WO2010101044A1 - Cover member for microchip, method for producing cover member for microchip, microchip, and method for manufacturing microchip - Google Patents

Cover member for microchip, method for producing cover member for microchip, microchip, and method for manufacturing microchip Download PDF

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Publication number
WO2010101044A1
WO2010101044A1 PCT/JP2010/052724 JP2010052724W WO2010101044A1 WO 2010101044 A1 WO2010101044 A1 WO 2010101044A1 JP 2010052724 W JP2010052724 W JP 2010052724W WO 2010101044 A1 WO2010101044 A1 WO 2010101044A1
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WO
WIPO (PCT)
Prior art keywords
cover member
microchip
adhesive layer
substrate
protective film
Prior art date
Application number
PCT/JP2010/052724
Other languages
French (fr)
Japanese (ja)
Inventor
毅彦 五島
Original Assignee
コニカミノルタオプト株式会社
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Publication date
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Publication of WO2010101044A1 publication Critical patent/WO2010101044A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
    • B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
    • B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
    • B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2200/00—Solutions for specific problems relating to chemical or physical laboratory apparatus
    • B01L2200/14—Process control and prevention of errors
    • B01L2200/141—Preventing contamination, tampering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00—Additional constructional details
    • B01L2300/04—Closures and closing means
    • B01L2300/041—Connecting closures to device or container
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00—Additional constructional details
    • B01L2300/04—Closures and closing means
    • B01L2300/041—Connecting closures to device or container
    • B01L2300/044—Connecting closures to device or container pierceable, e.g. films, membranes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00—Additional constructional details
    • B01L2300/12—Specific details about materials

Definitions

  • the present invention relates to a microchip cover member used for manufacturing a microchip having a microchannel created by a microfabrication technique, a method for manufacturing the microchip cover member, a microchip using the cover member, and The present invention relates to a method for manufacturing the microchip.
  • micro analysis chip By forming fine flow path grooves on a silicon or glass substrate using microfabrication technology and joining a flat sealing member to the substrate, a flow path and a circuit are formed.
  • micro-analysis systems Micro-analysis systems
  • a resin film may be used as the sealing member described above.
  • This film as the sealing member is called a cover member or a cover film.
  • Patent Document 1 a technique of bonding with an adhesive (for example, see Patent Document 1) and a technique of bonding by hot pressing (for example, see Patent Document 2) have been proposed.
  • Patent Document 1 the method of bonding the cover film and the substrate using an adhesive as described in Patent Document 1 is not preferable because there is a risk that an adhesive enters the fine channel and blocks the channel.
  • an adhesive when used for joining, the dimension of the flow path space may not be stable due to unevenness in the thickness applied by the adhesive. Therefore, in the case where a high quality such as a microchip is required, it is necessary to perform thermal bonding without using an adhesive.
  • the cover film When the cover film is peeled off from the protective film, the components of the adhesive layer shift to a portion in the vicinity of the cover film that forms the flow path. Therefore, it is impossible to obtain a stable bonding force that does not hinder the product function in the vicinity. Therefore, conventionally, when such a protective film is provided, the surface that is not bonded to the protective film is used as the bonding surface side with the substrate, so it is difficult to reduce the adhesion of foreign substances and the occurrence of scratches. there were.
  • the present invention has been made in view of such circumstances, and a cover for a microchip provided with an adhesive layer for adhering to a protective member in a region away from the vicinity of the flow path of the cover film (cover member).
  • the purpose is to provide a film.
  • the first embodiment is a cover used for forming a fine flow path by bonding one surface so as to cover the surface of a substrate having a fine flow path groove formed on the surface.
  • the second embodiment is the microchip cover member according to the first embodiment, wherein the cover member is a film having a thickness of 0.05 to 0.2 mm.
  • a third form is a cover member for a microchip according to the first form or the second form, wherein the cover member is substantially square, and the adhesive layer is a set of at least facing each other of the cover member. It is arranged around each of the sides.
  • a fourth embodiment is the microchip cover member according to any one of the first to third embodiments, wherein the adhesive layer surrounds the cover member. It is.
  • a fifth aspect is the microchip cover member according to any one of the first to fourth aspects, wherein the adhesive layer is separated by a predetermined distance or more from a region where the fine channel is formed. It is characterized by being arranged in a separate area.
  • a sixth aspect is the microchip cover member according to the first to fifth aspects, wherein the cover member includes a portion that protrudes when bonded to the substrate, and the adhesive layer includes: It is arrange
  • An eighth mode is a method for manufacturing a microchip cover member according to the seventh mode, wherein the cover member is substantially square, and the die-cutting step determines the distance between the strip-shaped adhesive layers. The die is cut so that the line dividing into two equals the line dividing the interval between two opposite sides of the quadrangle into two equal parts, and the two sides are included in the adhesive layer. .
  • a substantially rectangular cover member used for forming a fine flow path by bonding one surface so as to cover the surface of the substrate having a fine flow groove formed on the surface, and the cover
  • a protective film for protecting the one surface of the member, and disposed between the cover member and the protective film, and substantially parallel to each other along at least one pair of opposing sides of the one surface of the cover member.
  • a microchip manufacturing method comprising: an arrangement step of arranging and closely contacting, and a heat pressing step of forming the fine flow path by hot pressing and bonding the cover member and the substrate. .
  • the tenth aspect is the microchip manufacturing method according to the ninth aspect, wherein the cover member is a film having a thickness of 0.05 to 0.2 mm.
  • a flow path substrate in which a flow path groove is formed on the substrate surface, and the flow path substrate is joined to the substrate surface by thermal bonding so that the flow path groove is on the inner side to cover the flow path groove.
  • a microchip having a cover member, the adhesive formed between a substrate surface of the flow path substrate and the cover member and spaced from a region end portion where the flow path groove is formed
  • a microchip including a layer.
  • a twelfth aspect is the microchip according to the eleventh aspect, wherein the cover member is a film having a thickness of 0.05 to 0.2 mm.
  • a thirteenth aspect is the microchip according to the eleventh aspect or the twelfth aspect, wherein the cover member includes a portion protruding from a substrate surface joined to the flow path substrate, and the adhesive layer includes the adhesive layer It is formed in the part which protruded.
  • An adhesive layer formed at a predetermined interval from an end, and the cover member and the protective film are detachably bonded to each other by the adhesive layer. is there.
  • a fifteenth aspect is the microchip cover member according to the fourteenth aspect, wherein the cover member is a film having a thickness of 0.05 to 0.2 mm.
  • a sixteenth aspect is the microchip cover member according to the fourteenth aspect or the fifteenth aspect, wherein the adhesive layer is separated by 1 mm or more from a region facing the region where the fine channel groove is formed. It is characterized by being formed.
  • a seventeenth aspect is the microchip cover member according to the fourteenth aspect or the fifteenth aspect, wherein the adhesive layer is 0.8 mm from a region facing the region where the fine channel groove is formed. It is characterized by being formed with an interval of 1.2 mm or less.
  • the cover member for a microchip according to the present invention has a configuration in which the cover member and the protective film are bonded by an adhesive layer around two opposite sides of the cover member. As a result, one surface of the cover member is protected by the protective film until the cover member is supplied to the joining process of the cover member and the substrate, and the occurrence of foreign object pinching and scratches can be reduced. Accordingly, it is possible to suppress a decrease in bonding force when bonding the cover member and the substrate.
  • one surface of the cover member is protected by the protective film until the cover member is supplied to the joining process of the cover member and the substrate, and the occurrence of foreign object pinching and scratches can be reduced. Accordingly, it is possible to suppress a decrease in bonding force when bonding the cover member and the substrate. Moreover, since the cover member and the protective film for protecting the substrate bonding surface are partially bonded via the adhesive layer at a portion away from the region where the flow path is formed during substrate bonding, the cover member is protected by the protective film. Even when peeled off and bonded to the flow path substrate, a part of the adhesive layer remaining on the cover member does not move into the flow path of the substrate or a region where sufficient bonding force is obtained by thermal bonding. It is possible to bond the cover member and the flow path substrate with a sufficient bonding force without impairing the flow path characteristics.
  • the figure for demonstrating the other example of the coating pattern of an adhesion layer The exploded perspective view of the cover film for microchips concerning this modification, (B) is the top view of the cover film for microchips concerning this modification The top view of the cover film for microchips concerning 2nd Embodiment The perspective view of the microchip using the cover film for microchips concerning 3rd Embodiment (A) The figure of an example which changed the shape of the part which protruded from the board
  • FIG. 1A is an exploded perspective view of the microchip cover film according to the present embodiment.
  • FIG. 1B is a plan view of the microchip cover film according to the present embodiment.
  • FIG. 2 is a diagram showing a state where the cover film is being peeled from the protective film.
  • FIG. 3 is a plan view of a microchip formed using the microchip cover film according to this embodiment.
  • the microchip cover film according to the present embodiment is composed of three layers: a cover film 001, a protective film 002, and an adhesive layer 003.
  • a cover film 001 corresponds to the “cover member” in the present invention.
  • a film-like member is used as the cover member, but this shape may not be a film-like shape, for example, a shape having a certain thickness.
  • the cover film 001 has a substantially rectangular shape. Then, the cover film 001 is finally bonded to the substrate 004 to form a microchip as shown in FIG. Specifically, the surface having the fine channel groove 005 of the substrate 004 is covered with a cover film 001 and bonded by hot pressing to form a fine channel and complete a microchip.
  • the groove provided on the substrate 004 before being bonded to the cover film 001 is referred to as a fine channel groove 005, and the fine channel groove 005 is covered by bonding the cover film 001 and the substrate 004.
  • the completed channel is called a fine channel.
  • the cover film 001 has a rectangular shape, but this can be joined to the substrate 004 to form a fine flow path, in other words, the fine flow of the substrate 004.
  • Other shapes may be used as long as the shape sufficiently covers the entire road, and it may be adapted to the analysis method and the analysis device, and shapes such as a square, a rectangle, and a circle are preferable.
  • a quadrangular shape is used here, the shape is not limited to a strict quadrangular shape, and may include a shape in which corner portions are appropriately chamfered according to an analysis method and an analysis apparatus.
  • Resin is used for the cover film 001 and the substrate 004.
  • the resin include good moldability (transferability and releasability), high transparency, and low autofluorescence with respect to ultraviolet rays and visible light, but are not particularly limited. Absent.
  • polymethyl methacrylate, cyclic polyolefin and the like are preferable.
  • the same material may be used for the substrate 004 and the cover film 001, or different materials may be used.
  • the cover film 001 is adhered to the protective film 002 by the adhesive force of the adhesive layer 003.
  • the cover film 001 can be peeled off from the protective film 002 as shown in FIG. Specifically, the cover film 001 can be peeled by deflecting a three-layer microchip cover film by a predetermined amount or more (however, at least not to be broken). The predetermined amount to be peeled depends on the adhesive force of the adhesive layer 003 described later.
  • the protective film 002 has the same size and shape as the cover film 001 for convenience of the manufacturing method described later.
  • the size and shape of the protective film 002 may be other as long as it can cover the entire surface in close contact with the cover film 001.
  • the protective film 002 is made of polyethylene terephthalate as a material. This material is a material having higher adhesive strength with the adhesive layer 003 than the material used for the cover film 001. However, the protective film 002 may be made of another material as long as it has a higher adhesive force with the adhesive layer 003 than the cover film 001. For example, polymethylpentene or polyester may be used.
  • the adhesive layer 003 is a mixture of an adhesive that is an acrylic material and a release agent that is a silicon material.
  • a release agent is added so that the cover film 001 can be easily peeled off, but this release agent may not be added.
  • an adhesive an epoxy-type, urethane-type, and polyester-type substance may be used, for example.
  • the adhesive layer 003 is disposed between the cover film 001 and the protective film 002 as shown in FIG.
  • the adhesive force of the adhesive layer 003 is such that the cover film 001 and the protective film 002 can be peeled off.
  • the adhesive layer 003 has the cover film 001 adhered to the protective film 002.
  • the adhesive layer 003 is disposed in a range of 2.5 mm from an end portion formed by a pair of opposing sides of the cover film 001. Since the adhesive layer 003 is disposed near the end of the cover film 001, as shown in FIG. 3, when the cover film 001 and the substrate 004 are joined, the fine flow channel grooves 005 on the substrate 004 are formed.
  • the portion where the adhesive layer 003 on the cover film 001 is disposed does not overlap with the periphery (specifically, the distance from the fine channel groove 005 is within 1 mm).
  • a portion indicated by a dotted line in FIG. 3 is a region where the adhesive layer 003 is disposed.
  • the protective film 002 has a higher adhesive force with the adhesive layer 003 than the cover film 001, and therefore, most of the adhesive layer 003 remains on the protective film 002 side when peeled off. Therefore, the adhesive layer 003 is hardly left on the cover film 001 side, but for convenience of explanation, the region where the adhesive layer 003 is disposed is shown by a dotted line in FIG.
  • the range of the area of the adhesive layer 003 may actually be a range that has a force to maintain the state where the cover film 001 and the protective film 002 are adhered from the end of the cover film 001. .
