WO2011020393A1 - Solar battery's core veneers laminating encapsulation method - Google Patents
Solar battery's core veneers laminating encapsulation method Download PDFInfo
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- WO2011020393A1 WO2011020393A1 PCT/CN2010/075113 CN2010075113W WO2011020393A1 WO 2011020393 A1 WO2011020393 A1 WO 2011020393A1 CN 2010075113 W CN2010075113 W CN 2010075113W WO 2011020393 A1 WO2011020393 A1 WO 2011020393A1
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- mold
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- laminating
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- cell core
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- 238000000034 method Methods 0.000 title claims abstract description 24
- 238000010030 laminating Methods 0.000 title claims abstract description 15
- 238000005538 encapsulation Methods 0.000 title abstract description 7
- 239000000463 material Substances 0.000 claims abstract description 16
- 238000004519 manufacturing process Methods 0.000 claims abstract description 9
- 229920002799 BoPET Polymers 0.000 claims abstract description 6
- 229920005989 resin Polymers 0.000 claims abstract description 5
- 239000011347 resin Substances 0.000 claims abstract description 5
- 238000004806 packaging method and process Methods 0.000 claims description 10
- 238000003475 lamination Methods 0.000 claims description 8
- 239000004809 Teflon Substances 0.000 claims description 5
- 229920006362 Teflon® Polymers 0.000 claims description 5
- 238000005260 corrosion Methods 0.000 claims description 4
- 230000007797 corrosion Effects 0.000 claims description 4
- 238000005299 abrasion Methods 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 abstract description 4
- 230000001788 irregular Effects 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 12
- 238000012858 packaging process Methods 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 238000013467 fragmentation Methods 0.000 description 2
- 238000006062 fragmentation reaction Methods 0.000 description 2
- 238000010248 power generation Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 230000000181 anti-adherent effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/306—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising vinyl acetate or vinyl alcohol (co)polymers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/10—Batteries
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/12—Photovoltaic modules
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Definitions
- the invention belongs to the field of new energy photovoltaic power generation, and particularly relates to a method for laminating and packaging small solar battery core plates.
- the technical solution adopted by the present invention is: a method for laminating and packaging a solar cell core board, and the method comprises the following steps:
- the solar cell core plates are placed one by one into the unit recess of the mold;
- the groove of the mold used in the invention is manufactured according to the geometry and size of the actual solar cell core board, which makes the solar cell core board avoid the irregular arrangement, mechanization and automation in the processing flow.
- the problem of cutting and the surface of the mold is sprayed and sintered with a layer of temperature-resistant, wear-resistant, corrosion-resistant and anti-adhesive industrial Teflon material protection layer, which can effectively prevent the laminated solar panel from sticking with the typesetting mold, ensuring its easyness.
- the mold is demolded without damaging the packaged solar cells, thereby avoiding the displacement of the wafer unit on the core board and causing serious problems such as chipping, dislocation, open circuit and short circuit.
- the method of the invention is simple, easy to implement, and effectively improves production efficiency.
- Figure 1 is a schematic exploded view of the state of the present invention.
- Figure 2 is a schematic cross-sectional view showing the state of use of the present invention.
- 1 is a mold
- 2 is a solar cell core board
- 3 is a positioning pin
- 4 is an EVA resin
- 5 is a PET film
- 6 is a solar wafer.
- the solar cell core sheets 2 are placed one by one into the unit recess of the mold 1;
- the demolding material adopts an industrial Teflon material which is resistant to temperature, abrasion, corrosion and adhesion.
- the groove in the typesetting die 1 described in the first step 1) is matched with the geometry and size of the actual solar cell chip 2.
- the groove array on the typesetting die 1 in the step 1) is provided with a finished product pin hole 3 formed by laminating and packaging.
- a mold 1 is first manufactured, and a unit groove corresponding to the geometry and size of the solar cell core plate 2 is regularly distributed on the mold 1, the mold 1 It is made of aluminum alloy sheet with good thermal conductivity, and the surface is sprayed and sintered with a protective layer of industrial Teflon material which is resistant to temperature, abrasion, corrosion and anti-adhesion.
- the single solar core plates 2 are first placed into the unit grooves of the typesetting die 1 one by one, so that each of the single solar core plates 2 can be reliably positioned, and then the typesetting die 1 of the solar core board 2 is arranged.
