WO2009020801A3 - Mems device and interconnects for same - Google Patents

Mems device and interconnects for same Download PDF

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Publication number
WO2009020801A3
WO2009020801A3 PCT/US2008/071498 US2008071498W WO2009020801A3 WO 2009020801 A3 WO2009020801 A3 WO 2009020801A3 US 2008071498 W US2008071498 W US 2008071498W WO 2009020801 A3 WO2009020801 A3 WO 2009020801A3
Authority
WO
WIPO (PCT)
Prior art keywords
array
upper electrode
region
interconnect
interconnects
Prior art date
Application number
PCT/US2008/071498
Other languages
French (fr)
Other versions
WO2009020801A2 (en
Inventor
Teruo Sasagawa
Original Assignee
Qualcomm Mems Technologies Inc
Teruo Sasagawa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qualcomm Mems Technologies Inc, Teruo Sasagawa filed Critical Qualcomm Mems Technologies Inc
Priority to JP2010520136A priority Critical patent/JP2010535641A/en
Priority to CN200880101957A priority patent/CN101772467A/en
Publication of WO2009020801A2 publication Critical patent/WO2009020801A2/en
Publication of WO2009020801A3 publication Critical patent/WO2009020801A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0006—Interconnects
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/04—Optical MEMS
    • B81B2201/047—Optical MEMS not provided for in B81B2201/042 - B81B2201/045

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
  • Micromachines (AREA)

Abstract

A microelectromechanical systems (MEMS) device includes a substrate (20), an array region (ARRAY), and a peripheral region (INTERCONNECT). The array region (ARRAY) includes a lower electrode (16A, 16B), a movable upper electrode (14), and a cavity (19) between the lower electrode (16A, 16B) and the upper electrode (14). The peripheral region (INTERCONNECT) includes a portion of a layer forming the upper electrode (14) in the array region (ARRAY) and an electrical interconnect (58). The electrical interconnect (58) includes a conductive material (50) electrically connected to at least one of the lower electrode (16A, 16B) and the upper electrode (14). The electrical interconnect (58) is formed of a layer separate from and below the layer forming the upper electrode (14) in the array region (ARRAY). The conductive material (50) is selected from the group consisting of nickel, chromium, copper, and silver.
PCT/US2008/071498 2007-08-07 2008-07-29 Mems device and interconnects for same WO2009020801A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2010520136A JP2010535641A (en) 2007-08-07 2008-07-29 MEMS device and wiring thereof
CN200880101957A CN101772467A (en) 2007-08-07 2008-07-29 Mems device and interconnects for same

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US11/835,308 US7570415B2 (en) 2007-08-07 2007-08-07 MEMS device and interconnects for same
US11/835,308 2007-08-07
EP08153326A EP2022752A3 (en) 2007-08-07 2008-03-26 MEMS device and interconnects for same
EP08153326.7 2008-03-26

Publications (2)

Publication Number Publication Date
WO2009020801A2 WO2009020801A2 (en) 2009-02-12
WO2009020801A3 true WO2009020801A3 (en) 2009-07-09

Family

ID=40032789

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2008/071498 WO2009020801A2 (en) 2007-08-07 2008-07-29 Mems device and interconnects for same

Country Status (7)

Country Link
US (1) US7570415B2 (en)
EP (1) EP2022752A3 (en)
JP (1) JP2010535641A (en)
KR (1) KR20100053606A (en)
CN (1) CN101772467A (en)
TW (1) TWI390643B (en)
WO (1) WO2009020801A2 (en)

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US9213181B2 (en) * 2011-05-20 2015-12-15 Pixtronix, Inc. MEMS anchor and spacer structure
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US10131534B2 (en) * 2011-10-20 2018-11-20 Snaptrack, Inc. Stacked vias for vertical integration
US9128289B2 (en) * 2012-12-28 2015-09-08 Pixtronix, Inc. Display apparatus incorporating high-aspect ratio electrical interconnects
US9904386B2 (en) 2014-01-23 2018-02-27 3M Innovative Properties Company Method for patterning a microstructure
US9857930B2 (en) * 2015-12-16 2018-01-02 3M Innovative Properties Company Transparent conductive component with interconnect circuit tab comprising cured organic polymeric material
TWI699330B (en) * 2018-01-30 2020-07-21 大陸商蘇州明皜傳感科技有限公司 Mems device and manufacturing method thereof
CN111434605B (en) * 2019-01-15 2023-08-29 台湾积体电路制造股份有限公司 Control method and test method for micro-electromechanical system device

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Also Published As

Publication number Publication date
KR20100053606A (en) 2010-05-20
TW200915456A (en) 2009-04-01
EP2022752A3 (en) 2009-06-17
JP2010535641A (en) 2010-11-25
US20090040590A1 (en) 2009-02-12
US7570415B2 (en) 2009-08-04
WO2009020801A2 (en) 2009-02-12
TWI390643B (en) 2013-03-21
EP2022752A2 (en) 2009-02-11
CN101772467A (en) 2010-07-07

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