  • the force required to maintain the state where the cover film 001 and the protective film 002 are adhered depends on the materials of the cover film 001, the protective film 002, and the adhesive layer 003. It is preferable to determine the range of the adhesive layer 003.
  • the substrate 004 and the cover film 001 are arranged in parallel as shown in FIG. 1B so that the adhesive layer 003 can be easily formed without overlapping the fine channel groove 005 when the substrate 004 and the cover film 001 are bonded together. ing.
  • the area of the adhesive layer 003 does not need to be completely parallel, and the adhesive layer 003 adhering to the cover film 001 to be bonded as described above is bonded to the fine channel groove 005 of the substrate 004 or the cover film 001. As long as it does not affect the process.
  • the adhesive layer 003 is provided in a range of 2.5 mm from the end formed by the opposite sides.
  • the cover film 001 In the case of a shape, it is necessary to arrange the adhesive layer 003 in accordance with the shape of the cover film 001. Then, the arrangement
  • FIG. 4 is a view for explaining a circular microchip cover film. And as shown in FIG.
  • the adhesion layer 003 is arrange
  • the adhesive layer 003 requires a region having a force for maintaining the state where the cover film 001 and the protective film 002 are adhered as described above.
  • the center of gravity is used to select the opposite sides, but this may be another point as long as it is approximately the center of the shape of the cover film 001.
  • the “two opposite sides” in the present invention means two sides that are approximately 180 ° symmetrical with respect to the center of the shape of the cover film 001, and these two sides are local.
  • it may be two sides.
  • FIG. 5 is a diagram for explaining a coating pattern of the adhesive layer 003. More specifically, FIG. 5 shows a state where the adhesive layer 003 is formed on the protective film 002 as viewed from above.
  • FIG. 6 is a view for explaining die cutting of a microchip cover film. More specifically, FIG. 6 is a view showing a state in which a cover film 001 is overlaid on a protective film 002 on which an adhesive layer 003 is formed and die cutting is performed as a microchip cover film.
  • FIG. 7 is a flowchart of the method for manufacturing a microchip cover film according to this embodiment.
  • the shape of the cover film 001 is a quadrangle, the distance between opposite sides of the cover film 001 on the side where the adhesive layer 003 is formed is 45 mm, and the width of the adhesive layer 003 is 2.5 mm.
  • seat of the protective film 002 which can produce 16 microchips is demonstrated.
  • FIG. 5 and FIG. 6 a sheet is produced in which eight microchip cover films are formed in two rows per row.
  • Step S001 A sheet of a protective film 002 capable of producing a plurality of microchip cover films as shown in FIGS. 5 and 6 is prepared, and a width of 40 mm (cover film) is formed on the protective film 002 as shown in FIG.
  • a strip-shaped mask 007 is applied, in which the length between the opposite sides on the side where the 001 adhesive layer 003 is formed is 45 mm minus twice the width 2.5 mm of the adhesive layer 003.
  • two strip-shaped masks 007 are applied on the sheet of the protective film 002.
  • Step S002 An adhesive is applied to the sheet of the protective film 002 to which the mask 007 is applied. Thereby, the area
  • two sets of regions of two adhesive layers 003 are produced.
  • two sets of the adhesive layer 003 are produced, but this may be any number of stages.
  • Step S003 As shown in FIG. 6, the cover film 001 is pasted on the protective film 002 on which the adhesive layer 003 is formed.
  • the protective film 002 since the sheet of the cover film 001 is overlaid on the sheet of the protective film 002, the protective film 002 is not actually shown in the table.
  • the protective film 002 sheet and the cover film 001 sheet are drawn as the same size sheet, but they may be different size sheets. In the case of sheets of different sizes, at least the sheet of the cover film 001 needs to be disposed between the adhesive layers 003 (in other words, between the adhesive layers 003).
  • Step S004 As shown in FIG. 6, the distance between the areas of the two adhesive layers 003 (the area between the mask 007 and the distance between the adhesive layers in FIG. 5) from the sheet of the cover film 001 and the protective film 002 stacked.
  • the mold of the square 009 is pulled out so that the center line 008 that bisects the center line 008 and the center line 010 that bisects the distance between the opposing sides of the square 009 of the cover film for microchip to be created coincide.
  • the square 009 is removed so that the center line 008 and the center line 010 exactly coincide with each other, but actually, the adhesive layer 003 is disposed in the peripheral portions of the two sides facing the square 009.
  • the adhesive state between the cover film 001 and the protective film 002 can be maintained even after the mold is removed, and one surface of the cover film 001 (the surface that will become a joint surface in the future) is attached to the protective film 002. Not exposed to be covered. As a result, it is possible to prevent foreign matter from being caught or scratched. Therefore, it is not necessary to make the center lines exactly coincide, and the mold of the square 009 may be removed so that the adhesive layer 003 is arranged around the two opposite sides of the square 009.
  • Step S005 Remove the microchip cover film that has been extracted from the sheet into a square 009 mold.
  • FIG. 8 is a flowchart of manufacturing a microchip using the microchip cover film according to the present embodiment.
  • Step S101 A cover film 001 adhered to the protective film 002 as shown in FIGS. 1A and 1B is supplied to a place where the substrate 004 is bonded.
  • Step S102 As shown in FIG. 2, the cover film 001 is peeled from the microchip cover film (the protective film 002 and the adhesive layer 003).
  • Step S103 The peeling surface of the cover film 101 (one surface: the surface that has been adhered (contacted) with the protective film 002 in Step S101) is brought into contact with the surface of the substrate 004 (the surface on which the fine channel groove 005 is formed),
  • the cover film 001 and the substrate 004 are arranged and adhered so that the portion that is not in contact with the adhesive layer 003 in step S101 includes the peripheral portion of the fine channel groove 005 formed in the substrate 004.
  • Step S104 A pressing pressure is applied in the direction in which the cover film 001 and the substrate 004 are bonded, and heating is performed in this state (hot pressing).
  • FIG. 14 is a diagram of an example of a hot press apparatus that performs hot press using the microchip cover film according to the present embodiment.
  • the hot press surface plate 101 and the hot press surface plate 102 are arranged at opposing positions as shown in FIG. Then, a substrate 004 (channel substrate) having a fine channel groove 005 formed on the surface thereof at a predetermined position of the hot press surface plate 102 is replaced with a surface provided with the micro channel groove 005 (hereinafter referred to as “channel formation surface”). ”)" Is arranged so as to face the hot press surface plate 101.
  • the cover film 001 peeled from the protective film 002 is disposed on the flow path forming surface, and a press surface having a size sufficient to uniformly press the entire cover film 001 toward the flow path forming surface is provided.
  • the hot press surface plate 101 is moved in the direction of the cover film 001 (the direction of the arrow P shown in FIG. 14), and the entire cover film 001 is pressed against the flow path forming surface. That is, the arrow P is the pressing direction.
  • the cover film 001 is thermally bonded to the flow path forming surface.
  • the heat press surface plate 102 and the heat press surface plate 101 are both movable and press the cover film 001 and the flow path forming surface by moving both up and down. May be movable.
  • the microchip cover film according to the present embodiment is formed from three layers of a cover film, a protective film, and an adhesive layer, and the adhesive layer is arranged around a pair of sides facing the cover film. Has been. As a result, even when the cover film is peeled off from the protective film, even if the adhesive layer remains on the cover film, it remains only at the edge of the cover film. It is possible to reduce the decrease in bonding strength without leaving an adhesive layer. In addition, since the bonding surface of the cover film is covered with the protective film until just before the cover film is bonded to the substrate, it is possible to reduce the occurrence of foreign object pinching and scratches.
  • the band-shaped adhesive layer 003 extending in the lateral direction with respect to the sheet shown in FIG. 5 is produced, but the adhesive layer 003 is formed in accordance with the substrate 004.
  • the adhesive layer 003 is formed in accordance with the substrate 004.
  • a band-like adhesive layer 003 extending in the longitudinal direction of the sheet shown in the drawing may be created.
  • FIG. 9 is a diagram for explaining another example of the coating pattern of the adhesive layer 003.
  • the center line 008 of the region sandwiched between the regions of the adhesive layer 003 and the center line 010 of the opposite side of the square 009 of the microchip cover film mold are matched to form the mold. If it falls out, a cover film for a microscopic channel chip can be created.
  • FIGS. 10A and 10B the microchip cover film according to this modified example is arranged so that the adhesive layer 003 surrounds the periphery of the cover film 001.
  • FIG. 10A is an exploded perspective view of the cover film for microchip according to this modification.
  • FIG. 10B is a plan view of the microchip cover film according to this modification.
  • the method for forming the pressure-sensitive adhesive layer 003 in the microchip cover film according to the present modification is the same as that for forming the sheet of FIG. 9 after applying the same mask as in FIG. 5 on the protective film 002 sheet and applying the pressure-sensitive adhesive. A similar mask is applied and the adhesive is applied again. Thereby, the adhesive layer 003 surrounding the square region can be formed. Then, by removing the mold so that the center line of the region sandwiched between the regions of the adhesive layer 003 facing each other and the center line of each side of the quadrilateral of the mold for the microchip cover member to be created, A cover film for a microchip as shown in FIG. 10B can be manufactured.
  • another method may be used for forming the adhesive layer 003.
  • the adhesive layer 003 may be formed by applying a square mask on a sheet of the protective film 002 and applying an adhesive thereon.
  • the cover film for a microchip according to this modification has a configuration in which an adhesive layer is formed around the entire periphery of the outer edge of the cover film and is adhered to the protective film with the adhesive layer. As a result, a portion of the cover film that will form a fine channel in the future will be surrounded by the adhesive layer and the protective film, and it becomes possible to further reduce the occurrence of foreign object pinching and scratches.
  • the rectangular microchip cover film has been described.
  • other shapes may be used.
  • an adhesive layer is provided on the entire circumference.
  • FIG. 11 is a plan view of the microchip cover film according to the present embodiment.
  • the region represented by the gray color in the cover film 001 in FIG. 11 is a region where the adhesive layer 003 is disposed.
  • the dotted line 011 in FIG. 11 does not actually exist, it is a portion where the fine channel groove 005 is located when the substrate 004 and the cover film 001 are joined.
  • the fine channel groove 005 (in other words, the formed fine channel) has a channel width of 100 ⁇ m.
  • an adhesive layer 003 is disposed from a position 1 mm away from the dotted line 011 to an end portion.
  • the distance from the dotted line 011 that is the position of the fine channel groove 005 to the adhesive layer 003 is 1 mm or more between the cover film 001 and the substrate 004. It is preferable for obtaining a sufficient bonding force. Furthermore, 0.8 mm or more and 1.2 mm or less is more preferable in terms of positioning.
  • the cover film for microchips according to the present embodiment has an adhesive layer shown in FIG. 11 by disposing a mask having the shape of the white portion shown in FIG. 11 on the protective film 002 and applying an adhesive from the mask. 003 is formed.
  • the mask in the shape of the white portion shown in FIG. 11 can be manufactured, for example, based on the fine channel groove 005 in the design drawing.
  • the conveying device has a positioning accuracy within 0.2 mm. Therefore, in order to arrange the region not in contact with the adhesive layer 003 at the above-described position of 1 mm or more, a joining margin of ⁇ 1.2 mm is required when the flow path width is 100 ⁇ m. Therefore, even if the adhesive layer 003 is provided to a position that is 1 mm or more away from the flow path width, the area of the cover film 001 that is not in contact with the adhesive layer 003 has a sufficient size to include the necessary joint margin. Have. Therefore, in this embodiment, the adhesive layer 003 is provided from a position 1 mm away from the dotted line 011. As described above, the distance from the dotted line 011 actually depends on the positioning accuracy, and it is preferable to determine the distance from the dotted line 011 to the adhesive layer 003 based on the positioning accuracy.
  • the microchip cover film according to the present embodiment adheres to the region from the position of 1 mm or more to the end of the cover film from the position of the fine channel when the substrate and the cover film are joined. Layers are arranged. Accordingly, it is possible to further reduce the occurrence of foreign object pinching and scratches while maintaining the bonding force when bonding the cover film and the substrate.
  • FIG. 12 is a perspective view of a microchip using the microchip cover film according to the present embodiment.
  • the microchip cover film according to the present embodiment is provided with the adhesive layer 003 in a region other than the portion of the cover film 001 that is bonded to the substrate 004.
  • the microchip cover film according to this embodiment even if the adhesive layer remains on the cover film side when the cover film is peeled off, the remainder of the adhesive layer does not affect the bonding between the cover film and the substrate. Thereby, joining of a cover film and a board
  • FIG. 13A is a diagram of an example in which the shape of the portion of the cover film that protrudes from the substrate is changed.
  • FIG. 13B is a diagram of an example in which the mold of the microchip cover film according to the first embodiment is deformed.

