WO2009045747A1 - Method and material for purifying iron disilicide for photovoltaic application - Google Patents

Method and material for purifying iron disilicide for photovoltaic application Download PDF

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Publication number
WO2009045747A1
WO2009045747A1 PCT/US2008/076908 US2008076908W WO2009045747A1 WO 2009045747 A1 WO2009045747 A1 WO 2009045747A1 US 2008076908 W US2008076908 W US 2008076908W WO 2009045747 A1 WO2009045747 A1 WO 2009045747A1
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Prior art keywords
sample
iron disilicide
iron
disilicide
particle size
Prior art date
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PCT/US2008/076908
Other languages
French (fr)
Inventor
Frederic Victor Mikulec
Bing Shen Gao
Howard W. H. Lee
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Stion Corporation
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Application filed by Stion Corporation filed Critical Stion Corporation
Priority to CN200880001622.9A priority Critical patent/CN101578693B/en
Publication of WO2009045747A1 publication Critical patent/WO2009045747A1/en

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    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01BNON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00Silicon; Compounds thereof
    • C01B33/06Metal silicides
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/0248Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
    • H01L31/0256Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
    • H01L31/0264Inorganic materials
    • H01L31/032Inorganic materials including, apart from doping materials or other impurities, only compounds not provided for in groups H01L31/0272 - H01L31/0312

