WO2008133515A3 - Fabrication of planar electronic circuit devices - Google Patents

Fabrication of planar electronic circuit devices Download PDF

Info

Publication number
WO2008133515A3
WO2008133515A3 PCT/NL2008/050255 NL2008050255W WO2008133515A3 WO 2008133515 A3 WO2008133515 A3 WO 2008133515A3 NL 2008050255 W NL2008050255 W NL 2008050255W WO 2008133515 A3 WO2008133515 A3 WO 2008133515A3
Authority
WO
WIPO (PCT)
Prior art keywords
electronic circuit
fabrication
circuit devices
planar electronic
depositing
Prior art date
Application number
PCT/NL2008/050255
Other languages
French (fr)
Other versions
WO2008133515A2 (en
Inventor
Alec Reader
Aerle Nicolaas Aldegonda Jan Maria Van
Tobias Balla
Original Assignee
Polymer Vision Ltd
Alec Reader
Aerle Nicolaas Aldegonda Jan Maria Van
Tobias Balla
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Polymer Vision Ltd, Alec Reader, Aerle Nicolaas Aldegonda Jan Maria Van, Tobias Balla filed Critical Polymer Vision Ltd
Publication of WO2008133515A2 publication Critical patent/WO2008133515A2/en
Publication of WO2008133515A3 publication Critical patent/WO2008133515A3/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60—Forming conductive regions or layers, e.g. electrodes
    • H10K71/611—Forming conductive regions or layers, e.g. electrodes using printing deposition, e.g. ink jet printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having a potential-jump barrier or a surface barrier
    • H10K10/40—Organic transistors
    • H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
    • H10K10/462—Insulated gate field-effect transistors [IGFETs]
    • H10K10/468—Insulated gate field-effect transistors [IGFETs] characterised by the gate dielectrics
    • H10K10/471—Insulated gate field-effect transistors [IGFETs] characterised by the gate dielectrics the gate dielectric comprising only organic materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/621—Providing a shape to conductive layers, e.g. patterning or selective deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/821—Patterning of a layer by embossing, e.g. stamping to form trenches in an insulating layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Thin Film Transistor (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

A method is provided of fabricating a multilayer planar electronic circuit device on a substrate comprising the steps providing a patterned layer of a first conducting material, depositing a layer of a first insulating material and providing a patterned layer of a second conducting material. The method enables the fabrication of complex electronic circuit devices by depositing core material layers and forming the required conducting structures using an imprinting technique. High tolerances are possible at fast processing speed, while keeping processing material costs low.
PCT/NL2008/050255 2007-04-25 2008-04-25 Fabrication of planar electronic circuit devices WO2008133515A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB0708032A GB2448730A (en) 2007-04-25 2007-04-25 Fabrication of Planar Electronic Circuit Devices
GB0708032.8 2007-04-25

Publications (2)

Publication Number Publication Date
WO2008133515A2 WO2008133515A2 (en) 2008-11-06
WO2008133515A3 true WO2008133515A3 (en) 2009-01-15

Family

ID=38170682

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/NL2008/050255 WO2008133515A2 (en) 2007-04-25 2008-04-25 Fabrication of planar electronic circuit devices

Country Status (2)

Country Link
GB (1) GB2448730A (en)
WO (1) WO2008133515A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11894208B2 (en) 2020-11-15 2024-02-06 Elve Inc. Multi-layer vacuum electron device and method of manufacture

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0966182A1 (en) * 1998-06-17 1999-12-22 Lg Electronics Inc. Method of fabricating organic electroluminescent display panel
US20030060038A1 (en) * 1999-12-21 2003-03-27 Plastic Logic Limited Forming interconnects
US20030223138A1 (en) * 2002-04-24 2003-12-04 Yoshikazu Akiyama Thin film apparatus, a manufacturing method of the thin film apparatus, an active matrix substrate, a manufacturing method of the active matrix substrate, and an electro-optical apparatus having the active matrix substrate
US20040013982A1 (en) * 1999-09-14 2004-01-22 Massachusetts Institute Of Technology Fabrication of finely featured devices by liquid embossing
WO2004111729A1 (en) * 2003-06-19 2004-12-23 Avantone Oy A method and an apparatus for manufacturing an electronic thin-film component and an electronic thin-film component
EP1541524A2 (en) * 2003-12-11 2005-06-15 Xerox Corporation Nanoparticle deposition process
US6930818B1 (en) * 2000-03-03 2005-08-16 Sipix Imaging, Inc. Electrophoretic display and novel process for its manufacture
WO2006064859A1 (en) * 2004-12-14 2006-06-22 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US20060160276A1 (en) * 2002-12-14 2006-07-20 Brown Thomas M Electronic devices
US20060208266A1 (en) * 2005-03-16 2006-09-21 Seiko Epson Corporation Method for manufacturing an organic semiconductor device, as well as organic semiconductor device, electronic device, and electronic apparatus

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996008047A2 (en) * 1994-09-06 1996-03-14 Philips Electronics N.V. Electroluminescent device comprising a transparent structured electrode layer made from a conductive polymer
US20020031602A1 (en) * 2000-06-20 2002-03-14 Chi Zhang Thermal treatment of solution-processed organic electroactive layer in organic electronic device
US7098060B2 (en) * 2002-09-06 2006-08-29 E.I. Du Pont De Nemours And Company Methods for producing full-color organic electroluminescent devices

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0966182A1 (en) * 1998-06-17 1999-12-22 Lg Electronics Inc. Method of fabricating organic electroluminescent display panel
US20040013982A1 (en) * 1999-09-14 2004-01-22 Massachusetts Institute Of Technology Fabrication of finely featured devices by liquid embossing
US20030060038A1 (en) * 1999-12-21 2003-03-27 Plastic Logic Limited Forming interconnects
US6930818B1 (en) * 2000-03-03 2005-08-16 Sipix Imaging, Inc. Electrophoretic display and novel process for its manufacture
US20030223138A1 (en) * 2002-04-24 2003-12-04 Yoshikazu Akiyama Thin film apparatus, a manufacturing method of the thin film apparatus, an active matrix substrate, a manufacturing method of the active matrix substrate, and an electro-optical apparatus having the active matrix substrate
US20060160276A1 (en) * 2002-12-14 2006-07-20 Brown Thomas M Electronic devices
WO2004111729A1 (en) * 2003-06-19 2004-12-23 Avantone Oy A method and an apparatus for manufacturing an electronic thin-film component and an electronic thin-film component
EP1541524A2 (en) * 2003-12-11 2005-06-15 Xerox Corporation Nanoparticle deposition process
WO2006064859A1 (en) * 2004-12-14 2006-06-22 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US20060208266A1 (en) * 2005-03-16 2006-09-21 Seiko Epson Corporation Method for manufacturing an organic semiconductor device, as well as organic semiconductor device, electronic device, and electronic apparatus

Also Published As

Publication number Publication date
GB2448730A (en) 2008-10-29
GB0708032D0 (en) 2007-06-06
WO2008133515A2 (en) 2008-11-06

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