Abstract

Disclosed is a cover member for a microchip, wherein a cover film is provided with an adhesive layer, which is used for the bonding with a protective member, in a region that is distant from the area where a channel is formed. Specifically disclosed is a cover member for a microchip, which comprises: a cover film (001) which is used for forming a fine channel by being bonded with a substrate (004), which is provided with a fine channel groove in the surface, in such a manner that one surface of the cover film (001) covers the surface of the substrate (004); a protective film (002) for protecting the surface of the cover film (001); and strip-shaped adhesive layers (003) which are arranged between the cover film (001) and the protective film (002) at least along two opposite sides of the surface of the cover film (001) so as to be generally parallel with each other at a distance. The cover film (001) and the protective film (002) are bonded with each other by the adhesive layers (003), and the cover member can be separated from the protective film and the adhesive layers.

Description

マイクロチップ用カバー部材、マイクロチップ用カバー部材の製造方法、マイクロチップ、及びマイクロチップの製造方法Microchip cover member, microchip cover member manufacturing method, microchip, and microchip manufacturing method
　本発明は、微細加工技術により作成された微細流路を有するマイクロチップの製造に使用されるマイクロチップ用カバー部材、そのマイクロチップ用カバー部材の製造方法、そのカバー部材を用いたマイクロチップ、及びそのマイクロチップの製造方法に関する。 The present invention relates to a microchip cover member used for manufacturing a microchip having a microchannel created by a microfabrication technique, a method for manufacturing the microchip cover member, a microchip using the cover member, and The present invention relates to a method for manufacturing the microchip.
　微細加工技術を利用してシリコンやガラス基板上に微細な流路用溝を形成し、当該基板に対して平板状の封止部材を接合することにより流路や回路を形成することで、微小空間上に核酸、タンパク質、血液などの液体試料の化学反応や、分離、分析などを行うマイクロ分析チップ、マイクロチップ、あるいはμＴＡＳ（Ｍｉｃｒｏ　Ｔｏｔａｌ　Ａｎａｌｙｓｉｓ　Ｓｙｓｔｅｍｓ）などと称される装置（以下では、「マイクロチップ」という。）が実用化されている。このようなマイクロチップの利点としては、サンプルや試薬の使用量または廃液の排出量が軽減され、省スペースで持ち運び可能な安価なシステムの実現が考えられる。 By forming fine flow path grooves on a silicon or glass substrate using microfabrication technology and joining a flat sealing member to the substrate, a flow path and a circuit are formed. A device called a micro analysis chip, microchip, or μTAS (Micro Total Analysis Systems) that performs chemical reaction, separation, analysis, etc. of a liquid sample such as nucleic acid, protein, blood, etc. in space (hereinafter referred to as “micro-analysis systems”). Chip ") has been put to practical use. As an advantage of such a microchip, it is conceivable to realize an inexpensive system that can be carried in a small space because the amount of sample and reagent used or the amount of waste liquid discharged is reduced.
　上述した封止部材として樹脂製のフィルムが用いられる場合がある。この封止部材としてのフィルムをカバー部材若しくはカバーフィルムという。 A resin film may be used as the sealing member described above. This film as the sealing member is called a cover member or a cover film.
　従来、カバーフィルムを基板に接合するには、接着材で接着する技術（例えば、特許文献１参照。）や、熱プレスにより接合する技術（例えば、特許文献２参照。）が提案されている。 Conventionally, in order to bond a cover film to a substrate, a technique of bonding with an adhesive (for example, see Patent Document 1) and a technique of bonding by hot pressing (for example, see Patent Document 2) have been proposed.
特表２００３－５２０６９０号公報Special table 2003-520690 gazette 特開２００６－１４２１９８号公報JP 2006-142198 A
　しかし、特許文献１に記載されているような接着剤を用いてカバーフィルムと基板とを接合する方法では、微細流路に接着材が入り込み流路を塞ぐ危険があり、好ましくない。また、接合に接着材を用いる場合、その接着材の塗布した厚みのムラにより、流路空間の寸法が安定しないおそれがある。よって、マイクロチップのような高品質が要求されるものにおいては、接着材を用いない熱接合で行う必要がある。 However, the method of bonding the cover film and the substrate using an adhesive as described in Patent Document 1 is not preferable because there is a risk that an adhesive enters the fine channel and blocks the channel. In addition, when an adhesive is used for joining, the dimension of the flow path space may not be stable due to unevenness in the thickness applied by the adhesive. Therefore, in the case where a high quality such as a microchip is required, it is necessary to perform thermal bonding without using an adhesive.
　ところが、特許文献２に記載されているような従来の熱プレスによる接合の方法であっても、マイクロチップのような高品質を要求される製品では、従来にはない新たな問題がある。それは、カバーフィルム単体で熱プレス工程に供給するときに、カバーフィルムの接合面側にごみなどの異物が付着する危険や、接合面側に傷が発生してしまうおそれがある。この様な、異物の付着や傷の発生により不正確な接合が発生する危険がある。また、カバーフィルムを供給する際に保護フィルムを設けておいて供給する方法があるが、保護フィルムとカバーフィルムとを接合させておくための粘着層を保護フィルムとカバーフィルムとの間に設ける必要がある。そして、カバーフィルムを保護フィルムから剥離するときに、該粘着層の成分がカバーフィルムの流路を形成する付近の部分に移行してしまうため、その後の熱プレスによる接合工程において、流路を形成する付近において製品機能上支障のない安定した接合力を得ることができない。そのため、従来、この様な保護フィルムを設けた場合には保護フィルムと接着していない面を基板との接合面側として使用するため、やはり異物の付着や傷の発生を低減することは困難であった。 However, even with the conventional joining method by hot press as described in Patent Document 2, there is a new problem that is not found in the conventional products that require high quality such as microchips. That is, when supplying the cover film alone to the hot press process, there is a risk that foreign matters such as dust adhere to the joining surface side of the cover film, and there is a risk that scratches may occur on the joining surface side. There is a risk that inaccurate joining may occur due to the adhesion of foreign substances or the occurrence of scratches. In addition, there is a method of providing a protective film when supplying the cover film, but it is necessary to provide an adhesive layer between the protective film and the cover film for bonding the protective film and the cover film. There is. When the cover film is peeled off from the protective film, the components of the adhesive layer shift to a portion in the vicinity of the cover film that forms the flow path. Therefore, it is impossible to obtain a stable bonding force that does not hinder the product function in the vicinity. Therefore, conventionally, when such a protective film is provided, the surface that is not bonded to the protective film is used as the bonding surface side with the substrate, so it is difficult to reduce the adhesion of foreign substances and the occurrence of scratches. there were.
　この発明は、このような事情に鑑みてなされたもので、カバーフィルム（カバー部材）の流路を形成する付近から離れた領域に保護部材と接着するための粘着層を設けたマイクロチップ用カバーフィルムを提供することを目的としている。 The present invention has been made in view of such circumstances, and a cover for a microchip provided with an adhesive layer for adhering to a protective member in a region away from the vicinity of the flow path of the cover film (cover member). The purpose is to provide a film.
　上記目的を達成するために、第１の形態は、表面に微細流路溝が形成された基板の該表面を覆うように一面が接合されることによって微細流路を形成するのに用いられるカバー部材と、前記カバー部材の前記一面を保護するための保護フィルムと、前記カバー部材と前記保護フィルムとの間に配置され、且つ少なくとも前記カバー部材の前記一面の相対する２つの辺に沿って間隔をもって略平行に配置された帯状の粘着層と、を備え、前記カバー部材と前記保護フィルムとが前記粘着層によって接着されており、前記カバー部材は、前記保護フィルム及び前記粘着層と剥離可能であることを特徴とするマイクロチップ用カバー部材である。 In order to achieve the above object, the first embodiment is a cover used for forming a fine flow path by bonding one surface so as to cover the surface of a substrate having a fine flow path groove formed on the surface. A member, a protective film for protecting the one surface of the cover member, and disposed between the cover member and the protective film, and spaced at least along two opposing sides of the one surface of the cover member And the cover member and the protective film are adhered by the adhesive layer, and the cover member is peelable from the protective film and the adhesive layer. There is a cover member for a microchip characterized by being.
　第２の形態は、第１の形態に記載のマイクロチップ用カバー部材であって、前記カバー部材は、厚みが０．０５～０．２ｍｍのフィルムであることを特徴とするものである。 The second embodiment is the microchip cover member according to the first embodiment, wherein the cover member is a film having a thickness of 0.05 to 0.2 mm.
　第３の形態は、第１の形態又は第２の形態に記載のマイクロチップ用カバー部材であって、前記カバー部材は略四角形であり、前記粘着層は、前記カバー部材の少なくとも向かい合う一組の辺のそれぞれの周辺に配置されている、ことを特徴とするものである。 A third form is a cover member for a microchip according to the first form or the second form, wherein the cover member is substantially square, and the adhesive layer is a set of at least facing each other of the cover member. It is arranged around each of the sides.
　第４の形態は、第１の形態乃至第３の形態のいずれか一つに記載のマイクロチップ用カバー部材であって、前記粘着層が、前記カバー部材を囲っていることを特徴とするものである。 A fourth embodiment is the microchip cover member according to any one of the first to third embodiments, wherein the adhesive layer surrounds the cover member. It is.
　第５の形態は、第１の形態乃至第４の形態のいずれか一つに記載のマイクロチップ用カバー部材であって、前記粘着層は、前記微細流路を形成する領域から所定距離以上離れた領域に配置されることを特徴とするものである。 A fifth aspect is the microchip cover member according to any one of the first to fourth aspects, wherein the adhesive layer is separated by a predetermined distance or more from a region where the fine channel is formed. It is characterized by being arranged in a separate area.
　第６の形態は、第１の形態乃至第５の形態に記載のマイクロチップ用カバー部材であって、前記カバー部材は前記基板と接合した際にはみ出す部分を備えており、前記粘着層は、前記基板からはみ出す部分に配置されている、ことを特徴とするものである。 A sixth aspect is the microchip cover member according to the first to fifth aspects, wherein the cover member includes a portion that protrudes when bonded to the substrate, and the adhesive layer includes: It is arrange | positioned in the part which protrudes from the said board | substrate.
　第７の形態は、保護フィルムの上に間隔をあけて略平行に２つの帯状の粘着層を形成する粘着層形成段階と、前記粘着層が形成された前記保護フィルムに前記２つの帯状の粘着層の間をまたぐようにカバー部材を接着する段階と、前記カバー部材と前記保護フィルムとが重なっている部分であって、前記２つの帯状の粘着層が共に相対する一組の辺として含まれるように前記カバー部材側から前記保護フィルムもしくは前記保護フィルム側から前記カバー部材へと型抜きする型抜き段階と、を有することを特徴とするマイクロチップ用カバー部材の製造方法である。 In the seventh embodiment, an adhesive layer forming step of forming two strip-shaped adhesive layers substantially parallel to each other on the protective film, and the two strip-shaped adhesives on the protective film on which the adhesive layer is formed. A step of adhering the cover member so as to straddle between the layers, and a portion where the cover member and the protective film overlap each other, and the two band-like adhesive layers are included as a pair of opposing sides. Thus, there is provided a method for producing a microchip cover member, comprising: a die-cutting step of punching the cover film from the cover member side or the protective film side to the cover member.
　第８の形態は、第７の形態に記載のマイクロチップ用カバー部材の製造方法であって、前記カバー部材は略四角形であり、前記型抜き段階は、前記帯状の粘着層の間の距離を２等分する線が、前記四角形の向かい合う２辺の間隔を２等分する線に一致し、且つ前記２辺が前記粘着層に含まれるように型を抜く、ことを特徴とするものである。 An eighth mode is a method for manufacturing a microchip cover member according to the seventh mode, wherein the cover member is substantially square, and the die-cutting step determines the distance between the strip-shaped adhesive layers. The die is cut so that the line dividing into two equals the line dividing the interval between two opposite sides of the quadrangle into two equal parts, and the two sides are included in the adhesive layer. .
　第９の形態は、表面に微細流路溝が形成された基板の該表面を覆うように一面が接合されることによって微細流路を形成するのに用いられる略四角形のカバー部材と、前記カバー部材の前記一面を保護するための保護フィルムと、前記カバー部材と前記保護フィルムとの間に配置され、且つ前記カバー部材の前記一面の少なくとも向かい合う一組の辺のそれぞれに沿って略平行に配置された帯状の粘着層と、を備え、前記カバー部材と前記保護フィルムとが前記粘着層によって剥離可能に接着されているマイクロチップ用カバー部材から、前記カバー部材を剥離する剥離段階と、前記カバー部材の前記一面を前記基板の前記表面に当接させ、且つ前記基板の微細流路溝が前記カバー部材の前記粘着層と接していなかった領域に含まれるように配置し密着させる配置段階と、前記カバー部材と前記基板とを熱プレスして接合することで前記微細流路を形成する熱プレス段階と、を有することを特徴とするマイクロチップの製造方法である。 According to a ninth aspect, there is provided a substantially rectangular cover member used for forming a fine flow path by bonding one surface so as to cover the surface of the substrate having a fine flow groove formed on the surface, and the cover A protective film for protecting the one surface of the member, and disposed between the cover member and the protective film, and substantially parallel to each other along at least one pair of opposing sides of the one surface of the cover member. A peeling step of peeling the cover member from a microchip cover member, wherein the cover member and the protective film are detachably bonded to each other by the adhesive layer; The one surface of the member is brought into contact with the surface of the substrate, and the fine channel groove of the substrate is included in a region not in contact with the adhesive layer of the cover member. A microchip manufacturing method comprising: an arrangement step of arranging and closely contacting, and a heat pressing step of forming the fine flow path by hot pressing and bonding the cover member and the substrate. .