- One to two layers of EVA encapsulating sheet 4 are overlaid thereon, and a layer of PET film material 5 is placed thereon, and then placed in a laminating machine for conventional lamination encapsulation processing.
- the solar cell core sheet 2 is always reliably positioned and shaped in the typesetting mold 1 throughout the lamination process and during the cooling and solidification process after the laminating machine.
- the unit groove also restricts the free flow of the EVA in the molten state, effectively preventing the offset of the solar wafer 6 attached to the solar core board 2, and avoiding serious defects such as fragmentation, dislocation, open circuit and short circuit. problem.
- the thickness and flatness of the solar panel EVA encapsulation layer are controlled by controlling the depth of the cell recess on the typesetting die 1.
- the positioning pin 3 is provided for forming a positioning hole required for cutting and slitting after lamination.
- the layer of industrial Teflon sprayed on the surface of the typesetting mold 1 can effectively prevent the laminated solar panel from sticking to the typesetting mold 1 to ensure that it can be easily released without damaging the packaged solar cell.
Abstract
A method of a solar battery's core veneers laminating encapsulation solves the problem of uncertain laminating thickness, inconsistent thickness at the middle and edge portions and nonuniform of the whole thickness because of irregular arrangement caused by nonexistence of the layout mold, which leads to impractical mechanized automated cutting and unlimited free flow for the EVA at melted state, when mass production by using laminating encapsulation is performed in prior art. The method includes the following steps: manufacturing a layout mold having an array of grooves in a unit of the geometrical size for the encapsulated core veneers of the solar battery, wherein the array of grooves are matched with the unit of the geometrical size; a layer of release material is sprayed and sintered on the whole surface of the layout mold; disposing the core veneers of the solar battery one by one into the unit grooves of the mold; disposing one or two layers of EVA resin for encapsulating the core veneers of the solar battery on the plate with the core veneers of the solar battery arranged thereon, then disposing a layer of PET film materials; and performing laminating encapsulation in a laminating machine, and the structure being picked out to be cooled and de-molded. The method of the invention is simple, easy to be implemented and the production efficiency is effectively enhanced.
Description
太阳能电池芯板层压封装的方法 Solar cell core board laminate package method
技术领域 Technical field
本发明属于新能源光伏发电领域， 具体涉及一种小型太阳能电池芯板 层压封装的方法。 The invention belongs to the field of new energy photovoltaic power generation, and particularly relates to a method for laminating and packaging small solar battery core plates.
背景技术 Background technique
由于全球能源危机与环境问题的日益严峻， 人们对新能源以及无污染 可再生能源的需求越来越迫切， 太阳能光伏发电时新能源和可再生能源中 很有发展前途的一个技术领域。 Due to the global energy crisis and the increasingly serious environmental problems, the demand for new energy and non-polluting renewable energy is becoming more and more urgent. There is a promising technology field in new energy and renewable energy for solar photovoltaic power generation.
目前， 单晶硅和多晶硅的小型太阳能电池板的封装方法常见的有两种， 一是采用环氧树脂滴胶包覆封装， 二是用 EVA等材料进行层压封装。 采用 层压封装大批量生产时， 如果没用专用排版模板， 会有以下问题： At present, there are two common methods for packaging small silicon panels of monocrystalline silicon and polycrystalline silicon. One is to use epoxy resin to cover the package, and the other is to laminate with EVA and other materials. When mass-produced in a laminate package, if you do not use a dedicated layout template, you will have the following problems:
1 )、 因为排列不规则， 也无法设置裁切时所需的定位， 所以无法实现 机械化、 自动化分切； 2)、 因为 EVA在熔融状态下无限制地自由流动， 所 以会造成层压厚度不确定， 中间和边缘厚度不一致， 整体厚度不均匀。 同 时在封装过程中， 贴在芯板上的硅片单元会产生移位而造成断片、 脱悍、 断路和短路等严重问题。 1), because the arrangement is irregular, it is impossible to set the positioning required for cutting, so mechanization and automatic slitting cannot be realized; 2) Because EVA is freely flowing without restriction in the molten state, the laminate thickness is not caused. Make sure that the middle and edge thicknesses are inconsistent and the overall thickness is not uniform. At the same time, during the packaging process, the silicon wafer unit attached to the core board may be displaced to cause serious problems such as chipping, dislocation, open circuit and short circuit.