Definitions

  • the present invention relates generally to photovoltaic materials. More particularly, the present invention provides a method and structure for processing semiconductor materials used for the manufacture of photovoltaic devices. Merely by way of example, the present method and structure have been implemented using a commercial source of iron disilicide, but it would be recognized that the invention may have other configurations.
  • Petrochemical energy includes gas and oil.
  • Gas includes lighter forms such as butane and propane, commonly used to heat homes and serve as fuel for cooking.
  • Gas also includes gasoline, diesel, and jet fuel, commonly used for transportation purposes. Heavier forms of petrochemicals can also be used to heat homes in some places.
  • the supply of petrochemical fuel is limited and essentially fixed based upon the amount available on Earth. Additionally, as more people use petrochemicals in growing amounts, it is rapidly becoming a scarce resource, which will eventually be depleted over time.
  • hydroelectric power is derived from electric generators driven by the flow of water produced by dams such as the Hoover Dam in Nevada. The electric power generated is used to power a large portion of the city of Los Angeles in California. Clean and renewable sources of energy also include wind, waves, biomass, and the like. That is, windmills convert wind energy into more useful forms of energy such as electricity. Still other types of clean energy include solar energy. Specific details of solar energy can be found throughout the present background and more particularly below.
  • Solar energy technology generally converts electromagnetic radiation from the sun to other useful forms of energy. These other forms of energy include thermal energy and electrical power.
  • solar cells are often used. Although solar energy is environmentally clean and has been successful to a point, many limitations remain to be resolved before it becomes widely used throughout the world.
  • one type of solar cell uses crystalline materials, which arc derived from semiconductor material ingots. These crystalline materials can be used to fabricate optoelectronic devices that include photovoltaic and photodiodc devices that convert electromagnetic radiation into electrical power.
  • crystalline materials are often costly and difficult to make on a large scale. Additionally, devices made from such crystalline materials often have low energy conversion efficiencies.
  • a method and a system for forming semiconductor materials for photovoltaic applications is provided. More particularly, the present invention provides a method and structure for processing semiconductor materials used for the manufacture of photovoltaic devices. Merely by way of example, the method has been used to provide beta iron disilicide for photovoltaic application. But it would be recognized that the present invention has a much broader range of applicability.
  • the method includes providing a first sample of iron disilicide.
  • the first sample of iron disilicide comprises at least alpha iron disilicide, beta phase iron disilicide, and epsilon phase iron suicide and characterized by a first particle size.
  • the method includes maintaining the first sample of iron disilicide in an inert environment and subjecting the first sample of iron disilicide to an heating process while maintaining the first sample of iron disilicide in the inert environment to form a second sample of iron disilicide.
  • the second sample of iron disilicide comprises substantially beta phase iron disilicide (greater than about 90 percent).
  • the second iron disilicide is characterized by a second particle size.
  • the method forms a first mixture of material comprising the second sample of iron disilicide and an organic solvent.
  • the first mixture of material including the second sample of iron disilicide is subjected to a grinding process.
  • the method includes removing the organic solvent; and forms a third sample of iron disilicide comprising substantially beta iron disilicide.
  • the third sample of iron disilicide is characterized by a third particle size.
  • the method includes providing a first sample of an iron disilicide.
  • the first sample of iron disilicide comprises at least an alpha phase entity ranging from about 5% to about 20% of a total phase entity, a beta phase entity comprising about 30 % to about 75% of the phase entity, and an epsilon phase entity comprising about 5 % to about 20% of the total phase entity.
  • the method includes maintaining the first sample of iron disilicide in an inert environment, for example, nitrogen, helium, argon, or others.
  • the method subjects the first sample of iron disilicide to a thermal process while maintaining the first sample of iron disilicide in the inert environment to cause formation of a second sample of iron disilicide.
  • the second sample of iron disilicide comprises substantially beta phase iron disilicide and characterized by a first particle size ranging from about 1 to about 20 microns.
  • the method includes introducing an organic solvent to the second sample to form a first mixture of material comprising the second sample of iron disilicide and the organic solvent.
  • the method processes the first mixture of material including the second sample of iron disilicide using a grinding process to convert the second sample of iron disilicide having the first particle size to a third sample of iron disilicide having a second particle size.
  • the second particle size ranges from about 1 micron to about 2 microns.
  • the method then removes the organic solvent from the third sample of iron disilicide and outputting the third sample of iron disilicide characterized by the second particle size and greater than about 90% of the beta phase entity.
  • the present invention uses a commercial source of iron disilicide as a starting material to form substantially pure beta phase iron disilicide.
  • the substantially pure beta phase iron disilicide can be further processed to form iron disilicide of desired characteristics, such as particle size, bandgap, resistivity, carrier mobility, carrier density, and others.
  • the present method uses environmentally friendly materials that are non-toxic.
  • one or more of the benefits can be achieved.
  • Figure 1 is a simplified flow diagram illustrating a method of forming beta phase iron disilicide according to an embodiment of the present invention.
  • Figure 2-6 are simplified diagrams illustrating a method of forming beta phase iron disilicide according to an embodiment of the present invention.
  • FIG. 1 is a simplified flow diagram 100 illustrating a method for forming a sample of beta phase iron disilicide according to an embodiment of the present invention. The method may be summarized as follow:
  • Step 102 start; 2.
  • Step 104 provide a first sample of iron disilicide, comprises an alpha phase entity, a beta phase entity and an epsilon phase entity;
  • Step 106 subject at least the sample of iron disilicide to a thermal process
  • Step 108 convert the first sample of iron disilicide to a second sample of iron disilicide comprising substantially the beta phase entity (for example, greater than about 90 percent) characterized by a first particle size (about 20 mesh);
  • Step 110 mix the second sample of iron disilicide with a solvent
  • Step 116 form a third sample of iron disilicide comprising substantially beta phase iron disilicide characterized by a second particle size (about 1 micron to 2 microns);
  • Step 118 Stop.
  • FIG. 1 is a simplified diagram of a first sample of iron disilicide 202 according to an embodiment of the present invention.
  • the first sample of iron disilicide is commercially available, for example from sources such as Alfa-AESAR of Massachusetts, USA.
  • the first sample of iron disilicide comprises at least alpha phase iron disilicide, beta phase iron disilicide, and epsilon phase iron suicide.
  • the first sample of iron disilicide comprises about 5% to about 20% of the alpha phase entity, about 30 % to about 75% of the beta phase entity, and about 5 % to about 20% of the epsilon phase entity.
  • sources such as Alfa-AESAR of Massachusetts, USA.
  • the first sample of iron disilicide comprises at least alpha phase iron disilicide, beta phase iron disilicide, and epsilon phase iron suicide.
  • the first sample of iron disilicide comprises about 5% to about 20% of the alpha phase entity, about 30 % to about 75% of the beta phase entity, and about 5 % to about 20% of the epsilon phase entity.
  • a simplified diagram illustrating a method of forming a sample of beta phase iron disilicidc is shown.
  • the diagram is merely an example and should not unduly limit the claims herein.
  • One skilled in the art would recognize other variations, modifications, and alternatives.
  • a first sample of iron disilicide 304 is provided in a chamber 302.
  • the first sample of iron disilicide is maintained in an inert gas environment within the chamber.
  • the inert environment can be provided using, for example, nitrogen, argon, helium, and the like.
  • the first sample of iron disilicidc is subjected to a thermal process 306 while maintaining in the inert environment to form a second sample of iron disilicidc.
  • the thermal process is provided at a temperature ranging from about 700 Degree Celsius to about 800 Degree Celsius for a time period of about 16 hours to about 17 hours. In an alternative embodiment, the thermal process can be provided at a temperature ranging from about 800 Degree Celsius to about 850 Degree Celsius for a time period of about 16 hours to about 18 hours.
  • the thermal process converts the alpha phase iron disilicidc and the epsilon phase iron silicidc to the beta phase entity.
  • the second sample of iron disilicidc comprises substantially beta iron disilicide. In a specific embodiment, the second sample of iron disilicide comprises greater than about 90 percent of beta iron disilicide. In a specific embodiment, the second sample of iron disilicide is characterized by a particle size ranging from about 1 micron to about 20 microns. Of course there can be other variations, modifications, and alternatives.
  • the method includes allowing the second sample of iron disilicide to cool to about room temperature.
  • the cooled second sample of iron disilicide is mixed with a suitable organic solvent to form a first mixture of material 402 as shown in Figure 4.
  • organic solvent may include alkanes (such as octane), or alcohols (such as isopropyl alcohol) among others.
  • the first mixture of material including the second sample of iron disilicide, which comprises greater than 90 percent beta phase iron disilicide is subjected to a grinding process as shown in Figure 5.
  • the grinding process uses, for example, a ball milling technique in a preferred embodiment. Other grinding processes may also be used.
  • the ball milling technique uses using a plurality of spheres 502.
  • the plurality of spheres may be metal balls or ceramic balls depending on the application.
  • the plurality of spheres are ceramic balls made of zirconium dioxide.
  • Each of the plurality of spheres has a diameter of about 3 mm in a specific embodiment.
  • the first mixture of material, including the second sample of iron disilicide and the plurality of ceramic balls arc provided in a suitable vessel.
  • Example of such vessel may include zirconium dioxide coated stainless steel jar from Restsch, Haan, Germany.
  • the vessel containing the first mixture of material and a plurality of zirconium dioxide balls is loaded into a rotating planetary ball mill, provided also by Restsch, Haan, Germany.
  • milling time ranges from about 15 hours to about 30 hours.
  • the jar may develop an internal pressure that may be reduced by stopping the ball mill, resting the system for about 1 hour, then continuing the milling process.
  • This embodiment uses a stainless steel jar coated with zirconium dioxide (Retsch) as the mixing vessel.
  • the jar is filled with about 50 grams of 3 mm diameter zirconium dioxide balls, 20 grams of the second sample of iron disilicide, and 15 grams of a suitable solvent such as octane.
  • the jar is then loaded into a rotating planetary ball mill (Retsch) and milled for about 15 to 30 hours at a speed of 400 to 600 rpm.
  • the jar may develop an internal pressure that may be reduced by stopping the ball mill, resting the system for about 1 hour, then continuing the milling process.
  • the method removes the organic solvent in the first mixture of material using a drying process 602 and forms a third sample of iron disilicide 604.
  • the drying process can include a vacuum process or a heating process, or a combination to evaporate the organic solvent from the first mixture of material.
  • the third sample of iron disilicide comprises at least 95 percent of beta iron phase disilicide.
  • a substantially uniform particle size 606 of about 1 micron to about 2 micron characterizes the third sample of iron disilicide.
  • the third sample of iron disilicide has a desired semiconductor characteristic with a bandgap ranging from 0.8 eV to 0.9 cV.