　第１０の形態は、第９の形態に記載のマイクロチップの製造方法であって、前記カバー部材は、厚みが０．０５～０．２ｍｍのフィルムであることを特徴とするものである。 The tenth aspect is the microchip manufacturing method according to the ninth aspect, wherein the cover member is a film having a thickness of 0.05 to 0.2 mm.
　第１１の形態は、基板表面に流路用溝が形成された流路基板と、前記流路用溝が内側となるように前記基板表面に熱接合により接合されて前記流路用溝を覆うカバー部材を有するマイクロチップであって、前記流路基板の基板表面と前記カバー部材との間であって、前記流路用溝が形成された領域端部から所定間隔を隔てて形成された粘着層を備えることを特徴とするマイクロチップである。 In an eleventh aspect, a flow path substrate in which a flow path groove is formed on the substrate surface, and the flow path substrate is joined to the substrate surface by thermal bonding so that the flow path groove is on the inner side to cover the flow path groove. A microchip having a cover member, the adhesive formed between a substrate surface of the flow path substrate and the cover member and spaced from a region end portion where the flow path groove is formed A microchip including a layer.
　第１２の形態は、第１１の形態に記載のマイクロチップであって、前記カバー部材は、厚みが０．０５～０．２ｍｍのフィルムであることを特徴とするものである。 A twelfth aspect is the microchip according to the eleventh aspect, wherein the cover member is a film having a thickness of 0.05 to 0.2 mm.
　第１３の形態は、第１１の形態又は第１２の形態に記載のマイクロチップであって、前記カバー部材は前記流路基板と接合された基板表面からはみ出した部分を備え、前記粘着層は前記はみ出した部分に形成されていることを特徴とするものである。 A thirteenth aspect is the microchip according to the eleventh aspect or the twelfth aspect, wherein the cover member includes a portion protruding from a substrate surface joined to the flow path substrate, and the adhesive layer includes the adhesive layer It is formed in the part which protruded.
　第１４の形態は、表面に微細流路溝が形成された基板の該表面を覆うように一面が接合されることによって微細流路を形成するのに用いられるカバー部材と、前記カバー部材の前記一面を保護するための保護フィルムと、前記カバー部材と前記保護フィルムとの間に配置され、前記基板に前記カバー部材が接合される際の前記微細流路溝が形成された領域に対向する領域端部から所定間隔を隔てて形成された粘着層と、を備え、記カバー部材と前記保護フィルムとが前記粘着層によって剥離可能に接着されている、ことを特徴とするマイクロチップ用カバー部材である。 In a fourteenth aspect, a cover member used to form a fine channel by bonding one surface so as to cover the surface of the substrate having a fine channel groove formed on the surface, and the cover member A region that is disposed between the protective film for protecting one surface and the cover member and the protective film, and that is opposed to the region in which the fine channel groove is formed when the cover member is joined to the substrate. An adhesive layer formed at a predetermined interval from an end, and the cover member and the protective film are detachably bonded to each other by the adhesive layer. is there.
　第１５の形態は、第１４の形態に記載のマイクロチップ用カバー部材であって、前記カバー部材は、厚みが０．０５～０．２ｍｍのフィルムであることを特徴とするものである。 A fifteenth aspect is the microchip cover member according to the fourteenth aspect, wherein the cover member is a film having a thickness of 0.05 to 0.2 mm.
　第１６の形態は、第１４の形態又は第１５の形態に記載のマイクロチップ用カバー部材であって、前記粘着層は、前記微細流路溝が形成された領域に対向する領域から１ｍｍ以上隔てて形成されていることを特徴とするものである。 A sixteenth aspect is the microchip cover member according to the fourteenth aspect or the fifteenth aspect, wherein the adhesive layer is separated by 1 mm or more from a region facing the region where the fine channel groove is formed. It is characterized by being formed.
　第１７の形態は、第１４の形態又は第１５の形態に記載のマイクロチップ用カバー部材であって、前記粘着層は、前記微細流路溝が形成された領域に対向する領域から０．８ｍｍ以上１．２ｍｍ以下の間隔を隔てて形成されていることを特徴とするものである。 A seventeenth aspect is the microchip cover member according to the fourteenth aspect or the fifteenth aspect, wherein the adhesive layer is 0.8 mm from a region facing the region where the fine channel groove is formed. It is characterized by being formed with an interval of 1.2 mm or less.
　この発明のマイクロチップ用カバー部材は、カバー部材の相対する２つの辺の周辺の粘着層により、カバー部材と保護フィルムが接着されている構成である。これにより、カバー部材と基板との接合工程にカバー部材が供給されるまでカバー部材の一面が保護フィルムで保護されており異物の挟み込みや傷の発生を軽減することができる。したがって、カバー部材と基板とを接合するときの接合力の低下を抑えることが可能となる。 The cover member for a microchip according to the present invention has a configuration in which the cover member and the protective film are bonded by an adhesive layer around two opposite sides of the cover member. As a result, one surface of the cover member is protected by the protective film until the cover member is supplied to the joining process of the cover member and the substrate, and the occurrence of foreign object pinching and scratches can be reduced. Accordingly, it is possible to suppress a decrease in bonding force when bonding the cover member and the substrate.
　この発明によれば、カバー部材と基板との接合工程にカバー部材が供給されるまでカバー部材の一面が保護フィルムで保護されており異物の挟み込みや傷の発生を軽減することができる。したがって、カバー部材と基板とを接合するときの接合力の低下を抑えることが可能となる。またカバー部材とその基板接合面を保護する保護フィルムとは、基板接合時に流路が形成された領域から離れた部分で部分的に粘着層を介して接合されているため、カバー部材を保護フィルムから剥離して流路基板に接合する場合でも、カバー部材に残存した粘着層の一部が基板の流路内や熱接合で十分な接合力を得る領域に移行する事がないため、マイクロチップの流路特性を損なうことなく、カバー部材と流路基板とを十分な接合力で接合する事が可能となる。 According to the present invention, one surface of the cover member is protected by the protective film until the cover member is supplied to the joining process of the cover member and the substrate, and the occurrence of foreign object pinching and scratches can be reduced. Accordingly, it is possible to suppress a decrease in bonding force when bonding the cover member and the substrate. Moreover, since the cover member and the protective film for protecting the substrate bonding surface are partially bonded via the adhesive layer at a portion away from the region where the flow path is formed during substrate bonding, the cover member is protected by the protective film. Even when peeled off and bonded to the flow path substrate, a part of the adhesive layer remaining on the cover member does not move into the flow path of the substrate or a region where sufficient bonding force is obtained by thermal bonding. It is possible to bond the cover member and the flow path substrate with a sufficient bonding force without impairing the flow path characteristics.
（Ａ）第１の実施形態に係るマイクロチップ用カバーフィルムの分解斜視図、（Ｂ）第１の実施形態に係るマイクロチップ用カバーフィルムの平面図(A) The exploded perspective view of the cover film for microchips concerning 1st Embodiment, (B) The top view of the cover film for microchips concerning 1st Embodiment カバーフィルムの保護フィルムからの剥離途中の状態の図Diagram of the state of peeling of the cover film from the protective film 第１の実施形態に係るマイクロチップ用カバーフィルムを使用して作成したマイクロチップの平面図The top view of the microchip created using the cover film for microchips concerning 1st Embodiment 円形のマイクロチップ用カバーフィルムを説明するための図Diagram for explaining circular microchip cover film 粘着層の塗工パターンを説明するための図Diagram for explaining the coating pattern of the adhesive layer マイクロチップ用カバーフィルムの型抜きを説明するための図Diagram for explaining die cutting of microchip cover film 本実施形態に係るマイクロチップ用カバーフィルムの製造方法のフローチャートの図The figure of the flowchart of the manufacturing method of the cover film for microchips concerning this embodiment 第１の実施形態に係るマイクロチップ用カバーフィルムを用いたマイクロチップの製造のフローチャートの図The figure of the flowchart of manufacture of the microchip using the cover film for microchips concerning 1st Embodiment. 粘着層の塗工パターンの他の例を説明するための図The figure for demonstrating the other example of the coating pattern of an adhesion layer 本変形例に係るマイクロチップ用カバーフィルムの分解斜視図、（Ｂ）は本変形例に係るマイクロチップ用カバーフィルムの平面図The exploded perspective view of the cover film for microchips concerning this modification, (B) is the top view of the cover film for microchips concerning this modification 第２の実施形態に係るマイクロチップ用カバーフィルムの平面図The top view of the cover film for microchips concerning 2nd Embodiment 第３の実施形態に係るマイクロチップ用カバーフィルムを用いたマイクロチップの斜視図The perspective view of the microchip using the cover film for microchips concerning 3rd Embodiment （Ａ）カバーフィルムの基板からはみ出た部分の形状を変化させた一例の図、（Ｂ）第１の実施形態に係るマイクロチップ用カバーフィルムの型を変形させた一例の図(A) The figure of an example which changed the shape of the part which protruded from the board | substrate of the cover film, (B) The figure of an example which changed the type | mold of the cover film for microchips which concerns on 1st Embodiment. 第１の実施形態に係るマイクロチップ用カバーフィルムを用いて熱プレスを行う熱プレス装置の一例の図The figure of an example of the hot press apparatus which performs hot press using the cover film for microchips concerning 1st Embodiment
　〔第１の実施形態〕
　以下、この発明の第１の実施形態に係るマイクロチップ用カバー部材について説明する。本実施形態に係るマイクロチップ用カバー部材はフィルム状であるので、以下の説明では「マイクロチップ用カバーフィルム」という。ただし、この形状は薄いフィルム状のものでなくてもよく、例えばある程度の厚みのあるような形状でもよい。図１（Ａ）は本実施形態に係るマイクロチップ用カバーフィルムの分解斜視図である。図１（Ｂ）は本実施形態に係るマイクロチップ用カバーフィルムの平面図である。図２はカバーフィルムの保護フィルムからの剥離途中の状態の図である。図３は本実施形態に係るマイクロチップ用カバーフィルムを使用して作成したマイクロチップの平面図である。 [First Embodiment]
A microchip cover member according to the first embodiment of the present invention will be described below. Since the microchip cover member according to the present embodiment is in the form of a film, it will be referred to as a “microchip cover film” in the following description. However, this shape does not have to be a thin film, and may be a shape having a certain thickness, for example. FIG. 1A is an exploded perspective view of the microchip cover film according to the present embodiment. FIG. 1B is a plan view of the microchip cover film according to the present embodiment. FIG. 2 is a diagram showing a state where the cover film is being peeled from the protective film. FIG. 3 is a plan view of a microchip formed using the microchip cover film according to this embodiment.
　図１（Ａ）に示すように、本実施形態に係るマイクロチップ用カバーフィルムは、カバーフィルム００１、保護フィルム００２、及び粘着層００３の３層で構成されている。以下では、この３層を構成するそれぞれの部材について詳細に説明する。このカバーフィルム００１が本発明における「カバー部材」にあたる。ただし、本実施形態ではカバー部材としてフィルム状のものを使用しているが、この形状はフィルム状でなくてもよく、例えばある程度の厚みのあるような形状でもよい。 As shown in FIG. 1A, the microchip cover film according to the present embodiment is composed of three layers: a cover film 001, a protective film 002, and an adhesive layer 003. Below, each member which comprises these three layers is demonstrated in detail. This cover film 001 corresponds to the “cover member” in the present invention. However, in the present embodiment, a film-like member is used as the cover member, but this shape may not be a film-like shape, for example, a shape having a certain thickness.
