WO2012082168A1 - Pin attachment - Google Patents
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- Publication number
- WO2012082168A1 WO2012082168A1 PCT/US2011/024143 US2011024143W WO2012082168A1 WO 2012082168 A1 WO2012082168 A1 WO 2012082168A1 US 2011024143 W US2011024143 W US 2011024143W WO 2012082168 A1 WO2012082168 A1 WO 2012082168A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- microelectronic
- metal
- elements
- substrate
- conductive
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
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- H01L21/486—Via connections through the substrate with or without pins
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Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013544457A JP5687770B2 (en) | 2010-12-13 | 2011-02-09 | Pin attachment |
CN201180067393.2A CN103354949B (en) | 2010-12-13 | 2011-02-09 | Pin connecting device |
KR1020137018378A KR101519458B1 (en) | 2010-12-13 | 2011-02-09 | Pin attachment |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/966,225 US20120146206A1 (en) | 2010-12-13 | 2010-12-13 | Pin attachment |
US12/966,225 | 2010-12-13 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2012082168A1 true WO2012082168A1 (en) | 2012-06-21 |
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US20160225748A1 (en) * | 2015-01-29 | 2016-08-04 | Qualcomm Incorporated | Package-on-package (pop) structure |
CN106534728A (en) * | 2016-09-30 | 2017-03-22 | 天津大学 | CMOS image sensor architecture applied to spiral CT machine |
US10522505B2 (en) * | 2017-04-06 | 2019-12-31 | Advanced Semiconductor Engineering, Inc. | Semiconductor device package and method for manufacturing the same |
IT201700055983A1 (en) | 2017-05-23 | 2018-11-23 | St Microelectronics Srl | PROCEDURE FOR PRODUCING SEMICONDUCTOR, SEMICONDUCTOR AND CORRESPONDENT CIRCUIT DEVICES |
US10573573B2 (en) * | 2018-03-20 | 2020-02-25 | Taiwan Semiconductor Manufacturing Co., Ltd. | Package and package-on-package structure having elliptical conductive columns |
DE102018109920A1 (en) * | 2018-04-25 | 2019-10-31 | Dr. Ing. H.C. F. Porsche Aktiengesellschaft | Cooling of power electronic circuits |
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KR101519458B1 (en) | 2015-05-12 |
CN103354949B (en) | 2016-08-10 |
US20150011052A1 (en) | 2015-01-08 |
US20120146206A1 (en) | 2012-06-14 |
JP5687770B2 (en) | 2015-03-18 |
US9324681B2 (en) | 2016-04-26 |
JP2013546196A (en) | 2013-12-26 |
KR20130127995A (en) | 2013-11-25 |
CN103354949A (en) | 2013-10-16 |
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