发明内容 Summary of the invention
本发明为了解决现有技术中的采用层压封装大批量生产时， 如果在工 艺加工过程中没用专用排版模板， 导致排列不规格， 无法实现机械化、 自 动化分切的问题， 以及因为在层压封装过程中， 因为 EVA在熔融状态下无 限制地自由流动， 造成层压厚度不确定， 中间和边缘厚度不一致， 整体厚
度不均匀的问题和在封装过程中芯板上的硅片单元会产生移位而造成断 片、 脱悍、 断路和短路等严重问题。 本发明采用的技术方案是： 太阳能电 池芯板层压封装的方法， 本方法中包括以下歩骤： In order to solve the problem of mass production in the prior art by using the laminate package, if the special typesetting template is not used in the process, the arrangement is not standardized, the mechanization and the automatic slitting cannot be realized, and the lamination is performed. During the encapsulation process, because EVA is free to flow freely in the molten state, the thickness of the laminate is uncertain, the thickness of the middle and the edges are inconsistent, and the thickness is overall. The problem of unevenness and the displacement of the silicon wafer unit on the core during the packaging process cause serious problems such as chipping, dislocation, open circuit and short circuit. The technical solution adopted by the present invention is: a method for laminating and packaging a solar cell core board, and the method comprises the following steps:
1 )、 以所封装的太阳能电池芯板几何尺寸为单元， 制造具有与该单元 几何尺寸匹配的凹槽阵列的排版模具； 1) manufacturing a typesetting mold having an array of grooves matching the geometrical dimensions of the unit in units of the encapsulated solar cell core geometry;
2)、 在排版模具的整个表面喷涂烧结有一层脱模材料 ·， 2), spraying a layer of release material on the entire surface of the typesetting mold.
3 )、 将太阳能电池芯板逐个放入模具的单元凹槽中； 3), the solar cell core plates are placed one by one into the unit recess of the mold;
4 )、 在排布好太阳能电池芯板的模板上放置一至两层用于封装电池芯 板的 EVA树脂， 然后再加设一层 PET胶片材料； 4), placing one or two layers of EVA resin for encapsulating the battery core plate on the template on which the solar cell core sheets are arranged, and then adding a layer of PET film material;
5 )、 放入层压机进行层压封装， 取出后进行冷却、 脱模。 5), placed in a laminator for lamination and packaging, taken out, cooled and demolded.
本发明所用到的模具的凹槽是根据实际的太阳能电池芯板的几何形状 和尺寸来制造的， 这就使太阳能电池芯板在加工工艺流程中， 避免了排列 不规则， 无法实现机械化、 自动化分切的问题。 并且在模具的表面喷涂烧 结有一层耐温、 耐磨、 耐腐蚀、 抗粘的工业特氟龙材料保护层， 能有效地 防止被层压封装的太阳能电池板与排版模具发生粘连， 保证其轻易脱模而 不损伤已封装好的太阳能电池， 从而避免了芯板上的硅片单元产生移位而 造成断片、 脱悍、 断路和短路等严重问题。 The groove of the mold used in the invention is manufactured according to the geometry and size of the actual solar cell core board, which makes the solar cell core board avoid the irregular arrangement, mechanization and automation in the processing flow. The problem of cutting. And the surface of the mold is sprayed and sintered with a layer of temperature-resistant, wear-resistant, corrosion-resistant and anti-adhesive industrial Teflon material protection layer, which can effectively prevent the laminated solar panel from sticking with the typesetting mold, ensuring its easyness. The mold is demolded without damaging the packaged solar cells, thereby avoiding the displacement of the wafer unit on the core board and causing serious problems such as chipping, dislocation, open circuit and short circuit.
本发明方法简单， 容易实施， 有效地提高了生产效率。 The method of the invention is simple, easy to implement, and effectively improves production efficiency.
附图说明 DRAWINGS
图 1为本发明的状态分解示意图。 Figure 1 is a schematic exploded view of the state of the present invention.
图 2为本发明的使用状态剖面示意图。 Figure 2 is a schematic cross-sectional view showing the state of use of the present invention.