　本実施形態では、カバーフィルム００１は略四角形の形状を有している。そして、カバーフィルム００１は、最終的には図３に示すように、基板００４と接合されてマイクロチップを形成する。具体的には、基板００４の微細流路溝００５を有する面をカバーフィルム００１で覆い、熱プレスをして接合することで微細流路を形成し、マイクロチップを完成させる。以下の説明では、カバーフィルム００１と接合する前の基板００４上に設けられた溝を微細流路溝００５と呼び、カバーフィルム００１と基板００４が接合されることで微細流路溝００５が覆われて完成した状態の流路を微細流路と呼ぶ。ここで、本実施形態では図１に示すように、カバーフィルム００１は、四角形の形状をしているが、これは基板００４と接合して微細流路を形成できる、言い換えれば基板００４の微細流路全体を十分に覆う大きさ形状であれば他の形状であってもよく、分析手法、分析装置に合わせればよく、正方形、長方形、円形等の形状が好ましい。また、ここで四角形の形状としているが、厳密な四角形状には限定されず、分析手法、分析装置に合わせて角部は適宜面取りされている形状も含みえるものである。 In this embodiment, the cover film 001 has a substantially rectangular shape. Then, the cover film 001 is finally bonded to the substrate 004 to form a microchip as shown in FIG. Specifically, the surface having the fine channel groove 005 of the substrate 004 is covered with a cover film 001 and bonded by hot pressing to form a fine channel and complete a microchip. In the following description, the groove provided on the substrate 004 before being bonded to the cover film 001 is referred to as a fine channel groove 005, and the fine channel groove 005 is covered by bonding the cover film 001 and the substrate 004. The completed channel is called a fine channel. Here, in this embodiment, as shown in FIG. 1, the cover film 001 has a rectangular shape, but this can be joined to the substrate 004 to form a fine flow path, in other words, the fine flow of the substrate 004. Other shapes may be used as long as the shape sufficiently covers the entire road, and it may be adapted to the analysis method and the analysis device, and shapes such as a square, a rectangle, and a circle are preferable. In addition, although a quadrangular shape is used here, the shape is not limited to a strict quadrangular shape, and may include a shape in which corner portions are appropriately chamfered according to an analysis method and an analysis apparatus.
　カバーフィルム００１及び基板００４には樹脂が用いられる。その樹脂としては、成形性（転写性、離型性）が良いこと、透明性が高いこと、紫外線や可視光に対する自己蛍光性が低いことなどが条件として挙げられるが、特に限定されるものではない。例えば、ポリカーボネート、ポリメタクリル酸メチル、ポリスチレン、ポリアクリロニトリル、ポリ塩化ビニル、ポリエチレンテレフタレート、ナイロン６、ナイロン６６、ポリ酢酸ビニル、ポリ塩化ビニリデン、ポリプロピレン、ポリイソプレン、ポリエチレン、ポリジメチルシロキサン、環状ポリオレフィン等が好ましい。特に、ポリメタクリル酸メチル、環状ポリオレフィン等が好ましい。基板００４とカバーフィルム００１とで、同じ材料を用いてもよく、異なる材料を用いてもよい。 Resin is used for the cover film 001 and the substrate 004. Examples of the resin include good moldability (transferability and releasability), high transparency, and low autofluorescence with respect to ultraviolet rays and visible light, but are not particularly limited. Absent. For example, polycarbonate, polymethyl methacrylate, polystyrene, polyacrylonitrile, polyvinyl chloride, polyethylene terephthalate, nylon 6, nylon 66, polyvinyl acetate, polyvinylidene chloride, polypropylene, polyisoprene, polyethylene, polydimethylsiloxane, cyclic polyolefin, etc. preferable. In particular, polymethyl methacrylate, cyclic polyolefin and the like are preferable. The same material may be used for the substrate 004 and the cover film 001, or different materials may be used.
　カバーフィルム００１は、粘着層００３の粘着力により保護フィルム００２に接着されている。そして、カバーフィルム００１は、図２に示すように保護フィルム００２から剥離可能である。具体的には、３層構造のマイクロチップ用カバーフィルムを所定量以上（ただし、少なくとも折れない程度）たわませることで、カバーフィルム００１を剥離可能である。この剥離する所定量は後述する粘着層００３の粘着力に依存する。 The cover film 001 is adhered to the protective film 002 by the adhesive force of the adhesive layer 003. The cover film 001 can be peeled off from the protective film 002 as shown in FIG. Specifically, the cover film 001 can be peeled by deflecting a three-layer microchip cover film by a predetermined amount or more (however, at least not to be broken). The predetermined amount to be peeled depends on the adhesive force of the adhesive layer 003 described later.
　保護フィルム００２は、本実施形態では後述する製造方法の都合上カバーフィルム００１と同じ大きさ形状である。ただし、保護フィルム００２の大きさ形状はカバーフィルム００１と密着している面をすべて覆うことが可能な大きさであれば他のものでもよい。 In the present embodiment, the protective film 002 has the same size and shape as the cover film 001 for convenience of the manufacturing method described later. However, the size and shape of the protective film 002 may be other as long as it can cover the entire surface in close contact with the cover film 001.
　保護フィルム００２は、材料としてはポリエチレンテレフタレートが用いられる。この材料は、カバーフィルム００１に用いられる材料と比較して粘着層００３との粘着力が高い材質である。ただし、この保護フィルム００２は、カバーフィルム００１よりも粘着層００３との粘着力が高い材質であれば他の材料で構成されていてもよく、例えば、ポリメチルペンテン、ポリエステルなどでもよい。 The protective film 002 is made of polyethylene terephthalate as a material. This material is a material having higher adhesive strength with the adhesive layer 003 than the material used for the cover film 001. However, the protective film 002 may be made of another material as long as it has a higher adhesive force with the adhesive layer 003 than the cover film 001. For example, polymethylpentene or polyester may be used.
　粘着層００３は、アクリル系物質である粘着剤とシリコン系物質である離型剤を混合させたものである。ここで、本実施形態ではカバーフィルム００１を剥離し易いように離型剤を加えているがこの離型剤は加えなくてもよい。また、粘着剤としては、例えば、エポキシ系、ウレタン系、ポリエステル系の物質でもよい。 The adhesive layer 003 is a mixture of an adhesive that is an acrylic material and a release agent that is a silicon material. Here, in this embodiment, a release agent is added so that the cover film 001 can be easily peeled off, but this release agent may not be added. Moreover, as an adhesive, an epoxy-type, urethane-type, and polyester-type substance may be used, for example.
　粘着層００３は、図１（Ａ）に示すようにカバーフィルム００１と保護フィルム００２との間に配置される。この粘着層００３の粘着力はカバーフィルム００１と保護フィルム００２とを剥離可能な程度の粘着力を有する。そして、粘着層００３は、カバーフィルム００１を保護フィルム００２に接着させておく。粘着層００３は、図１（Ｂ）に示すようにカバーフィルム００１の向かい合う一組の辺が形成する端部から２．５ｍｍの範囲に配置されている。この粘着層００３はカバーフィルム００１の端部付近に配置されているため、図３に示すように、カバーフィルム００１と基板００４とが接合されたときに、基板００４上の微細流路溝００５の周辺（具体的には微細流路溝００５からの距離が１ｍｍ以内）にカバーフィルム００１上の粘着層００３が配置されていた部分が重ならない構成になっている。図３の点線で示されている部分は粘着層００３が配置されていた領域である。実際には、前述したように、保護フィルム００２の方がカバーフィルム００１と比較して粘着層００３との粘着力が高いため、粘着層００３は剥離した時にそのほとんどが保護フィルム００２側に残る。そのため、カバーフィルム００１側には粘着層００３はほぼ残っていないが説明の都合上図３では粘着層００３が配置されていた領域を点線で図示している。 The adhesive layer 003 is disposed between the cover film 001 and the protective film 002 as shown in FIG. The adhesive force of the adhesive layer 003 is such that the cover film 001 and the protective film 002 can be peeled off. The adhesive layer 003 has the cover film 001 adhered to the protective film 002. As shown in FIG. 1B, the adhesive layer 003 is disposed in a range of 2.5 mm from an end portion formed by a pair of opposing sides of the cover film 001. Since the adhesive layer 003 is disposed near the end of the cover film 001, as shown in FIG. 3, when the cover film 001 and the substrate 004 are joined, the fine flow channel grooves 005 on the substrate 004 are formed. The portion where the adhesive layer 003 on the cover film 001 is disposed does not overlap with the periphery (specifically, the distance from the fine channel groove 005 is within 1 mm). A portion indicated by a dotted line in FIG. 3 is a region where the adhesive layer 003 is disposed. Actually, as described above, the protective film 002 has a higher adhesive force with the adhesive layer 003 than the cover film 001, and therefore, most of the adhesive layer 003 remains on the protective film 002 side when peeled off. Therefore, the adhesive layer 003 is hardly left on the cover film 001 side, but for convenience of explanation, the region where the adhesive layer 003 is disposed is shown by a dotted line in FIG.
　ここで、実際には粘着層００３の領域の範囲はカバーフィルム００１の端部から範囲はカバーフィルム００１と保護フィルム００２とを接着した状態を維持させておく力を有するような範囲であればよい。そして、このカバーフィルム００１と保護フィルム００２とを接着した状態を維持させておくのに必要な力はカバーフィルム００１、保護フィルム００２、及び粘着層００３の材質に依存するため、それぞれの材質に合わせて粘着層００３の範囲を決定することが好ましい。本実施形態では、基板００４とカバーフィルム００１とを張り合わせた時に微細流路溝００５と重ならず、且つ容易に粘着層００３を形成できるように図１（Ｂ）に示すように平行に配置されている。ただし、この粘着層００３の領域は完全に並行である必要はなく、上述のように接着されるカバーフィルム００１に付着する粘着層００３が基板００４の微細流路溝００５やカバーフィルム００１との接合に影響がない程度であれば良い。 Here, the range of the area of the adhesive layer 003 may actually be a range that has a force to maintain the state where the cover film 001 and the protective film 002 are adhered from the end of the cover film 001. . The force required to maintain the state where the cover film 001 and the protective film 002 are adhered depends on the materials of the cover film 001, the protective film 002, and the adhesive layer 003. It is preferable to determine the range of the adhesive layer 003. In the present embodiment, the substrate 004 and the cover film 001 are arranged in parallel as shown in FIG. 1B so that the adhesive layer 003 can be easily formed without overlapping the fine channel groove 005 when the substrate 004 and the cover film 001 are bonded together. ing. However, the area of the adhesive layer 003 does not need to be completely parallel, and the adhesive layer 003 adhering to the cover film 001 to be bonded as described above is bonded to the fine channel groove 005 of the substrate 004 or the cover film 001. As long as it does not affect the process.
　また、本実施形態では、カバーフィルム００１が四角形の形状を有しているため、その向かい合う辺が形成する端部から２．５ｍｍの範囲に粘着層００３を設けたが、カバーフィルム００１が他の形状の場合には、カバーフィルム００１の形状に合わせて粘着層００３を配置する必要がある。そこで、他の形状を有するカバーフィルム００１の場合における粘着層００３の配置方法を説明する。 In the present embodiment, since the cover film 001 has a quadrangular shape, the adhesive layer 003 is provided in a range of 2.5 mm from the end formed by the opposite sides. However, the cover film 001 In the case of a shape, it is necessary to arrange the adhesive layer 003 in accordance with the shape of the cover film 001. Then, the arrangement | positioning method of the adhesion layer 003 in the case of the cover film 001 which has another shape is demonstrated.
　まずカバーフィルム００１の重心を選択する。そして、その重心を通り１８０度対称の位置にあり重心を挟んで向かい合うカバーフィルム００１の端部の点を選択する。そして、粘着層００３は、その向かい合うカバーフィルム００１の端部の点を含むその周辺に配置される。具体的には、例えば、図４に示すようにカバーフィルム００１が円形の場合には、カバーフィルム００１の重心は円の中心であり、円の中心を挟んで１８０度対称の位置（相対する２つの辺の上）にある点として点００６ａ及び点００６ｂを選択する。図４は円形のマイクロチップ用カバーフィルムを説明するための図である。そして、図４に示すようにその点００６ａ及び点００６ｂの周辺の領域に粘着層００３が配置される。ただし、粘着層００３は、上述のようにカバーフィルム００１と保護フィルム００２とを接着した状態を維持させておく力を有する領域が必要である。またここでは、相対する辺を選択するために重心を利用したが、これはおおよそカバーフィルム００１の形状の中心であれば他の点でもよい。この様に、本発明における「相対する２つの辺とは」、カバーフィルム００１の形状の中心を挟んでおおよそ１８０°対称の位置にある２つの辺のことをいい、それらの２つの辺は局所的に見て２つの辺となっていればよく、例えば円周のように２つの辺同士が繋がっていて１つの線を構成している状態のものでもよい。 First, select the center of gravity of the cover film 001. And the point of the edge part of the cover film 001 which passes through the center of gravity and is located at a symmetrical position of 180 degrees and faces the center of gravity is selected. And the adhesion layer 003 is arrange | positioned in the periphery containing the point of the edge part of the cover film 001 which faces it. Specifically, for example, when the cover film 001 is circular as shown in FIG. 4, the center of gravity of the cover film 001 is the center of the circle, and a 180 ° symmetrical position (2 Point 006a and point 006b are selected as points on one side). FIG. 4 is a view for explaining a circular microchip cover film. And as shown in FIG. 4, the adhesion layer 003 is arrange | positioned in the area | region around the points 006a and 006b. However, the adhesive layer 003 requires a region having a force for maintaining the state where the cover film 001 and the protective film 002 are adhered as described above. Here, the center of gravity is used to select the opposite sides, but this may be another point as long as it is approximately the center of the shape of the cover film 001. As described above, the “two opposite sides” in the present invention means two sides that are approximately 180 ° symmetrical with respect to the center of the shape of the cover film 001, and these two sides are local. For example, it may be two sides. For example, it may be a state in which two sides are connected to each other like a circumference to form one line.
