WO2009112704A8 - Dispositif d'inspection de plaquettes semi-conductrices - Google Patents
Dispositif d'inspection de plaquettes semi-conductrices Download PDFInfo
- Publication number
- WO2009112704A8 WO2009112704A8 PCT/FR2009/000115 FR2009000115W WO2009112704A8 WO 2009112704 A8 WO2009112704 A8 WO 2009112704A8 FR 2009000115 W FR2009000115 W FR 2009000115W WO 2009112704 A8 WO2009112704 A8 WO 2009112704A8
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- inspection
- semiconductor wafers
- wafer
- incident beams
- source
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
- G01N21/9503—Wafer edge inspection
Abstract
Dispositif d'inspection de plaquettes semi-conductrices (1) en mouvement, comprenant une source de lumière (4) d'au moins une plaquette supportée par un élément de transfert (2), et configurée pour émettre deux faisceaux incidents (5) vers une surface (la) de la plaquette (1), lesdits faisceaux incidents étant inclinés par rapport à la normale à ladite surface (la), et un module de détection (6) de franges d'interférence dans le faisceau réfléchi (7) par la surface (la) de la plaquette (1).
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0800597 | 2008-02-05 | ||
FR0800597A FR2927175B1 (fr) | 2008-02-05 | 2008-02-05 | Dispositif d'inspection de plaquettes semi-conductrices |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2009112704A1 WO2009112704A1 (fr) | 2009-09-17 |
WO2009112704A8 true WO2009112704A8 (fr) | 2010-01-28 |
Family
ID=39731249
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/FR2009/000115 WO2009112704A1 (fr) | 2008-02-05 | 2009-02-02 | Dispositif d'inspection de plaquettes semi-conductrices |
Country Status (3)
Country | Link |
---|---|
US (1) | US20090195786A1 (fr) |
FR (1) | FR2927175B1 (fr) |
WO (1) | WO2009112704A1 (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109073566A (zh) * | 2016-03-31 | 2018-12-21 | 统半导体公司 | 用于通过激光多普勒效应检测用于微电子或光学的板的方法和系统 |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI512865B (zh) * | 2008-09-08 | 2015-12-11 | Rudolph Technologies Inc | 晶圓邊緣檢查技術 |
FR2959864B1 (fr) | 2010-05-06 | 2013-01-18 | Altatech Semiconductor | Dispositif et procede d'inspection de plaquettes semi-conductrices en mouvement. |
US9658169B2 (en) | 2013-03-15 | 2017-05-23 | Rudolph Technologies, Inc. | System and method of characterizing micro-fabrication processes |
JP6295497B2 (ja) * | 2014-09-08 | 2018-03-20 | キリンテクノシステム株式会社 | 回転検出装置および該回転検出装置を備えた検査装置 |
FR3026485B1 (fr) * | 2014-09-29 | 2016-09-23 | Altatech Semiconductor | Procede et systeme d'inspection de plaquettes pour l'electronique, l'optique ou l'optoelectronique |
FR3026484B1 (fr) * | 2014-09-29 | 2018-06-15 | Altatech Semiconductor | Procede et systeme d'inspection de plaquettes transparentes pour l'electronique, l'optique ou l'optoelectronique |
WO2018152202A1 (fr) * | 2017-02-14 | 2018-08-23 | Massachusetts Institute Of Technology | Systèmes et procédés pour microscopie automatisée |
FR3076618B1 (fr) | 2018-01-05 | 2023-11-24 | Unity Semiconductor | Procede et systeme d'inspection optique d'un substrat |
FR3087011B1 (fr) | 2018-10-08 | 2022-12-30 | Unity Semiconductor | Dispositif d’inspection optique en champ sombre |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4030830A (en) * | 1976-01-05 | 1977-06-21 | Atlantic Research Corporation | Process and apparatus for sensing defects on a smooth surface |
US4644172A (en) * | 1984-02-22 | 1987-02-17 | Kla Instruments Corporation | Electronic control of an automatic wafer inspection system |
US4775877A (en) * | 1985-10-29 | 1988-10-04 | Canon Kabushiki Kaisha | Method and apparatus for processing a plate-like workpiece |
US4850693A (en) * | 1988-05-23 | 1989-07-25 | The United States Of America As Represented By The United States Department Of Energy | Compact portable diffraction moire interferometer |
US5124931A (en) * | 1988-10-14 | 1992-06-23 | Tokyo Electron Limited | Method of inspecting electric characteristics of wafers and apparatus therefor |
JPH04298060A (ja) * | 1991-03-26 | 1992-10-21 | Tokyo Electron Ltd | ウエハの位置合わせ装置 |
US5523839A (en) * | 1994-02-28 | 1996-06-04 | Minnesota Mining & Manufacturing | Differential optical interferometric profilomenty for real time manufacturing control |
FR2722290B1 (fr) * | 1994-07-07 | 1996-08-30 | Schneider Electric Sa | Dispositif optique de detection de caracteristiques de particules en mouvement |
US5548195A (en) * | 1994-12-22 | 1996-08-20 | International Business Machines Corporation | Compensated servo control stage positioning apparatus |
JP2877119B2 (ja) * | 1996-12-26 | 1999-03-31 | 日本電気株式会社 | 移動体の速度測定装置 |
JPH1154407A (ja) * | 1997-08-05 | 1999-02-26 | Nikon Corp | 位置合わせ方法 |
WO2002025708A2 (fr) * | 2000-09-20 | 2002-03-28 | Kla-Tencor-Inc. | Procedes et systemes destines a des processus de fabrication de semi-conducteurs |
EP1336094A2 (fr) * | 2000-11-13 | 2003-08-20 | Koninklijke Philips Electronics N.V. | Mesure de defauts de surface |
US20040227954A1 (en) * | 2003-05-16 | 2004-11-18 | Tong Xie | Interferometer based navigation device |
US7352444B1 (en) * | 2004-06-24 | 2008-04-01 | Cypress Semiconductor Corp. | Method for arranging and rotating a semiconductor wafer within a photolithography tool prior to exposing the wafer |
US20060256345A1 (en) * | 2005-05-12 | 2006-11-16 | Kla-Tencor Technologies Corp. | Interferometry measurement in disturbed environments |
US7433052B2 (en) * | 2005-07-07 | 2008-10-07 | Mitutoyo Corporation | Systems and methods for tilt and range measurement |
CN101563769B (zh) * | 2006-12-14 | 2012-07-18 | 凯思捷股份有限公司 | 圆板保持装置及缺陷异物检测装置 |
-
2008
- 2008-02-05 FR FR0800597A patent/FR2927175B1/fr active Active
- 2008-04-11 US US12/101,674 patent/US20090195786A1/en not_active Abandoned
-
2009
- 2009-02-02 WO PCT/FR2009/000115 patent/WO2009112704A1/fr active Application Filing
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109073566A (zh) * | 2016-03-31 | 2018-12-21 | 统半导体公司 | 用于通过激光多普勒效应检测用于微电子或光学的板的方法和系统 |
CN109073566B (zh) * | 2016-03-31 | 2022-07-19 | 统一半导体公司 | 用于通过激光多普勒效应检测用于微电子或光学的板的方法和系统 |
Also Published As
Publication number | Publication date |
---|---|
FR2927175B1 (fr) | 2011-02-18 |
FR2927175A1 (fr) | 2009-08-07 |
US20090195786A1 (en) | 2009-08-06 |
WO2009112704A1 (fr) | 2009-09-17 |
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