmitting unit configured to transmit at least one of the laser process parameters, which is related to laser process control, to a laser head and/or a laser source of the robotic laser cell during a laser processing, so as to control the laser head and the laser source.

12. The apparatus according to any one of Claim 9 to 11, further comprising:

a parameter loading unit configured to load laser process parameters in an activated table into a robot program so as to control a laser processing.

13. The apparatus according to any one of Claims 9 to 12, wherein the operation comprises at least one of checking; activating; creating; deleting; editing; saving and copying.

14. The apparatus according to any one of Claims 9 to 13, wherein the parameter display unit is further configured to display the laser process parameters associated with a laser processing in a tab with tags, and wherein the tags are configured to display laser process parameters for laser sub-processes individually.

15. The apparatus according to any one of Claims 9 to 14, wherein the parameter display unit is further configured to display the laser process parameters in response to opening a laser parameter table referenced in a robot program.

16. The apparatus according to any one of Claims 9 to 15, wherein the parameter display unit is further configured to display the laser process parameters in a table list comprising at least one parameter table having cutting parameters associated therewith.

17. A teach pendant unit in a robotic laser cell, comprising an apparatus according to any one of Claims 9 to 16.

18. A robotic laser cell, comprising a teach pendant unit according to Claim 17.