　次に、本実施形態に係るマイクロチップ用カバーフィルムの製造方法を図５、図６、及び図７を参照して説明する。図５は粘着層００３の塗工パターンを説明するための図である。より詳しくは、図５は保護フィルム００２に粘着層００３を形成する状態を上から見た状態である。図６はマイクロチップ用カバーフィルムの型抜きを説明するための図である。より詳しくは、図６は粘着層００３が形成された保護フィルム００２上にカバーフィルム００１を重ね合わせ、マイクロチップ用カバーフィルムとしての型抜きを行った状態の図である。図７は本実施形態に係るマイクロチップ用カバーフィルムの製造方法のフローチャートの図である。以下の説明では、カバーフィルム００１の形状を四角形とし、カバーフィルム００１の粘着層００３が形成される側の向かい合う辺の間の距離を４５ｍｍとし、粘着層００３の幅を２．５ｍｍとする。また、以下の説明では、１６個のマイクロチップを作製することができるカバーフィルム００１のシート及び保護フィルム００２のシートを用いる場合について説明する。図５及び図６では、１列につき８個のマイクロチップ用カバーフィルムが２段組みになって作製されるシートとなっている。 Next, a method for manufacturing a microchip cover film according to the present embodiment will be described with reference to FIGS. 5, 6, and 7. FIG. 5 is a diagram for explaining a coating pattern of the adhesive layer 003. More specifically, FIG. 5 shows a state where the adhesive layer 003 is formed on the protective film 002 as viewed from above. FIG. 6 is a view for explaining die cutting of a microchip cover film. More specifically, FIG. 6 is a view showing a state in which a cover film 001 is overlaid on a protective film 002 on which an adhesive layer 003 is formed and die cutting is performed as a microchip cover film. FIG. 7 is a flowchart of the method for manufacturing a microchip cover film according to this embodiment. In the following description, the shape of the cover film 001 is a quadrangle, the distance between opposite sides of the cover film 001 on the side where the adhesive layer 003 is formed is 45 mm, and the width of the adhesive layer 003 is 2.5 mm. Moreover, in the following description, the case where the sheet | seat of the cover film 001 and the sheet | seat of the protective film 002 which can produce 16 microchips is demonstrated. In FIG. 5 and FIG. 6, a sheet is produced in which eight microchip cover films are formed in two rows per row.
　ステップＳ００１：図５及び図６のように複数のマイクロチップ用カバーフィルムを作製できる保護フィルム００２のシートを用意し、該保護フィルム００２のシートの上に図５に示すように幅４０ｍｍ（カバーフィルム００１の粘着層００３が形成される側の向かい合う辺の間の長さを４５ｍｍから粘着層００３の幅２．５ｍｍの２倍を引いたもの）の帯状のマスク００７を施す。ここで、本実施形態では、図５に示すように、保護フィルム００２のシートの上に２つの帯状のマスク００７を施す。 Step S001: A sheet of a protective film 002 capable of producing a plurality of microchip cover films as shown in FIGS. 5 and 6 is prepared, and a width of 40 mm (cover film) is formed on the protective film 002 as shown in FIG. A strip-shaped mask 007 is applied, in which the length between the opposite sides on the side where the 001 adhesive layer 003 is formed is 45 mm minus twice the width 2.5 mm of the adhesive layer 003. Here, in this embodiment, as shown in FIG. 5, two strip-shaped masks 007 are applied on the sheet of the protective film 002.
　ステップＳ００２：マスク００７を施した保護フィルム００２のシートに粘着剤を塗布する。これにより、保護フィルム００２のシートの上に４０ｍｍの間隔をあけて２つの粘着層００３の領域を形成する。本実施形態では、図５に示すように、２つの粘着層００３の領域の組みを２段作製する。ここで、本実施形態では、粘着層００３の組を２段作製したが、これは何段であってもよい。 Step S002: An adhesive is applied to the sheet of the protective film 002 to which the mask 007 is applied. Thereby, the area | region of the two adhesion layers 003 is formed on the sheet | seat of the protective film 002 at intervals of 40 mm. In this embodiment, as shown in FIG. 5, two sets of regions of two adhesive layers 003 are produced. Here, in this embodiment, two sets of the adhesive layer 003 are produced, but this may be any number of stages.
　ステップＳ００３：図６のように、粘着層００３を形成した保護フィルム００２のシート上にカバーフィルム００１のシートを張り付ける。図６では保護フィルム００２のシート上にカバーフィルム００１のシートが重ねられているため、実際には保護フィルム００２は表に出ていない。また、本実施形態では保護フィルム００２のシートとカバーフィルム００１のシートが同じ大きさのシートとして描かれているがこれは異なる大きさのシートであってもよい。異なる大きさのシートの場合、少なくともカバーフィルム００１のシートは粘着層００３の間をまたいで（言い換えれば、粘着層００３の間に亘るように）配置される必要がある。 Step S003: As shown in FIG. 6, the cover film 001 is pasted on the protective film 002 on which the adhesive layer 003 is formed. In FIG. 6, since the sheet of the cover film 001 is overlaid on the sheet of the protective film 002, the protective film 002 is not actually shown in the table. In this embodiment, the protective film 002 sheet and the cover film 001 sheet are drawn as the same size sheet, but they may be different size sheets. In the case of sheets of different sizes, at least the sheet of the cover film 001 needs to be disposed between the adhesive layers 003 (in other words, between the adhesive layers 003).
　ステップＳ００４：図６に示すように、カバーフィルム００１のシートと保護フィルム００２のシートを重ねたシートから、２つの粘着層００３の領域の間隔（図５におけるマスク００７の領域であり粘着層間の距離）を二等分する中心線００８と、作成するマイクロチップ用カバーフィルムの四角形００９の向かい合う辺の間の距離を二等分する中心線０１０とが一致するように四角形００９の型を抜く。ここで、本実施形態では、厳密に中心線００８と中心線０１０とが一致するように四角形００９の型を抜いたが、実際には四角形００９の向かい合う２辺の周辺部分に粘着層００３が配置されていれば型を抜いた後もカバーフィルム００１と保護フィルム００２との接着状態を維持することが可能であり、カバーフィルム００１の一面（将来的に接合面となる面）は保護フィルム００２に覆われるために露出していない。これにより異物の挟み込みや傷の発生を防止できる。そこで、中心線を正確に一致させる必要はなく、おおよそ粘着層００３が四角形００９の向かい合う２辺の周辺に配置されるように四角形００９の型を抜くようにしてもよい。 Step S004: As shown in FIG. 6, the distance between the areas of the two adhesive layers 003 (the area between the mask 007 and the distance between the adhesive layers in FIG. 5) from the sheet of the cover film 001 and the protective film 002 stacked. The mold of the square 009 is pulled out so that the center line 008 that bisects the center line 008 and the center line 010 that bisects the distance between the opposing sides of the square 009 of the cover film for microchip to be created coincide. Here, in this embodiment, the square 009 is removed so that the center line 008 and the center line 010 exactly coincide with each other, but actually, the adhesive layer 003 is disposed in the peripheral portions of the two sides facing the square 009. If this is done, the adhesive state between the cover film 001 and the protective film 002 can be maintained even after the mold is removed, and one surface of the cover film 001 (the surface that will become a joint surface in the future) is attached to the protective film 002. Not exposed to be covered. As a result, it is possible to prevent foreign matter from being caught or scratched. Therefore, it is not necessary to make the center lines exactly coincide, and the mold of the square 009 may be removed so that the adhesive layer 003 is arranged around the two opposite sides of the square 009.
　ステップＳ００５：シートから四角形００９の型に抜いたマイクロチップ用カバーフィルムを外す。 Step S005: Remove the microchip cover film that has been extracted from the sheet into a square 009 mold.
　（マイクロチップの製造方法）
　次に、本実施形態に係るマイクロチップ用カバーフィルムを用いたマイクロチップの製造方法を図８を参照して説明する。図８は本実施形態に係るマイクロチップ用カバーフィルムを用いたマイクロチップの製造のフローチャートの図である。 (Microchip manufacturing method)
Next, a microchip manufacturing method using the microchip cover film according to the present embodiment will be described with reference to FIG. FIG. 8 is a flowchart of manufacturing a microchip using the microchip cover film according to the present embodiment.
　ステップＳ１０１：図１（Ａ）及び図１（Ｂ）に示すような保護フィルム００２と接着した状態のカバーフィルム００１を、基板００４を接合する場所に供給する。 Step S101: A cover film 001 adhered to the protective film 002 as shown in FIGS. 1A and 1B is supplied to a place where the substrate 004 is bonded.
　ステップＳ１０２：図２に示すように、マイクロチップカバーフィルム（保護フィルム００２及び粘着層００３）からカバーフィルム００１を剥離する。 Step S102: As shown in FIG. 2, the cover film 001 is peeled from the microchip cover film (the protective film 002 and the adhesive layer 003).
　ステップＳ１０３：カバーフィルム１０１の剥離面（一面：ステップＳ１０１で保護フィルム００２と接着（接触）していた面）を基板００４の表面（微細流路溝００５が形成された面）を当接させ、かつ、ステップＳ１０１で粘着層００３と接触していなかった部分に基板００４に形成された微細流路溝００５の周辺部分とが含まれるように、カバーフィルム００１と基板００４とを配置し密着させる。 Step S103: The peeling surface of the cover film 101 (one surface: the surface that has been adhered (contacted) with the protective film 002 in Step S101) is brought into contact with the surface of the substrate 004 (the surface on which the fine channel groove 005 is formed), In addition, the cover film 001 and the substrate 004 are arranged and adhered so that the portion that is not in contact with the adhesive layer 003 in step S101 includes the peripheral portion of the fine channel groove 005 formed in the substrate 004.
　ステップＳ１０４：カバーフィルム００１と基板００４とを接着する方向にプレス圧をかけ、その状態で加熱を行う（熱プレス）。 Step S104: A pressing pressure is applied in the direction in which the cover film 001 and the substrate 004 are bonded, and heating is performed in this state (hot pressing).
　図１４は、本実施形態に係るマイクロチップ用カバーフィルムを用いて熱プレスを行う熱プレス装置の一例の図である。熱プレス定盤１０１と熱プレス定盤１０２とが図１４に示すように対向する位置に配置されている。そして、熱プレス定盤１０２の所定位置に、微細流路溝００５が表面に形成された基板００４（流路基板）を、微細流路溝００５が設けられた面（以下、「流路形成面」という。）を熱プレス定盤１０１に向けるようにして配置する。その後、流路形成面に保護フィルム００２から剥離されたカバーフィルム００１を配置し、流路形成面に向けてカバーフィルム００１全体を均一にプレスするのに十分な大きさを有するプレス面を備えた熱プレス定盤１０１をカバーフィルム００１方向（図１４に示す矢印Ｐの方向）に可動させ、カバーフィルム００１全体を流路形成面に対してプレスする。すなわち矢印Ｐがプレス方向となる。それとともに所定温度で熱プレス定盤１０１を加熱する事により、カバーフィルム００１を流路形成面に熱接合する。なお、ここでは熱プレス定盤１０２及び熱プレス定盤１０１は共に可動構成となっており、双方が上下する事でカバーフィルム００１と流路形成面とをプレスするが、一方が固定構成、他方が可動構成であっても良い。 FIG. 14 is a diagram of an example of a hot press apparatus that performs hot press using the microchip cover film according to the present embodiment. The hot press surface plate 101 and the hot press surface plate 102 are arranged at opposing positions as shown in FIG. Then, a substrate 004 (channel substrate) having a fine channel groove 005 formed on the surface thereof at a predetermined position of the hot press surface plate 102 is replaced with a surface provided with the micro channel groove 005 (hereinafter referred to as “channel formation surface”). ")" Is arranged so as to face the hot press surface plate 101. Thereafter, the cover film 001 peeled from the protective film 002 is disposed on the flow path forming surface, and a press surface having a size sufficient to uniformly press the entire cover film 001 toward the flow path forming surface is provided. The hot press surface plate 101 is moved in the direction of the cover film 001 (the direction of the arrow P shown in FIG. 14), and the entire cover film 001 is pressed against the flow path forming surface. That is, the arrow P is the pressing direction. At the same time, by heating the hot press surface plate 101 at a predetermined temperature, the cover film 001 is thermally bonded to the flow path forming surface. Here, the heat press surface plate 102 and the heat press surface plate 101 are both movable and press the cover film 001 and the flow path forming surface by moving both up and down. May be movable.