Abstract

A method for processing iron disilicide for manufacture photovoltaic devices. The method includes providing a first sample of iron disilicide comprising at least an alpha phase entity, a beta phase entity, and an epsilon phase entity. The method includes maintaining the first sample of iron disilicide in an inert environment and subjects the first sample of iron disilicide to a thermal process to form a second sample of iron disilicide. The second sample of iron disilicide comprises substantially beta phase iron disilicide and is characterized by a first particle size. The method includes introducing an organic solvent to the second sample of iron disilicide, forming a first mixture of material comprising the second sample of iron disilicide and the organic solvent. The method processed the first mixture of material including the second sample of iron disilicide using a grinding process. The method converted the second sample of iron disilicide having the first particle size to a third sample of iron disilicide having a second particle size. The organic solvent is removed and output a third sample of iron disilicide characterized by the second particle size and greater than about 90% of the beta phase entity.

Description

METHOD AND MATERIAL FOR PURIFYING IRON DISILICIDE FOR PHOTOVOLTAIC APPLICATION
CROSS-REFERENCES TO RELATED APPLICATIONS [0001] This application claims priority to U.S. Provisional Patent Application No. 60/976,239, filed September 28, 2007, entitled "METHOD AND MATERIAL FOR PURIFYING IRON DiSILlCIDE FOR PHOTOVOLTAIC APPLICATION" by inventor FREDERTC VICTOR MIKULEC et al, commonly assigned and incorporated by reference herein for all purposes.
STATEMENT AS TO RIGHTS TO INVENTIONS MADE UNDER FEDERALLY SPONSORED RESEARCH AND DEVELOPMENT
[0002] NOT APPLICABLE
REFERENCE TO A "SEQUENCE LISTING," A TABLE, OR A COMPUTER
PROGRAM LISTING APPENDIX SUBMITTED ON A COMPACT DISK. [0003] NOT APPLICABLE
BACKGROUND OF THE TNVENTTON
[0004] The present invention relates generally to photovoltaic materials. More particularly, the present invention provides a method and structure for processing semiconductor materials used for the manufacture of photovoltaic devices. Merely by way of example, the present method and structure have been implemented using a commercial source of iron disilicide, but it would be recognized that the invention may have other configurations.
[0005] From the beginning of time, mankind has been challenged to find ways of harnessing energy. Energy comes in the forms such as petrochemical, hydroelectric, nuclear, wind, biomass, solar, and more primitive forms such as wood and coal. Over the past century, modern civilization has relied upon petrochemical energy as an important energy source. Petrochemical energy includes gas and oil. Gas includes lighter forms such as butane and propane, commonly used to heat homes and serve as fuel for cooking. Gas also includes gasoline, diesel, and jet fuel, commonly used for transportation purposes. Heavier forms of petrochemicals can also be used to heat homes in some places. Unfortunately, the supply of petrochemical fuel is limited and essentially fixed based upon the amount available on Earth. Additionally, as more people use petrochemicals in growing amounts, it is rapidly becoming a scarce resource, which will eventually be depleted over time.
[0006] More recently, environmentally clean and renewable sources of energy have been desired. An example of a clean source of energy is hydroelectric power. Hydroelectric power is derived from electric generators driven by the flow of water produced by dams such as the Hoover Dam in Nevada. The electric power generated is used to power a large portion of the city of Los Angeles in California. Clean and renewable sources of energy also include wind, waves, biomass, and the like. That is, windmills convert wind energy into more useful forms of energy such as electricity. Still other types of clean energy include solar energy. Specific details of solar energy can be found throughout the present background and more particularly below.
[0007] Solar energy technology generally converts electromagnetic radiation from the sun to other useful forms of energy. These other forms of energy include thermal energy and electrical power. For electrical power applications, solar cells are often used. Although solar energy is environmentally clean and has been successful to a point, many limitations remain to be resolved before it becomes widely used throughout the world. As an example, one type of solar cell uses crystalline materials, which arc derived from semiconductor material ingots. These crystalline materials can be used to fabricate optoelectronic devices that include photovoltaic and photodiodc devices that convert electromagnetic radiation into electrical power. However, crystalline materials are often costly and difficult to make on a large scale. Additionally, devices made from such crystalline materials often have low energy conversion efficiencies. Other types of solar cells use "thin film" technology to form a thin film of photosensitive material to be used to convert electromagnetic radiation into electrical power. Similar limitations exist with the use of thin film technology in making solar cells. That is, efficiencies are often poor. Additionally, film reliability is often poor and cannot be used for extensive periods of time in conventional environmental applications. Often, thin films are difficult to mechanically integrate with each other. These and other limitations of these conventional technologies can be found throughout the present specification and more particularly below.
[0008] From the above, it is seen that improved techniques for manufacturing photovoltaic materials and resulting devices are desired. BRIEF SUMMARY OF THE INVENTION
[0009] According to embodiments of the present invention, a method and a system for forming semiconductor materials for photovoltaic applications is provided. More particularly, the present invention provides a method and structure for processing semiconductor materials used for the manufacture of photovoltaic devices. Merely by way of example, the method has been used to provide beta iron disilicide for photovoltaic application. But it would be recognized that the present invention has a much broader range of applicability.
[0010] In a specific embodiment, the method includes providing a first sample of iron disilicide. The first sample of iron disilicide comprises at least alpha iron disilicide, beta phase iron disilicide, and epsilon phase iron suicide and characterized by a first particle size. The method includes maintaining the first sample of iron disilicide in an inert environment and subjecting the first sample of iron disilicide to an heating process while maintaining the first sample of iron disilicide in the inert environment to form a second sample of iron disilicide. The second sample of iron disilicide comprises substantially beta phase iron disilicide (greater than about 90 percent). The second iron disilicide is characterized by a second particle size. The method forms a first mixture of material comprising the second sample of iron disilicide and an organic solvent. In a specific embodiment, the first mixture of material including the second sample of iron disilicide is subjected to a grinding process. The method includes removing the organic solvent; and forms a third sample of iron disilicide comprising substantially beta iron disilicide. The third sample of iron disilicide is characterized by a third particle size.
[0011] Tn a specific embodiment, the method includes providing a first sample of an iron disilicide. The first sample of iron disilicide comprises at least an alpha phase entity ranging from about 5% to about 20% of a total phase entity, a beta phase entity comprising about 30 % to about 75% of the phase entity, and an epsilon phase entity comprising about 5 % to about 20% of the total phase entity. The method includes maintaining the first sample of iron disilicide in an inert environment, for example, nitrogen, helium, argon, or others. The method subjects the first sample of iron disilicide to a thermal process while maintaining the first sample of iron disilicide in the inert environment to cause formation of a second sample of iron disilicide. The second sample of iron disilicide comprises substantially beta phase iron disilicide and characterized by a first particle size ranging from about 1 to about 20 microns. The method includes introducing an organic solvent to the second sample to form a first mixture of material comprising the second sample of iron disilicide and the organic solvent. In a specific embodiment, the method processes the first mixture of material including the second sample of iron disilicide using a grinding process to convert the second sample of iron disilicide having the first particle size to a third sample of iron disilicide having a second particle size. In a specific embodiment, the second particle size ranges from about 1 micron to about 2 microns. The method then removes the organic solvent from the third sample of iron disilicide and outputting the third sample of iron disilicide characterized by the second particle size and greater than about 90% of the beta phase entity.