图中， 1为模具， 2为太阳能电池芯板， 3为定位销， 4为 EVA树脂， 5为 PET胶片， 6为太阳能硅片。
具体实施方式 In the figure, 1 is a mold, 2 is a solar cell core board, 3 is a positioning pin, 4 is an EVA resin, 5 is a PET film, and 6 is a solar wafer. detailed description
本发明为了解决现有技术中的采用层压封装大批量生产时， 如果没用 专用排版模， 导致排列不规格， 无法实现机械化、 自动化分切的问题； 以 及因为在层压封装过程中， 因为 EVA在熔融状态下无限制地自由流动， 造 成层压厚度不确定， 中间和边缘厚度不一致， 整体厚度不均匀的问题和在 封装过程中芯板上的硅片单元会产生移位而造成断片、 脱悍、 断路和短路 等严重问题， 提出了一种太阳能电池芯板层压封装的方法及模具， 采用的 技术方案是： 太阳能电池芯板层压封装的方法， 本方法中包括以下歩骤： In order to solve the problem of mass production in the prior art by using a laminate package, if the special layout mode is not used, the arrangement is not standardized, and the problem of mechanization and automatic slitting cannot be realized; and because during the lamination and packaging process, EVA is free to flow freely in the molten state, resulting in an indeterminate thickness of the laminate, inconsistent thickness of the middle and edges, uneven thickness of the whole body, and displacement of the wafer unit on the core during the packaging process, resulting in fragmentation, A serious problem such as dislocation, open circuit and short circuit is proposed. A method and a mold for laminating and packaging a solar cell core board are proposed. The technical solution adopted is: a method for laminating and packaging a solar cell core board, the method comprising the following steps:
1 )、 以所封装的太阳能电池芯板 2几何尺寸为单元， 制造具有与该 单元几何尺寸匹配的凹槽阵列的排版模具 1 ; 1) manufacturing a typesetting die 1 having a groove array matching the geometrical dimensions of the unit in a unit of the packaged solar cell core 2;
2)、 在排版模具 1的整个表面喷涂烧结有一层脱模材料 ·， 2), spraying a layer of release material on the entire surface of the typesetting die 1
3 )、 将太阳能电池芯板 2逐个放入模具 1的单元凹槽中； 3), the solar cell core sheets 2 are placed one by one into the unit recess of the mold 1;
4)、 在排布好太阳能电池芯板 2的模板上放置一至两层用于封装电池 芯板 2的 EVA树脂， 然后再加设一层 PET胶片 5材料； 4), placing one or two layers of EVA resin for encapsulating the battery core board 2 on the template in which the solar cell core board 2 is arranged, and then adding a layer of PET film 5 material;
5 )、 放入层压机进行层压封装， 取出后进行冷却、 脱模。 5), placed in a laminator for lamination and packaging, taken out, cooled and demolded.
本发明的技术方案中， 所述的脱模材料采用耐温、 耐磨、 耐腐蚀、 抗 粘的工业特氟龙材料。 In the technical solution of the present invention, the demolding material adopts an industrial Teflon material which is resistant to temperature, abrasion, corrosion and adhesion.
本发明的技术方案中，歩骤 1 )所述的排版模具 1中的凹槽与实际的太 阳能电池芯片 2的几何形状和尺寸来相配套。 In the technical solution of the present invention, the groove in the typesetting die 1 described in the first step 1) is matched with the geometry and size of the actual solar cell chip 2.
本发明的技术方案中， 歩骤 1 ) 中的排版模具 1上的凹槽阵列中设 置有层压封装后形成的成品分切地定位销孔 3。 In the technical solution of the present invention, the groove array on the typesetting die 1 in the step 1) is provided with a finished product pin hole 3 formed by laminating and packaging.