　以上に説明したように、本実施形態に係るマイクロチップ用カバーフィルムは、カバーフィルム、保護フィルム、及び粘着層の３層から作成され、粘着層はカバーフィルムの向かい合う一組の辺の周辺に配置されている。これにより、カバーフィルムを保護フィルムから剥離したときに、粘着層がカバーフィルムに残ったとしても、カバーフィルムの端部にのみ残るため、カバーフィルムを基板に接合する場合にも微細流路の付近には粘着層は残らず接合力の低下を軽減することが可能となる。また、カバーフィルムを基板に接合する直前までカバーフィルムの接合面が保護フィルムにより覆われているため、異物の挟み込みや傷の発生を軽減することが可能となる。 As described above, the microchip cover film according to the present embodiment is formed from three layers of a cover film, a protective film, and an adhesive layer, and the adhesive layer is arranged around a pair of sides facing the cover film. Has been. As a result, even when the cover film is peeled off from the protective film, even if the adhesive layer remains on the cover film, it remains only at the edge of the cover film. It is possible to reduce the decrease in bonding strength without leaving an adhesive layer. In addition, since the bonding surface of the cover film is covered with the protective film until just before the cover film is bonded to the substrate, it is possible to reduce the occurrence of foreign object pinching and scratches.
　また、本実施形態では、図５及び図６に示すように図に示されたシートに対して横方向に伸びる帯状の粘着層００３の領域を作製したが、基板００４に合わせて粘着層００３に対して型抜きの方向を調整することで接合時に微細流路溝００５の部分（微細流路を形成する領域）に、カバーフィルムの粘着層と接していた部分が当たらないようにできるため、これはどの方向に粘着層００３を形成してもよい。例えば、図９のように図に示されたシートの縦方向に伸びる帯状の粘着層００３の領域を作成してもよい。図９は粘着層００３の塗工パターンの他の例を説明するための図である。この場合にも、図９に示すように、粘着層００３の領域に挟まれる領域の中心線００８とマイクロチップ用カバーフィルムの型の四角形００９の向かい合う辺の中心線０１０とを一致させて型を抜けば、微視流路チップ用カバーフィルムが作成できる。 Further, in this embodiment, as shown in FIGS. 5 and 6, the band-shaped adhesive layer 003 extending in the lateral direction with respect to the sheet shown in FIG. 5 is produced, but the adhesive layer 003 is formed in accordance with the substrate 004. On the other hand, by adjusting the direction of punching, it is possible to prevent the portion of the fine channel groove 005 (region where the fine channel is formed) from coming into contact with the adhesive layer of the cover film at the time of joining. May form the adhesive layer 003 in any direction. For example, as shown in FIG. 9, a band-like adhesive layer 003 extending in the longitudinal direction of the sheet shown in the drawing may be created. FIG. 9 is a diagram for explaining another example of the coating pattern of the adhesive layer 003. Also in this case, as shown in FIG. 9, the center line 008 of the region sandwiched between the regions of the adhesive layer 003 and the center line 010 of the opposite side of the square 009 of the microchip cover film mold are matched to form the mold. If it falls out, a cover film for a microscopic channel chip can be created.
　（変形例）
　次に、本実施形態に係るマイクロチップ用カバーフィルムの変形例を説明する。この変形例に係るマイクロチップ用カバーフィルムは、図１０（Ａ）及び図１０（Ｂ）に示すように、粘着層００３がカバーフィルム００１の周囲を囲むように配置されている。ここで、図１０（Ａ）は本変形例に係るマイクロチップ用カバーフィルムの分解斜視図である。図１０（Ｂ）は本変形例に係るマイクロチップ用カバーフィルムの平面図である。 (Modification)
Next, a modification of the microchip cover film according to this embodiment will be described. As shown in FIGS. 10A and 10B, the microchip cover film according to this modified example is arranged so that the adhesive layer 003 surrounds the periphery of the cover film 001. Here, FIG. 10A is an exploded perspective view of the cover film for microchip according to this modification. FIG. 10B is a plan view of the microchip cover film according to this modification.
　本変形例に係るマイクロチップ用カバーフィルムにおける粘着層００３の形成方法は、保護フィルム００２のシートの上に図５と同様のマスクを施し粘着剤を塗布した後に、図９のシートを作るときと同様のマスクを施して粘着剤を再度塗布する。これにより、四角い領域を囲う粘着層００３を形成することができる。そして、その後に、向かい合う粘着層００３の領域に挟まれた領域の中心線と作成しようとするマイクロチップ用カバー部材の型の四角形の各辺の中心線が一致するように型を抜くことで、図１０（Ｂ）に示すようなマイクロチップ用カバーフィルムを製造することができる。ただし、粘着層００３の形成方法は他の方法でもよく、例えば、保護フィルム００２のシートの上に四角のマスクを施し、その上から粘着剤を塗布して粘着層００３を形成してもよい。 The method for forming the pressure-sensitive adhesive layer 003 in the microchip cover film according to the present modification is the same as that for forming the sheet of FIG. 9 after applying the same mask as in FIG. 5 on the protective film 002 sheet and applying the pressure-sensitive adhesive. A similar mask is applied and the adhesive is applied again. Thereby, the adhesive layer 003 surrounding the square region can be formed. Then, by removing the mold so that the center line of the region sandwiched between the regions of the adhesive layer 003 facing each other and the center line of each side of the quadrilateral of the mold for the microchip cover member to be created, A cover film for a microchip as shown in FIG. 10B can be manufactured. However, another method may be used for forming the adhesive layer 003. For example, the adhesive layer 003 may be formed by applying a square mask on a sheet of the protective film 002 and applying an adhesive thereon.
　以上で説明したように、本変形例に係るマイクロチップ用カバーフィルムは、カバーフィルムの外縁の全周の周辺に粘着層が形成され、該粘着層で保護フィルムと接着されている構成である。これにより、将来的にカバーフィルムの微細流路を形成する部分は粘着層及び保護フィルムで囲われることになり、より外部からの異物の挟み込みや傷の発生を軽減することが可能となる。 As described above, the cover film for a microchip according to this modification has a configuration in which an adhesive layer is formed around the entire periphery of the outer edge of the cover film and is adhered to the protective film with the adhesive layer. As a result, a portion of the cover film that will form a fine channel in the future will be surrounded by the adhesive layer and the protective film, and it becomes possible to further reduce the occurrence of foreign object pinching and scratches.
　ここで、本変形例では四角形のマイクロチップ用カバーフィルムで説明したが、これは他の形状でもよく、例えば円形の場合には円周の全周に粘着層を設ける構成となる。 Here, in this modified example, the rectangular microchip cover film has been described. However, other shapes may be used. For example, in the case of a circular shape, an adhesive layer is provided on the entire circumference.
　〔第２の実施形態〕
　以下、この発明の第２の実施形態に係るマイクロチップ用カバーフィルムについて説明する。本実施形態に係るマイクロチップ用カバーフィルムは、粘着層が微細流路溝の端部から所定間隔を隔てて配置されていることが第１の実施形態と異なるものである。図１１は本実施形態に係るマイクロチップ用カバーフィルムの平面図である。 [Second Embodiment]
Hereinafter, a microchip cover film according to a second embodiment of the present invention will be described. The microchip cover film according to the present embodiment is different from the first embodiment in that the adhesive layer is disposed at a predetermined interval from the end of the fine channel groove. FIG. 11 is a plan view of the microchip cover film according to the present embodiment.
　図１１のカバーフィルム００１におけるグレーの色で表わされる領域は粘着層００３が配置されている領域である。また、図１１の点線０１１は実際には存在しないが、基板００４とカバーフィルム００１とを接合した時に微細流路溝００５が位置する部分である。本実施形態では微細流路溝００５（言い換えれば、形成される微細流路）は１００μｍの流路幅であるとする。本実施形態に係るマイクロチップ用カバーフィルムは、点線０１１から１ｍｍ離れた位置から端部まで粘着層００３が配置されている。ここで、基板００４とカバーフィルム００１とを接合した時の微細流路溝００５の位置である点線０１１からの粘着層００３までの距離は、１ｍｍ以上であることがカバーフィルム００１と基板００４とが十分な接合力を得るには好ましい。さらに、０．８ｍｍ以上１．２ｍｍ以下であると位置決めの点で更に好ましい。 The region represented by the gray color in the cover film 001 in FIG. 11 is a region where the adhesive layer 003 is disposed. In addition, although the dotted line 011 in FIG. 11 does not actually exist, it is a portion where the fine channel groove 005 is located when the substrate 004 and the cover film 001 are joined. In the present embodiment, it is assumed that the fine channel groove 005 (in other words, the formed fine channel) has a channel width of 100 μm. In the microchip cover film according to this embodiment, an adhesive layer 003 is disposed from a position 1 mm away from the dotted line 011 to an end portion. Here, when the substrate 004 and the cover film 001 are joined, the distance from the dotted line 011 that is the position of the fine channel groove 005 to the adhesive layer 003 is 1 mm or more between the cover film 001 and the substrate 004. It is preferable for obtaining a sufficient bonding force. Furthermore, 0.8 mm or more and 1.2 mm or less is more preferable in terms of positioning.
　本実施形態に係るマイクロチップ用カバーフィルムは、図１１に示す白抜きの部分の形状を有するマスクを保護フィルム００２上に配置し、その上から粘着剤を塗布することで図１１に示す粘着層００３を形成する。ここで、図１１に示す白抜きの部分の形状のマスクは、例えば、設計図における微細流路溝００５を基に製造することができる。 The cover film for microchips according to the present embodiment has an adhesive layer shown in FIG. 11 by disposing a mask having the shape of the white portion shown in FIG. 11 on the protective film 002 and applying an adhesive from the mask. 003 is formed. Here, the mask in the shape of the white portion shown in FIG. 11 can be manufactured, for example, based on the fine channel groove 005 in the design drawing.
　カバーフィルム００１と基板００４との接合時において、カバーフィルム００１の微細流路溝００５から１ｍｍ以上の位置に粘着層００３が残っても安定した接合力を維持することが可能である。 When the cover film 001 and the substrate 004 are bonded, a stable bonding force can be maintained even if the adhesive layer 003 remains at a position of 1 mm or more from the fine channel groove 005 of the cover film 001.
　本実施形態では、搬送装置が０．２ｍｍ以内の位置決め精度を有するものとしている。そのため、上述の１ｍｍ以上の位置に粘着層００３と接していない領域を配置するには、流路幅が１００μｍの場合に接合しろが±１．２ｍｍ必要になる。そこで、流路幅から１ｍｍ以上離れた位置まで粘着層００３を設けたとしても、カバーフィルム００１の粘着層００３と接していない領域が必要とする接合しろの部分を含むのに十分な大きさを有する。そのため、本実施形態では、点線０１１から１ｍｍ離れた位置から粘着層００３を設けている。このように、実際には点線０１１からの距離は位置決め精度に依存するものであり、位置決め精度に基づいて点線０１１からの粘着層００３までの距離を決めることが好ましい。 In this embodiment, it is assumed that the conveying device has a positioning accuracy within 0.2 mm. Therefore, in order to arrange the region not in contact with the adhesive layer 003 at the above-described position of 1 mm or more, a joining margin of ± 1.2 mm is required when the flow path width is 100 μm. Therefore, even if the adhesive layer 003 is provided to a position that is 1 mm or more away from the flow path width, the area of the cover film 001 that is not in contact with the adhesive layer 003 has a sufficient size to include the necessary joint margin. Have. Therefore, in this embodiment, the adhesive layer 003 is provided from a position 1 mm away from the dotted line 011. As described above, the distance from the dotted line 011 actually depends on the positioning accuracy, and it is preferable to determine the distance from the dotted line 011 to the adhesive layer 003 based on the positioning accuracy.
　以上で説明したように、本実施形態に係るマイクロチップ用カバーフィルムは、基板とカバーフィルムとを接合した時の微細流路の位置から１ｍｍ以上の位置からカバーフィルムの端部までの領域に粘着層が配置されている。これにより、カバーフィルムと基板とを接合するときの接合力を維持しつつ、異物の挟み込みや傷の発生をより軽減することが可能となる。 As described above, the microchip cover film according to the present embodiment adheres to the region from the position of 1 mm or more to the end of the cover film from the position of the fine channel when the substrate and the cover film are joined. Layers are arranged. Accordingly, it is possible to further reduce the occurrence of foreign object pinching and scratches while maintaining the bonding force when bonding the cover film and the substrate.
　〔第３の実施形態〕
　以下、この発明の第３の実施形態に係るマイクロチップ用カバーフィルムについて説明する。本実施形態に係るマイクロチップ用カバーフィルムは、基板よりも大きいサイズであることが第１及び第２の実施形態に係るマイクロチップ用カバーフィルムと異なるものである。図１２は本実施形態に係るマイクロチップ用カバーフィルムを用いたマイクロチップの斜視図である。 [Third Embodiment]
The microchip cover film according to the third embodiment of the present invention will be described below. The microchip cover film according to the present embodiment is different from the microchip cover films according to the first and second embodiments in that the microchip cover film is larger in size than the substrate. FIG. 12 is a perspective view of a microchip using the microchip cover film according to the present embodiment.
　図１２に示す点線０１２で表わされる領域が粘着層００３とカバーフィルム００１が接していた領域である。すなわち、本実施形態に係るマイクロチップ用カバーフィルムは、カバーフィルム００１の基板００４と接合される部分以外の領域に粘着層００３が設けられている。 12 is an area where the adhesive layer 003 and the cover film 001 are in contact with each other. In other words, the microchip cover film according to the present embodiment is provided with the adhesive layer 003 in a region other than the portion of the cover film 001 that is bonded to the substrate 004.