[0012] Many benefits are achieved by ways of present invention. For example, the present invention uses a commercial source of iron disilicide as a starting material to form substantially pure beta phase iron disilicide. The substantially pure beta phase iron disilicide can be further processed to form iron disilicide of desired characteristics, such as particle size, bandgap, resistivity, carrier mobility, carrier density, and others. Additionally, the present method uses environmentally friendly materials that are non-toxic. Depending on the embodiment, one or more of the benefits can be achieved. These and other benefits will be described in more detailed throughout the present specification and particularly below.
BRIEF DESCRIPTION OF THE DRAWINGS
[0013] Figure 1 is a simplified flow diagram illustrating a method of forming beta phase iron disilicide according to an embodiment of the present invention. [0014] Figure 2-6 are simplified diagrams illustrating a method of forming beta phase iron disilicide according to an embodiment of the present invention.
DETAILED DESCRIPTION OF THE INVENTION
[0015] According to embodiments of the present invention, a method and a system for forming semiconductor materials for photovoltaic applications is provided. More particularly, the present invention provides a method and structure for processing semiconductor materials used for the manufacture of photovoltaic devices. Merely by way of example, the method has been used to provide beta iron disilicide for photovoltaic application. But it would be recognized that the present invention has a much broader range of applicability. f0016| Figure 1 is a simplified flow diagram 100 illustrating a method for forming a sample of beta phase iron disilicide according to an embodiment of the present invention. The method may be summarized as follow:
1. Step 102, start; 2. Step 104, provide a first sample of iron disilicide, comprises an alpha phase entity, a beta phase entity and an epsilon phase entity;
3. Step 106, subject at least the sample of iron disilicide to a thermal process;
4. Step 108, convert the first sample of iron disilicide to a second sample of iron disilicide comprising substantially the beta phase entity (for example, greater than about 90 percent) characterized by a first particle size (about 20 mesh);
5. Step 110, mix the second sample of iron disilicide with a solvent;
6. Step 112, grind;
7. Step 1 14, dry;
8. Step 116, form a third sample of iron disilicide comprising substantially beta phase iron disilicide characterized by a second particle size (about 1 micron to 2 microns);
9. Step 118, Stop.
[0017] The above sequence of steps provides a method of forming a sample of iron disilicide comprising substantially beta phase iron disilicide according to an embodiment of the present invention. As shown the method uses a combination of steps, including a thermal process to convert the alpha phase and the epsilon phase iron disilicide into beta phase iron disilicide. Further, the method uses a grinding process to form the sample of iron disilicide comprising substantially beta phase iron disilicide of desired particle size. Merely by way of example, the present method has been used in fabricating photovoltaic devices. But it should be recognized that the present invention has a much broader range of applicability. [0018] Figure 2 is a simplified diagram of a first sample of iron disilicide 202 according to an embodiment of the present invention. The first sample of iron disilicide is commercially available, for example from sources such as Alfa-AESAR of Massachusetts, USA. The first sample of iron disilicide comprises at least alpha phase iron disilicide, beta phase iron disilicide, and epsilon phase iron suicide. The first sample of iron disilicide comprises about 5% to about 20% of the alpha phase entity, about 30 % to about 75% of the beta phase entity, and about 5 % to about 20% of the epsilon phase entity. Of course there can be other variations, modifications, and alternatives.
[0019] Referring to Figure 3, a simplified diagram illustrating a method of forming a sample of beta phase iron disilicidc is shown. The diagram is merely an example and should not unduly limit the claims herein. One skilled in the art would recognize other variations, modifications, and alternatives. As shown, a first sample of iron disilicide 304 is provided in a chamber 302. In a specific embodiment, the first sample of iron disilicide is maintained in an inert gas environment within the chamber. The inert environment can be provided using, for example, nitrogen, argon, helium, and the like. As shown, the first sample of iron disilicidc is subjected to a thermal process 306 while maintaining in the inert environment to form a second sample of iron disilicidc. In a specific embodiment, the thermal process is provided at a temperature ranging from about 700 Degree Celsius to about 800 Degree Celsius for a time period of about 16 hours to about 17 hours. In an alternative embodiment, the thermal process can be provided at a temperature ranging from about 800 Degree Celsius to about 850 Degree Celsius for a time period of about 16 hours to about 18 hours. The thermal process converts the alpha phase iron disilicidc and the epsilon phase iron silicidc to the beta phase entity. The second sample of iron disilicidc comprises substantially beta iron disilicide. In a specific embodiment, the second sample of iron disilicide comprises greater than about 90 percent of beta iron disilicide. In a specific embodiment, the second sample of iron disilicide is characterized by a particle size ranging from about 1 micron to about 20 microns. Of course there can be other variations, modifications, and alternatives.
[00201 The method includes allowing the second sample of iron disilicide to cool to about room temperature. In a specific embodiment, the cooled second sample of iron disilicide is mixed with a suitable organic solvent to form a first mixture of material 402 as shown in Figure 4. Such organic solvent may include alkanes (such as octane), or alcohols (such as isopropyl alcohol) among others. In a specific embodiment, the first mixture of material including the second sample of iron disilicide, which comprises greater than 90 percent beta phase iron disilicide, is subjected to a grinding process as shown in Figure 5. The grinding process uses, for example, a ball milling technique in a preferred embodiment. Other grinding processes may also be used. In a specific embodiment, the ball milling technique uses using a plurality of spheres 502. The plurality of spheres may be metal balls or ceramic balls depending on the application. In a specific embodiment, the plurality of spheres are ceramic balls made of zirconium dioxide. Each of the plurality of spheres has a diameter of about 3 mm in a specific embodiment. The first mixture of material, including the second sample of iron disilicide and the plurality of ceramic balls arc provided in a suitable vessel. Example of such vessel may include zirconium dioxide coated stainless steel jar from Restsch, Haan, Germany. In a specific embodiment, the vessel containing the first mixture of material and a plurality of zirconium dioxide balls is loaded into a rotating planetary ball mill, provided also by Restsch, Haan, Germany. Depending on the embodiment, milling time ranges from about 15 hours to about 30 hours. Additionally, depending upon the solvent and other conditions, the jar may develop an internal pressure that may be reduced by stopping the ball mill, resting the system for about 1 hour, then continuing the milling process. Of course there can be other modifications, variations, and alternatives. This embodiment uses a stainless steel jar coated with zirconium dioxide (Retsch) as the mixing vessel. The jar is filled with about 50 grams of 3 mm diameter zirconium dioxide balls, 20 grams of the second sample of iron disilicide, and 15 grams of a suitable solvent such as octane. The jar is then loaded into a rotating planetary ball mill (Retsch) and milled for about 15 to 30 hours at a speed of 400 to 600 rpm. Depending upon the solvent and other conditions, the jar may develop an internal pressure that may be reduced by stopping the ball mill, resting the system for about 1 hour, then continuing the milling process.
[0021] As shown in Figure 6, the method removes the organic solvent in the first mixture of material using a drying process 602 and forms a third sample of iron disilicide 604. The drying process can include a vacuum process or a heating process, or a combination to evaporate the organic solvent from the first mixture of material. In a specific embodiment, the third sample of iron disilicide comprises at least 95 percent of beta iron phase disilicide. A substantially uniform particle size 606 of about 1 micron to about 2 micron characterizes the third sample of iron disilicide. In a specific embodiment, the third sample of iron disilicide has a desired semiconductor characteristic with a bandgap ranging from 0.8 eV to 0.9 cV. Of course there can be other variations, modifications, and alternatives.
[0022] It is also understood that the examples and embodiments described herein are for illustrative purposes only and that various modifications or changes in light thereof will be suggested to persons skilled in the art and are to be included within the spirit and purview of this application and scope of the appended claims.

