WO2012169873A3 - Method of thermocompression bonding of laser-etched copper pads to cob module - Google Patents

Method of thermocompression bonding of laser-etched copper pads to cob module Download PDF

Info

Publication number
WO2012169873A3
WO2012169873A3 PCT/MY2012/000116 MY2012000116W WO2012169873A3 WO 2012169873 A3 WO2012169873 A3 WO 2012169873A3 MY 2012000116 W MY2012000116 W MY 2012000116W WO 2012169873 A3 WO2012169873 A3 WO 2012169873A3
Authority
WO
WIPO (PCT)
Prior art keywords
thermocompression bonding
laser
copper pads
etched copper
cob module
Prior art date
Application number
PCT/MY2012/000116
Other languages
French (fr)
Other versions
WO2012169873A2 (en
Inventor
Pooi Nguon LIM
Noordazlee Bin MOHD DAUD
Original Assignee
Iris Corporation Berhad
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Iris Corporation Berhad filed Critical Iris Corporation Berhad
Publication of WO2012169873A2 publication Critical patent/WO2012169873A2/en
Publication of WO2012169873A3 publication Critical patent/WO2012169873A3/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
    • B23K20/023—Thermo-compression bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/22—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded
    • B23K20/233—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded without ferrous layer

Abstract

The present invention provides an RFID board comprising antenna and chip-on board module, wherein the antenna having two terminals in a form of pads, is bonded to lead frame of the chip-on-board module via theiTnocompression bonding, without the use of any intermediate electrically conductive materials. A method to fabricate the RFID board via thermocompression bonding is also provided herewith.
PCT/MY2012/000116 2011-06-10 2012-06-08 Method of thermocompression bonding of laser-etched copper pads to cob module WO2012169873A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
MYPI2011002669 2011-06-10
MYPI2011002669A MY164922A (en) 2011-06-10 2011-06-10 Method of thermocompression bonding of laser-etched copper pads to cob module

Publications (2)

Publication Number Publication Date
WO2012169873A2 WO2012169873A2 (en) 2012-12-13
WO2012169873A3 true WO2012169873A3 (en) 2013-04-04

Family

ID=47296656

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/MY2012/000116 WO2012169873A2 (en) 2011-06-10 2012-06-08 Method of thermocompression bonding of laser-etched copper pads to cob module

Country Status (3)

Country Link
MY (1) MY164922A (en)
TW (1) TW201316865A (en)
WO (1) WO2012169873A2 (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1544787A1 (en) * 2003-12-19 2005-06-22 Axalto SA Contactless card including an antenna switch
US20080283615A1 (en) * 2007-05-17 2008-11-20 Advanced Microelectronic And Automation Technology Ltd. Dual interface inlays
US20090166431A1 (en) * 2005-04-18 2009-07-02 Hallys Corporation Electronic component and manufacturing method thereof
US20100038432A1 (en) * 2008-08-14 2010-02-18 Infineon Technologies Ag Transponder Inlay for a Document for Personal Identification and a Method for Producing a Transponder Inlay
US20110011939A1 (en) * 2007-12-19 2011-01-20 Linda Seah Contact-less and dual interface inlays and methods for producing the same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1544787A1 (en) * 2003-12-19 2005-06-22 Axalto SA Contactless card including an antenna switch
US20090166431A1 (en) * 2005-04-18 2009-07-02 Hallys Corporation Electronic component and manufacturing method thereof
US20080283615A1 (en) * 2007-05-17 2008-11-20 Advanced Microelectronic And Automation Technology Ltd. Dual interface inlays
US20110011939A1 (en) * 2007-12-19 2011-01-20 Linda Seah Contact-less and dual interface inlays and methods for producing the same
US20100038432A1 (en) * 2008-08-14 2010-02-18 Infineon Technologies Ag Transponder Inlay for a Document for Personal Identification and a Method for Producing a Transponder Inlay

Also Published As

Publication number Publication date
WO2012169873A2 (en) 2012-12-13
MY164922A (en) 2018-02-15
TW201316865A (en) 2013-04-16

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