　すなわち、本実施形態に係るマイクロチップ用カバーフィルムでは、カバーフィルムの剥離時に粘着層がカバーフィルム側に残っていても、カバーフィルムと基板との接合においてその粘着層の残りは影響を及ぼさない。これにより、カバーフィルムと基板との接合をより正確に行うことができる。 That is, in the microchip cover film according to this embodiment, even if the adhesive layer remains on the cover film side when the cover film is peeled off, the remainder of the adhesive layer does not affect the bonding between the cover film and the substrate. Thereby, joining of a cover film and a board | substrate can be performed more correctly.
　そして、このように、基板よりも大きいカバーフィルムを用いた場合、カバーフィルムを用いた基板の連続包装が可能となる。また、カバーフィルムの基板の外に出た部分の形状を変える（例えば、図１３（Ａ）のように切れ目を入れたり、穴をあけたりなど。）ことで搬送用、落下防止、位置決めなどに利用することが可能となる。ここで、図１３（Ａ）は、カバーフィルムの基板からはみ出た部分の形状を変化させた一例の図である。 In this way, when a cover film larger than the substrate is used, it is possible to continuously wrap the substrate using the cover film. Also, by changing the shape of the part of the cover film that has come out of the substrate (for example, making a cut or making a hole as shown in FIG. 13A), it can be used for conveyance, fall prevention, positioning, etc. It can be used. Here, FIG. 13A is a diagram of an example in which the shape of the portion of the cover film that protrudes from the substrate is changed.
　また、第１の実施形態のように基板と接合する部分に粘着層を設けた場合にも、図１３（Ｂ）に示すように基板からはみ出るように突出した部分を設けたような型でカバーフィルムの型を抜くことで位置決めなどに用いることができる。ここで、図１３（Ｂ）は、第１の実施形態に係るマイクロチップ用カバーフィルムの型を変形させた一例の図である。 Further, even when an adhesive layer is provided at a portion to be bonded to the substrate as in the first embodiment, the cover is provided with a mold in which a protruding portion is provided so as to protrude from the substrate as shown in FIG. It can be used for positioning by removing the film mold. Here, FIG. 13B is a diagram of an example in which the mold of the microchip cover film according to the first embodiment is deformed.
　００１　カバーフィルム
　００２　保護フィルム
　００３　粘着層
　００４　基板
　００５　微細流路溝 001 Cover film 002 Protective film 003 Adhesive layer 004 Substrate 005 Fine channel groove

Claims (17)

  1. 　表面に微細流路溝が形成された基板の該表面を覆うように一面が接合されることによって微細流路を形成するのに用いられるカバー部材と、
    　前記カバー部材の前記一面を保護するための保護フィルムと、
    　前記カバー部材と前記保護フィルムとの間に配置され、且つ少なくとも前記カバー部材の前記一面の相対する２つの辺に沿って間隔をもって略平行に配置された帯状の粘着層と、
    　を備え、
    　前記カバー部材と前記保護フィルムとが前記粘着層によって接着されており、前記カバー部材は、前記保護フィルム及び前記粘着層と剥離可能であることを特徴とするマイクロチップ用カバー部材。     A cover member used to form a fine flow path by bonding one surface so as to cover the surface of the substrate having a fine flow path groove formed on the surface;
    A protective film for protecting the one surface of the cover member;
    A strip-shaped adhesive layer disposed between the cover member and the protective film, and disposed substantially in parallel with an interval along at least two opposing sides of the one surface of the cover member;
    With
    The cover member for a microchip, wherein the cover member and the protective film are bonded by the adhesive layer, and the cover member is peelable from the protective film and the adhesive layer.
  2. 　前記カバー部材は、厚みが０．０５～０．２ｍｍのフィルムであることを特徴とする請求項１に記載のマイクロチップ用カバー部材。 2. The microchip cover member according to claim 1, wherein the cover member is a film having a thickness of 0.05 to 0.2 mm.
  3. 　前記カバー部材は略四角形であり、
    　前記粘着層は、前記カバー部材の少なくとも向かい合う一組の辺のそれぞれの周辺に配置されている、
    　ことを特徴とする請求項１又は請求項２に記載のマイクロチップ用カバー部材。     The cover member is substantially square,
    The adhesive layer is disposed around each of at least a pair of sides of the cover member,
    The microchip cover member according to claim 1, wherein the cover member is a microchip cover member.
  4. 　前記粘着層が、前記カバー部材を囲っていることを特徴とする請求項１乃至請求項３のいずれか一つに記載のマイクロチップ用カバー部材。 4. The microchip cover member according to claim 1, wherein the adhesive layer surrounds the cover member.
  5. 　前記粘着層は、前記微細流路を形成する領域から所定距離以上離れた領域に配置されることを特徴とする請求項１乃至請求項４のいずれか一つに記載のマイクロチップ用カバー部材。 The microchip cover member according to any one of claims 1 to 4, wherein the adhesive layer is disposed in a region separated by a predetermined distance or more from a region where the fine flow path is formed.
  6. 　前記カバー部材は前記基板と接合した際にはみ出す部分を備えており、
    　前記粘着層は、前記基板からはみ出す部分に配置されている、
    　ことを特徴とする請求項１乃至請求項５のいずれか一つに記載のマイクロチップ用カバー部材。     The cover member includes a portion that protrudes when bonded to the substrate,
    The adhesive layer is disposed in a portion protruding from the substrate,
    The microchip cover member according to claim 1, wherein the cover member is a microchip cover member.
  7. 　保護フィルムの上に間隔をあけて略平行に２つの帯状の粘着層を形成する粘着層形成段階と、
    　前記粘着層が形成された前記保護フィルムに前記２つの帯状の粘着層の間をまたぐようにカバー部材を接着する段階と、
    　前記カバー部材と前記保護フィルムとが重なっている部分であって、前記２つの帯状の粘着層が共に相対する一組の辺として含まれるように前記カバー部材側から前記保護フィルムもしくは前記保護フィルム側から前記カバー部材へと型抜きする型抜き段階と、
    　を有することを特徴とするマイクロチップ用カバー部材の製造方法。     A pressure-sensitive adhesive layer forming step of forming two strip-shaped pressure-sensitive adhesive layers substantially parallel to each other on the protective film;
    Adhering a cover member across the two strip-shaped adhesive layers to the protective film on which the adhesive layer is formed;
    The cover member and the protective film overlap each other, and the protective film or the protective film side from the cover member side so that the two band-like adhesive layers are included as a pair of opposing sides. A die cutting step for punching from the cover member to the cover member;
    The manufacturing method of the cover member for microchips characterized by having this.
  8. 　前記カバー部材は略四角形であり、
    　前記型抜き段階は、前記帯状の粘着層の間の距離を２等分する線が、前記四角形の向かい合う２辺の間隔を２等分する線に一致し、且つ前記２辺が前記粘着層に含まれるように型を抜く、ことを特徴とする請求項７に記載のマイクロチップ用カバー部材の製造方法。     The cover member is substantially square,
    In the die cutting step, a line that bisects the distance between the belt-like adhesive layers is coincident with a line that bisects an interval between two opposing sides of the square, and the two sides are in the adhesive layer. 8. The method of manufacturing a microchip cover member according to claim 7, wherein the mold is pulled out so as to be included.
  9. 　表面に微細流路溝が形成された基板の該表面を覆うように一面が接合されることによって微細流路を形成するのに用いられる略四角形のカバー部材と、前記カバー部材の前記一面を保護するための保護フィルムと、前記カバー部材と前記保護フィルムとの間に配置され、且つ前記カバー部材の前記一面の少なくとも向かい合う一組の辺のそれぞれに沿って略平行に配置された帯状の粘着層と、を備え、前記カバー部材と前記保護フィルムとが前記粘着層によって剥離可能に接着されているマイクロチップ用カバー部材から、前記カバー部材を剥離する剥離段階と、
    　前記カバー部材の前記一面を前記基板の前記表面に当接させ、且つ前記基板の微細流路溝が前記カバー部材の前記粘着層と接していなかった領域に含まれるように配置し密着させる配置段階と、
    　前記カバー部材と前記基板とを熱プレスして接合することで前記微細流路を形成する熱プレス段階と、
    　を有することを特徴とするマイクロチップの製造方法。     A substantially quadrangular cover member used to form a fine channel by bonding one surface so as to cover the surface of the substrate having a fine channel groove formed on the surface, and protecting the one surface of the cover member And a belt-like adhesive layer disposed between the cover member and the protective film, and disposed substantially in parallel along each of at least one pair of opposing sides of the one surface of the cover member. And a peeling step of peeling the cover member from the cover member for microchip in which the cover member and the protective film are detachably bonded by the adhesive layer,
    An arrangement step of bringing the one surface of the cover member into contact with the surface of the substrate, and arranging and closely contacting the fine flow path groove of the substrate so as to be included in a region not in contact with the adhesive layer of the cover member When,
    A hot pressing step of forming the fine flow path by hot pressing and bonding the cover member and the substrate;
    A method for producing a microchip, comprising:
  10. 　前記カバー部材は、厚みが０．０５～０．２ｍｍのフィルムであることを特徴とする請求項９に記載のマイクロチップの製造方法。 10. The method of manufacturing a microchip according to claim 9, wherein the cover member is a film having a thickness of 0.05 to 0.2 mm.
  11. 　基板表面に流路用溝が形成された流路基板と、
    　前記流路用溝が内側となるように前記基板表面に熱接合により接合されて前記流路用溝を覆うカバー部材を有するマイクロチップであって、
    　前記流路基板の基板表面と前記カバー部材との間であって、前記流路用溝が形成された領域端部から所定間隔を隔てて形成された粘着層を備えることを特徴とするマイクロチップ。     A channel substrate having a channel groove formed on the substrate surface;
    A microchip having a cover member that is bonded to the substrate surface by thermal bonding so that the flow path groove is inside and covers the flow path groove,
    A microchip comprising an adhesive layer formed between a substrate surface of the flow path substrate and the cover member and spaced from a region end portion where the flow path groove is formed. .
  12. 　前記カバー部材は、厚みが０．０５～０．２ｍｍのフィルムであることを特徴とする請求項１１に記載のマイクロチップ。 12. The microchip according to claim 11, wherein the cover member is a film having a thickness of 0.05 to 0.2 mm.
  13. 　前記カバー部材は前記流路基板と接合された基板表面からはみ出した部分を備え、前記粘着層は前記はみ出した部分に形成されていることを特徴とする請求項１１又は請求項１２に記載のマイクロチップ。 13. The micro of claim 11, wherein the cover member includes a portion protruding from a substrate surface joined to the flow path substrate, and the adhesive layer is formed in the protruding portion. Chip.
  14. 　表面に微細流路溝が形成された基板の該表面を覆うように一面が接合されることによって微細流路を形成するのに用いられるカバー部材と、
    　前記カバー部材の前記一面を保護するための保護フィルムと、
    　前記カバー部材と前記保護フィルムとの間に配置され、前記基板に前記カバー部材が接合される際の前記微細流路溝が形成された領域に対向する領域端部から所定間隔を隔てて形成された粘着層と、
    　を備え、
    　前記カバー部材と前記保護フィルムとが前記粘着層によって剥離可能に接着されている、ことを特徴とするマイクロチップ用カバー部材。     A cover member used to form a fine flow path by bonding one surface so as to cover the surface of the substrate having a fine flow path groove formed on the surface;
    A protective film for protecting the one surface of the cover member;
    It is disposed between the cover member and the protective film, and is formed at a predetermined interval from an end of a region facing the region where the fine channel groove is formed when the cover member is joined to the substrate. Adhesive layer,
    With
    The cover member for microchip, wherein the cover member and the protective film are detachably bonded by the adhesive layer.
  15. 　前記カバー部材は、厚みが０．０５～０．２ｍｍのフィルムであることを特徴とする請求項１４に記載のマイクロチップ用カバー部材。 15. The microchip cover member according to claim 14, wherein the cover member is a film having a thickness of 0.05 to 0.2 mm.
  16. 　前記粘着層は、前記微細流路溝が形成された域に対向する領域から１ｍｍ以上隔てて形成されていることを特徴とする請求項１４又は請求項１５に記載のマイクロチップ用カバー部材。 The microchip cover member according to claim 14 or 15, wherein the adhesive layer is formed 1 mm or more away from a region facing the region where the fine channel groove is formed.
  17. 　前記粘着層は、前記微細流路溝が形成された領域に対向する領域から０．８ｍｍ以上１．２ｍｍ以下の間隔を隔てて形成されていることを特徴とする請求項１４又は請求項１５に記載のマイクロチップ用カバー部材。 The adhesive layer is formed at an interval of 0.8 mm or more and 1.2 mm or less from a region facing the region where the fine channel groove is formed. The cover member for microchips as described.
PCT/JP2010/052724 2009-03-03 2010-02-23 Cover member for microchip, method for producing cover member for microchip, microchip, and method for manufacturing microchip WO2010101044A1 (en)

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