Claims

WHAT IS CLATMED IS:
1. A method for processing iron disilicide for manufacture of photovoltaic devices, the method comprising: providing a first sample of an iron disilicide comprising at least an alpha phase entity ranging from about 5% to about 20% of a total phase entity, a beta phase entity comprising about 30 % to about 75% of the phase entity, and an epsilon phase entity comprising about 5 % to about 20% of the total phase entity; maintaining the first sample of iron disilicide in an inert environment; subjecting the first sample of iron disilicide to a thermal process while maintaining the first sample of iron disilicide in the inert environment to cause formation of a second sample of iron disilicide comprising substantially beta phase iron disilicide, the second iron disilicide being characterized by a first particle size ranging from about 1 micron to about 20 microns; introducing an organic solvent to the second sample to form a first mixture of material comprising the second sample of iron disilicide and the organic solvent; processing the first mixture of material including the second sample of iron disilicide using a grinding process to convert the second sample of iron disilicide having the first particle size to a third sample of iron disilicide having a second particle size ranging from about 1 micron to about 2 microns; removing the organic solvent from the third sample of iron disilicide in the organic solvent; and outputting the third sample of iron disilicide characterized by the second particle size and greater than about 90% of the beta phase entity.
2. The method of claim 1 wherein the first iron disilicide is from a commercial source.
3. The method of claim 1 wherein the first particle size ranges from about 15 mesh to about 25 mesh.
4 The method of claim 1 wherein the first sample of iron disilicide comprises greater than about 75 percent beta phase iron disilicide.
5. The method of claim 1 wherein the inert environment is provided by nitrogen, argon, helium, and others.
6. The method of claim 1 wherein the thermal process is provided at a temperature ranging from about 800 Degree Celsius to about 850 Degree Celsius for about 16 hours to about 17 hours.
7. The method of claim 1 wherein the thermal process is provided at a temperature ranging from about 700 Degree Celsius to about 800 Degree Celsius for about 16 hours to about 18 hours.
8. The method of claim 1 wherein the organic solvent is selected from: isopropyl alcohol (IPA), octane, and others.
9. The method of claim 1 wherein the second sample of iron disilicidc comprises greater than about 95 percent beta phase iron disilicide.
10. The method of claim 1 wherein the second particle size is about 20 mesh.
1 1. The method of claim 1 wherein the grinding process is a ball milling process..
12. The method of claim 11 wherein the ball milling process comprises: providing a plurality of ceramic balls having a diameter ranging from about 2.5 mm to about 3.5 mm; providing the mixture of material and the plurality of ceramic balls in a milling vessel; and milling the mixture of material using a rotating planetary ball mill.
13. The method of claim 1 wherein the third sample of iron disilicide comprises at least 90 percent of beta phase iron disilicide.
14. The method of claim 1 wherein the second particle size is about 2 micron and less.
15. The method of claim 1 wherein the second particle size ranges from about 1 micron to about 2 micron.
16. The method of claim 1 wherein the third sample of iron disilicide is characterized by a bandgap ranging from about 0.8 eV to about 0.9 cV.
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Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8294025B2 (en) * 2002-06-08 2012-10-23 Solarity, Llc Lateral collection photovoltaics
WO2009003150A2 (en) * 2007-06-26 2008-12-31 Solarity, Inc. Lateral collection photovoltaics
JP5687606B2 (en) * 2011-11-14 2015-03-18 トヨタ自動車株式会社 Solar-heat conversion member, solar-heat conversion device, and solar power generation device