参看附图 1， 本发明在实施的过程中， 首先制造模具 1， 模具 1上规则 地分布有与太阳能电池芯板 2几何形状和尺寸相应的单元凹槽， 该模具 1
是用导热性良好的铝合金板材加工而成， 且表面喷涂烧结有一层耐温、 耐 磨、 耐腐蚀、 抗粘的工业特氟龙材料的保护层。 在具体封装时， 首先将单 体太阳能芯板 2逐个放入排版模具 1 的单元凹槽中， 使每个单体太阳能芯 板 2得以可靠定位， 再在排好太阳能芯板 2的排版模具 1上覆盖一至两层 EVA封装片材 4， 在其上再加一层 PET胶片材料 5， 然后一起放入层压机 中进行常规的层压封装加工。 在整个层压过程中以及出层压机后的冷却固 化过程中， 太阳能电池芯板 2在排版模具 1 中始终都得到了可靠地定位和 定型。 同时单元凹槽也限制了 EVA在熔融状态的平面自由流动， 有效地防 止了贴悍在太阳能芯板 2上的太阳能硅片 6的偏移错位， 避免了断片、 脱 悍、 断路和短路等严重问题。 通过控制排版模具 1 上单元凹槽的深度来控 制太阳能电池板 EVA封装层的厚度和平整度。 定位销 3是为层压后形成裁 断分切时需要的定位孔而设置的。 排版模具 1 表面所喷涂的一层工业特氟 龙能有效地防止被层压封装的太阳能电池板与排版模具 1 发生粘连， 保证 其轻易脱模而不损伤已封装好的太阳能电池。
Referring to Figure 1, in the process of the present invention, a mold 1 is first manufactured, and a unit groove corresponding to the geometry and size of the solar cell core plate 2 is regularly distributed on the mold 1, the mold 1 It is made of aluminum alloy sheet with good thermal conductivity, and the surface is sprayed and sintered with a protective layer of industrial Teflon material which is resistant to temperature, abrasion, corrosion and anti-adhesion. In the specific packaging, the single solar core plates 2 are first placed into the unit grooves of the typesetting die 1 one by one, so that each of the single solar core plates 2 can be reliably positioned, and then the typesetting die 1 of the solar core board 2 is arranged. One to two layers of EVA encapsulating sheet 4 are overlaid thereon, and a layer of PET film material 5 is placed thereon, and then placed in a laminating machine for conventional lamination encapsulation processing. The solar cell core sheet 2 is always reliably positioned and shaped in the typesetting mold 1 throughout the lamination process and during the cooling and solidification process after the laminating machine. At the same time, the unit groove also restricts the free flow of the EVA in the molten state, effectively preventing the offset of the solar wafer 6 attached to the solar core board 2, and avoiding serious defects such as fragmentation, dislocation, open circuit and short circuit. problem. The thickness and flatness of the solar panel EVA encapsulation layer are controlled by controlling the depth of the cell recess on the typesetting die 1. The positioning pin 3 is provided for forming a positioning hole required for cutting and slitting after lamination. The layer of industrial Teflon sprayed on the surface of the typesetting mold 1 can effectively prevent the laminated solar panel from sticking to the typesetting mold 1 to ensure that it can be easily released without damaging the packaged solar cell.
Claims
1、 太阳能电池芯板层压封装的方法， 其特征在于： 本方法中包括以 下歩骤： A method for laminating a solar cell core board, characterized in that: the method comprises the following steps:
1)、 以所封装的太阳能电池芯板 （2) 几何尺寸为单元， 制造具有与 该单元几何尺寸匹配的凹槽阵列的排版模具 （1); 1), in the package of the solar cell core board (2) geometry unit, manufacturing a typesetting mold (1) having a groove array matching the unit geometry;
2)、 在排版模具 （1) 的整个表面喷涂烧结有一层脱模材料 ·， 2), spraying a layer of release material on the entire surface of the typesetting mold (1) ·,
3)、 将太阳能电池芯板 （2) 逐个放入模具 （1) 的单元凹槽中； 3) Place the solar cell core plates (2) one by one into the unit recesses of the mold (1);
4)、 在排布好太阳能电池芯板 （2) 的模板上放置一至两层用于封装 电池芯板 （2) 的 EVA树脂， 然后再加设一层 PET胶片 （5) 材料； 4) Place one or two layers of EVA resin for encapsulating the battery core board (2) on the template of the solar cell core board (2), and then add a layer of PET film (5) material;
5)、 放入层压机进行层压封装， 取出后进行冷却、 脱模。 5), placed in a laminator for lamination and packaging, taken out, cooled and demolded.
2、 根据权利要求 1所述的太阳能电池芯板层压封装的方法， 其特征在 于： 所述的脱模材料采用耐温、 耐磨、 耐腐蚀、 抗粘的工业特氟龙材料。 2. The method of solar cell core panel laminate package according to claim 1, wherein: the mold release material is made of industrial Teflon material which is resistant to temperature, abrasion, corrosion and adhesion.