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4589918A (en) * 1984-03-28 1986-05-20 National Research Institute For Metals Thermal shock resistant thermoelectric material
US5029760A (en) * 1989-10-26 1991-07-09 Gamblin Rodger L Centrifugal grinding and mixing apparatus
US5069868A (en) * 1988-03-30 1991-12-03 Idemitsu Petrolchemical Co., Ltd. Method for producing thermoelectric elements
US20040203220A1 (en) * 2003-01-16 2004-10-14 Tdk Corporation Method of making iron silicide and method of making photoelectric transducer
US20040244826A1 (en) * 2002-06-19 2004-12-09 Jfe Steel Corporation Beta-iron disilicate thermoelectric transducing material and thermoelectric transducer
US20060002838A1 (en) * 2002-09-11 2006-01-05 Nikko Materials Co., Ltd. Iron silicide powder and method for production thereof
US20060053969A1 (en) * 2002-11-28 2006-03-16 Takashi Harada Thermoelectric material and method for producing same

Family Cites Families (112)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4335266A (en) * 1980-12-31 1982-06-15 The Boeing Company Methods for forming thin-film heterojunction solar cells from I-III-VI.sub.2
US4441113A (en) * 1981-02-13 1984-04-03 Energy Conversion Devices, Inc. P-Type semiconductor material having a wide band gap
US4465575A (en) * 1981-09-21 1984-08-14 Atlantic Richfield Company Method for forming photovoltaic cells employing multinary semiconductor films
DE3314197A1 (en) 1982-04-28 1983-11-03 Energy Conversion Devices, Inc., 48084 Troy, Mich. P-CONDUCTING AMORPHOUS SILICON ALLOY WITH A LARGE BAND GAP AND MANUFACTURING PROCESS THEREFOR
US4461922A (en) * 1983-02-14 1984-07-24 Atlantic Richfield Company Solar cell module
US4471155A (en) * 1983-04-15 1984-09-11 Energy Conversion Devices, Inc. Narrow band gap photovoltaic devices with enhanced open circuit voltage
US4517403A (en) * 1983-05-16 1985-05-14 Atlantic Richfield Company Series connected solar cells and method of formation
US4724011A (en) * 1983-05-16 1988-02-09 Atlantic Richfield Company Solar cell interconnection by discrete conductive regions
US4532372A (en) * 1983-12-23 1985-07-30 Energy Conversion Devices, Inc. Barrier layer for photovoltaic devices
US4598306A (en) * 1983-07-28 1986-07-01 Energy Conversion Devices, Inc. Barrier layer for photovoltaic devices
US4499658A (en) * 1983-09-06 1985-02-19 Atlantic Richfield Company Solar cell laminates
US4589194A (en) * 1983-12-29 1986-05-20 Atlantic Richfield Company Ultrasonic scribing of thin film solar cells
US4542255A (en) * 1984-01-03 1985-09-17 Atlantic Richfield Company Gridded thin film solar cell
US4581108A (en) * 1984-01-06 1986-04-08 Atlantic Richfield Company Process of forming a compound semiconductive material
US4661370A (en) * 1984-02-08 1987-04-28 Atlantic Richfield Company Electric discharge processing of thin films
US4507181A (en) * 1984-02-17 1985-03-26 Energy Conversion Devices, Inc. Method of electro-coating a semiconductor device
US4611091A (en) * 1984-12-06 1986-09-09 Atlantic Richfield Company CuInSe2 thin film solar cell with thin CdS and transparent window layer
US4599154A (en) * 1985-03-15 1986-07-08 Atlantic Richfield Company Electrically enhanced liquid jet processing
US4663495A (en) * 1985-06-04 1987-05-05 Atlantic Richfield Company Transparent photovoltaic module
JPH0682625B2 (en) * 1985-06-04 1994-10-19 シーメンス ソーラー インダストリーズ,エル.ピー. Deposition method of zinc oxide film
US4638111A (en) * 1985-06-04 1987-01-20 Atlantic Richfield Company Thin film solar cell module
US4623601A (en) * 1985-06-04 1986-11-18 Atlantic Richfield Company Photoconductive device containing zinc oxide transparent conductive layer
US4798660A (en) * 1985-07-16 1989-01-17 Atlantic Richfield Company Method for forming Cu In Se2 films
US4625070A (en) * 1985-08-30 1986-11-25 Atlantic Richfield Company Laminated thin film solar module
US4989794A (en) * 1986-07-16 1991-02-05 Alcan International Limited Method of producing fine particles
US4914042A (en) * 1986-09-30 1990-04-03 Colorado State University Research Foundation Forming a transition metal silicide radiation detector and source
US4775425A (en) * 1987-07-27 1988-10-04 Energy Conversion Devices, Inc. P and n-type microcrystalline semiconductor alloy material including band gap widening elements, devices utilizing same
US4816082A (en) * 1987-08-19 1989-03-28 Energy Conversion Devices, Inc. Thin film solar cell including a spatially modulated intrinsic layer
US5045409A (en) * 1987-11-27 1991-09-03 Atlantic Richfield Company Process for making thin film solar cell
US5008062A (en) * 1988-01-20 1991-04-16 Siemens Solar Industries, L.P. Method of fabricating photovoltaic module
US4915745A (en) * 1988-09-22 1990-04-10 Atlantic Richfield Company Thin film solar cell and method of making
US5180686A (en) * 1988-10-31 1993-01-19 Energy Conversion Devices, Inc. Method for continuously deposting a transparent oxide material by chemical pyrolysis
US4996108A (en) * 1989-01-17 1991-02-26 Simon Fraser University Sheets of transition metal dichalcogenides
US4950615A (en) * 1989-02-06 1990-08-21 International Solar Electric Technology, Inc. Method and making group IIB metal - telluride films and solar cells
FR2646560B1 (en) * 1989-04-27 1994-01-14 Solems Sa METHOD FOR IMPROVING THE SPECTRAL RESPONSE OF AN IMPROVED PHOTOCONDUCTOR STRUCTURE, SOLAR CELL AND PHOTORECEPTIVE STRUCTURE
US5028274A (en) * 1989-06-07 1991-07-02 International Solar Electric Technology, Inc. Group I-III-VI2 semiconductor films for solar cell application
US5078803A (en) * 1989-09-22 1992-01-07 Siemens Solar Industries L.P. Solar cells incorporating transparent electrodes comprising hazy zinc oxide
JPH03124067A (en) * 1989-10-07 1991-05-27 Showa Shell Sekiyu Kk Photovoltaic device and its manufacture
DK170189B1 (en) * 1990-05-30 1995-06-06 Yakov Safir Process for the manufacture of semiconductor components, as well as solar cells made therefrom
EP0460287A1 (en) * 1990-05-31 1991-12-11 Siemens Aktiengesellschaft Novel chalcopyrite solar cell
EP0468094B1 (en) * 1990-07-24 1995-10-11 Siemens Aktiengesellschaft Process for producing a chalcopyrite solar cell
JP2729239B2 (en) * 1990-10-17 1998-03-18 昭和シェル石油株式会社 Integrated photovoltaic device
US5211824A (en) * 1991-10-31 1993-05-18 Siemens Solar Industries L.P. Method and apparatus for sputtering of a liquid
US5231047A (en) * 1991-12-19 1993-07-27 Energy Conversion Devices, Inc. High quality photovoltaic semiconductor material and laser ablation method of fabrication same
US5501744A (en) * 1992-01-13 1996-03-26 Photon Energy, Inc. Photovoltaic cell having a p-type polycrystalline layer with large crystals
US5261968A (en) * 1992-01-13 1993-11-16 Photon Energy, Inc. Photovoltaic cell and method
JPH05243596A (en) * 1992-03-02 1993-09-21 Showa Shell Sekiyu Kk Manufacture of laminated type solar cell
EP0630524A1 (en) * 1992-03-19 1994-12-28 SIEMENS SOLAR GmbH Weather-resistant thin layer solar module
US5248349A (en) * 1992-05-12 1993-09-28 Solar Cells, Inc. Process for making photovoltaic devices and resultant product
US5298086A (en) * 1992-05-15 1994-03-29 United Solar Systems Corporation Method for the manufacture of improved efficiency tandem photovoltaic device and device manufactured thereby
WO1994000869A1 (en) * 1992-06-29 1994-01-06 United Solar Systems Corporation Microwave energized deposition process with substrate temperature control
EP0662247B1 (en) * 1992-09-22 1999-03-10 Siemens Aktiengesellschaft Process for rapidly generating a chalkopyrite semiconductor on a substrate
US5474939A (en) 1992-12-30 1995-12-12 Siemens Solar Industries International Method of making thin film heterojunction solar cell
JP3424180B2 (en) * 1993-02-23 2003-07-07 独立行政法人物質・材料研究機構 P-type thermoelectric material
JP3348924B2 (en) * 1993-08-04 2002-11-20 株式会社テクノバ Thermoelectric semiconductor materials
DE4333407C1 (en) * 1993-09-30 1994-11-17 Siemens Ag Solar cell comprising a chalcopyrite absorber layer
US5977476A (en) 1996-10-16 1999-11-02 United Solar Systems Corporation High efficiency photovoltaic device
GB2318680B (en) * 1996-10-24 2001-11-07 Univ Surrey Optoelectronic semiconductor devices
JP3249407B2 (en) 1996-10-25 2002-01-21 昭和シェル石油株式会社 Thin-film solar cells composed of chalcopyrite-based multi-compound semiconductor thin-film light-absorbing layers
JP3249408B2 (en) * 1996-10-25 2002-01-21 昭和シェル石油株式会社 Method and apparatus for manufacturing thin film light absorbing layer of thin film solar cell
JP3527815B2 (en) * 1996-11-08 2004-05-17 昭和シェル石油株式会社 Method for producing transparent conductive film of thin film solar cell
US5985691A (en) 1997-05-16 1999-11-16 International Solar Electric Technology, Inc. Method of making compound semiconductor films and making related electronic devices
JPH1154773A (en) 1997-08-01 1999-02-26 Canon Inc Photovoltaic element and its manufacture
US6127202A (en) * 1998-07-02 2000-10-03 International Solar Electronic Technology, Inc. Oxide-based method of making compound semiconductor films and making related electronic devices
JP3667178B2 (en) 1998-11-24 2005-07-06 キヤノン株式会社 Method for producing zinc oxide thin film, method for producing photovoltaic element using the same, and photovoltaic element
JP2000173969A (en) 1998-12-03 2000-06-23 Canon Inc Rinsing method and photovoltaic element
US6328871B1 (en) 1999-08-16 2001-12-11 Applied Materials, Inc. Barrier layer for electroplating processes
EP1261990A1 (en) 2000-02-07 2002-12-04 CIS Solartechnik Gmbh Flexible metal substrate for cis solar cells, and method for producing the same
US7194197B1 (en) * 2000-03-16 2007-03-20 Global Solar Energy, Inc. Nozzle-based, vapor-phase, plume delivery structure for use in production of thin-film deposition layer
US6310281B1 (en) * 2000-03-16 2001-10-30 Global Solar Energy, Inc. Thin-film, flexible photovoltaic module
US6372538B1 (en) * 2000-03-16 2002-04-16 University Of Delaware Fabrication of thin-film, flexible photovoltaic module
US6576112B2 (en) * 2000-09-19 2003-06-10 Canon Kabushiki Kaisha Method of forming zinc oxide film and process for producing photovoltaic device using it
JP2002167695A (en) 2000-09-19 2002-06-11 Canon Inc Method for depositing zinc oxide film and method for producing photovolatic element using the film
DE10104726A1 (en) * 2001-02-02 2002-08-08 Siemens Solar Gmbh Process for structuring an oxide layer applied to a carrier material
US6858308B2 (en) * 2001-03-12 2005-02-22 Canon Kabushiki Kaisha Semiconductor element, and method of forming silicon-based film
JP4827303B2 (en) 2001-03-12 2011-11-30 キヤノン株式会社 Photovoltaic element, TFT, and method for forming i-type semiconductor layer
JP2002299670A (en) 2001-04-03 2002-10-11 Canon Inc Silicon-based thin film and photovoltaic element
JP4143324B2 (en) * 2002-04-25 2008-09-03 キヤノン株式会社 LIGHT EMITTING ELEMENT, OPTICAL ELECTRONIC INTEGRATED DEVICE, ELECTRIC DEVICE, AND OPTICAL TRANSMISSION SYSTEM
US6690041B2 (en) * 2002-05-14 2004-02-10 Global Solar Energy, Inc. Monolithically integrated diodes in thin-film photovoltaic devices
US6852920B2 (en) * 2002-06-22 2005-02-08 Nanosolar, Inc. Nano-architected/assembled solar electricity cell