3、 根据权利要求 1 所述的太阳能电池芯板层压封装的方法，， 其特征 在于： 歩骤 1)所述的排版模具（1)中的凹槽与实际的太阳能电池芯片（2) 的几何形状和尺寸来相配套。 3. The method of solar cell core panel laminate package according to claim 1, characterized in that: the groove in the typesetting die (1) of the step 1) and the actual solar cell chip (2) The geometry and size are matched.
4、 根据权利要求 1所述的太阳能电池芯板层压封装的方法， 其特征在 于： 歩骤 1) 中的排版模具 （1) 上的凹槽阵列中设置有层压封装后形成成 品分切时所需的定位销孔 （3)。
The method for laminating a solar cell core panel according to claim 1, wherein: the groove array on the typesetting mold (1) in step 1) is provided with a laminate package to form a finished product slitting Locating pin holes (3) required.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910109349.8 | 2009-08-18 | ||
| CN2009101093498A CN101710599B (en) | 2009-08-18 | 2009-08-18 | Method for laminating and packaging solar battery core board |
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| WO2011020393A1 true WO2011020393A1 (en) | 2011-02-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| PCT/CN2010/075113 WO2011020393A1 (en) | 2009-08-18 | 2010-07-13 | Solar battery's core veneers laminating encapsulation method |
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| CN (1) | CN101710599B (en) |
| WO (1) | WO2011020393A1 (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101710599B (en) * | 2009-08-18 | 2011-10-19 | 深圳珈伟光伏照明股份有限公司 | Method for laminating and packaging solar battery core board |
| CN102337649B (en) * | 2010-07-22 | 2014-03-26 | 上海新安汽车隔音毡有限公司 | Positioning plate of parts |
| CN102903643B (en) * | 2012-07-07 | 2016-08-10 | 上海鼎虹电子有限公司 | Electronic package device |
| CN105772120A (en) * | 2016-03-07 | 2016-07-20 | 北京同方生物芯片技术有限公司 | Batched bonding packaging method for polymeric biochips and positioning device |
| CN106684211B (en) * | 2016-12-28 | 2018-11-02 | 中国电子科技集团公司第十八研究所 | Die for bonding solar cell module |
| CN108922944B (en) * | 2018-07-10 | 2019-11-12 | 成都先锋材料有限公司 | Method for manufacturing solar battery |
| CN108878592B (en) * | 2018-07-10 | 2022-03-04 | 成都先锋材料有限公司 | Solar cell manufacturing method |
| CN108899381B (en) * | 2018-07-10 | 2022-03-04 | 成都先锋材料有限公司 | Solar cell manufacturing method |
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| CN201413828Y (en) * | 2009-05-25 | 2010-02-24 | 深圳市珈伟实业有限公司 | Solar cell core plate laminating packaging typesetting die |
| CN101710599A (en) * | 2009-08-18 | 2010-05-19 | 深圳市珈伟实业有限公司 | Method for laminating and packaging solar battery core board |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| GB1554507A (en) * | 1977-04-28 | 1979-10-24 | Tideland Signal Corp | Enclosure for solar cells |
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| JPS5913380A (en) * | 1982-07-15 | 1984-01-24 | Nippon Sheet Glass Co Ltd | Solar battery panel |
| US5008062A (en) * | 1988-01-20 | 1991-04-16 | Siemens Solar Industries, L.P. | Method of fabricating photovoltaic module |
| CN101345267A (en) * | 2008-08-29 | 2009-01-14 | 李毅 | Solar optoelectronic template and its packaging method |
| CN101404298A (en) * | 2008-09-09 | 2009-04-08 | 上海拓引数码技术有限公司 | Photovoltaic component, its production technique and application |
| CN201413828Y (en) * | 2009-05-25 | 2010-02-24 | 深圳市珈伟实业有限公司 | Solar cell core plate laminating packaging typesetting die |
| CN101710599A (en) * | 2009-08-18 | 2010-05-19 | 深圳市珈伟实业有限公司 | Method for laminating and packaging solar battery core board |
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| Publication number | Publication date |
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| CN101710599B (en) | 2011-10-19 |
| CN101710599A (en) | 2010-05-19 |
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