WO2004023527A2 (en) * 2002-09-05 2004-03-18 Nanosys, Inc. Nanostructure and nanocomposite based compositions and photovoltaic devices
CN100584921C (en) * 2002-09-05 2010-01-27 奈米系统股份有限公司 Organic species that facilitate charge transfer to or from nanostructures
US7279832B2 (en) 2003-04-01 2007-10-09 Innovalight, Inc. Phosphor materials and illumination devices made therefrom
US20040252488A1 (en) 2003-04-01 2004-12-16 Innovalight Light-emitting ceiling tile
CN1771610A (en) * 2003-04-09 2006-05-10 松下电器产业株式会社 Solar cell
JP2004332043A (en) 2003-05-07 2004-11-25 Canon Inc Method and apparatus for forming zinc oxide thin film and method for forming photovoltaic element
EP1521308A1 (en) * 2003-10-02 2005-04-06 Scheuten Glasgroep Ball or grain-shaped semiconductor element to be used in solar cells and method of production; method of production of a solar cell with said semiconductor element and solar cell
JP2005135993A (en) * 2003-10-28 2005-05-26 National Institute Of Advanced Industrial & Technology Photosensor
US20070169810A1 (en) * 2004-02-19 2007-07-26 Nanosolar, Inc. High-throughput printing of semiconductor precursor layer by use of chalcogen-containing vapor
WO2005081324A1 (en) * 2004-02-20 2005-09-01 Sharp Kabushiki Kaisha Substrate for photoelectric converter, photoelectric converter, and multilayer photoelectric converter
JP2005311292A (en) 2004-03-25 2005-11-04 Kaneka Corp Substrate for thin film solar cell, manufacturing method therefor, and thin film solar cell using the same
US7501315B2 (en) 2004-06-08 2009-03-10 Nanosys, Inc. Methods and devices for forming nanostructure monolayers and devices including such monolayers
WO2006009881A2 (en) * 2004-06-18 2006-01-26 Innovalight, Inc. Process and apparatus for forming nanoparticles using radiofrequency plasmas
JP2006049768A (en) 2004-08-09 2006-02-16 Showa Shell Sekiyu Kk Cis compound semiconductor thin film solar battery and manufacturing method for light absorbing layer of solar battery
US7750352B2 (en) * 2004-08-10 2010-07-06 Pinion Technologies, Inc. Light strips for lighting and backlighting applications
US20060219547A1 (en) * 2004-11-10 2006-10-05 Daystar Technologies, Inc. Vertical production of photovoltaic devices
US20060096536A1 (en) * 2004-11-10 2006-05-11 Daystar Technologies, Inc. Pressure control system in a photovoltaic substrate deposition apparatus
CA2586961A1 (en) * 2004-11-10 2006-05-18 Daystar Technologies, Inc. Thermal process for creation of an in-situ junction layer in cigs
CN101410547A (en) * 2004-11-10 2009-04-15 德斯塔尔科技公司 Pallet based system for forming thin-film solar cells
WO2006053127A2 (en) * 2004-11-10 2006-05-18 Daystar Technologies, Inc. Process and photovoltaic device using an akali-containing layer
JP2006179626A (en) * 2004-12-22 2006-07-06 Showa Shell Sekiyu Kk Cis system thin film solar cell module, and its manufacturing method and separation method
JP2006186200A (en) 2004-12-28 2006-07-13 Showa Shell Sekiyu Kk Precursor film and film formation method therefor
JP2006183117A (en) * 2004-12-28 2006-07-13 Showa Shell Sekiyu Kk METHOD FOR PRODUCING ZnO-BASED TRANSPARENT ELECTROCONDUCTIVE FILM BY USING MOCVD (ORGANO-METAL CHEMICAL VAPOR DEPOSITION) PROCESS
JP4131965B2 (en) * 2004-12-28 2008-08-13 昭和シェル石油株式会社 Method for producing light absorption layer of CIS thin film solar cell
US7442413B2 (en) * 2005-11-18 2008-10-28 Daystar Technologies, Inc. Methods and apparatus for treating a work piece with a vaporous element
DE102005062977B3 (en) 2005-12-28 2007-09-13 Sulfurcell Solartechnik Gmbh Method and apparatus for converting metallic precursor layers to chalcopyrite layers of CIGSS solar cells
US8017860B2 (en) * 2006-05-15 2011-09-13 Stion Corporation Method and structure for thin film photovoltaic materials using bulk semiconductor materials
TW200810167A (en) * 2006-08-09 2008-02-16 Ind Tech Res Inst Dye-sensitized solar cell and the method of fabricating thereof
DE102006041046A1 (en) 2006-09-01 2008-03-06 Cis Solartechnik Gmbh & Co. Kg Solar cell, process for the production of solar cells and electrical trace
US8426722B2 (en) * 2006-10-24 2013-04-23 Zetta Research and Development LLC—AQT Series Semiconductor grain and oxide layer for photovoltaic cells
US7855089B2 (en) 2008-09-10 2010-12-21 Stion Corporation Application specific solar cell and method for manufacture using thin film photovoltaic materials
US7863074B2 (en) * 2008-09-30 2011-01-04 Stion Corporation Patterning electrode materials free from berm structures for thin film photovoltaic cells

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4589918A (en) * 1984-03-28 1986-05-20 National Research Institute For Metals Thermal shock resistant thermoelectric material
US5069868A (en) * 1988-03-30 1991-12-03 Idemitsu Petrolchemical Co., Ltd. Method for producing thermoelectric elements
US5029760A (en) * 1989-10-26 1991-07-09 Gamblin Rodger L Centrifugal grinding and mixing apparatus
US20040244826A1 (en) * 2002-06-19 2004-12-09 Jfe Steel Corporation Beta-iron disilicate thermoelectric transducing material and thermoelectric transducer
US20060002838A1 (en) * 2002-09-11 2006-01-05 Nikko Materials Co., Ltd. Iron silicide powder and method for production thereof
US20060053969A1 (en) * 2002-11-28 2006-03-16 Takashi Harada Thermoelectric material and method for producing same
US20040203220A1 (en) * 2003-01-16 2004-10-14 Tdk Corporation Method of making iron silicide and method of making photoelectric transducer

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