WO2008127923A3 - Heat-resistant structural epoxy resins - Google Patents

Heat-resistant structural epoxy resins Download PDF

Info

Publication number
WO2008127923A3
WO2008127923A3 PCT/US2008/059696 US2008059696W WO2008127923A3 WO 2008127923 A3 WO2008127923 A3 WO 2008127923A3 US 2008059696 W US2008059696 W US 2008059696W WO 2008127923 A3 WO2008127923 A3 WO 2008127923A3
Authority
WO
WIPO (PCT)
Prior art keywords
heat
epoxy resins
resistant structural
structural epoxy
bisphenol
Prior art date
Application number
PCT/US2008/059696
Other languages
French (fr)
Other versions
WO2008127923A2 (en
Inventor
Glenn G Eagle
Andreas Lutz
Original Assignee
Dow Global Technologies Inc
Glenn G Eagle
Andreas Lutz
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Global Technologies Inc, Glenn G Eagle, Andreas Lutz filed Critical Dow Global Technologies Inc
Priority to EP08745329A priority Critical patent/EP2137277B1/en
Priority to BRPI0809752A priority patent/BRPI0809752B1/en
Priority to JP2010503168A priority patent/JP5390505B2/en
Priority to AT08745329T priority patent/ATE510897T1/en
Priority to CN2008800199253A priority patent/CN101679828B/en
Publication of WO2008127923A2 publication Critical patent/WO2008127923A2/en
Publication of WO2008127923A3 publication Critical patent/WO2008127923A3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/066—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with chain extension or advancing agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

Epoxy adhesive compositions containing a rubber-modified epoxy resin contain a bisphenol. The bisphenol can be pre-reacted with the rubber-modified epoxy resin to advance the resin. The adhesives are resistant to thermal degradation as can occur in so-called 'overbake' conditions, in which the adhesive is heated to high temperatures for prolonged periods of time. In addition, expanded microballoons are included in epoxy structural adhesives to promote a desired fracture mode.
PCT/US2008/059696 2007-04-11 2008-04-09 Heat-resistant structural epoxy resins WO2008127923A2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
EP08745329A EP2137277B1 (en) 2007-04-11 2008-04-09 Heat-resistant structural epoxy resins
BRPI0809752A BRPI0809752B1 (en) 2007-04-11 2008-04-09 "one component structural adhesive and method"
JP2010503168A JP5390505B2 (en) 2007-04-11 2008-04-09 Heat-resistant structural epoxy resin
AT08745329T ATE510897T1 (en) 2007-04-11 2008-04-09 HEAT RESISTANT STRUCTURAL EPOXY RESINS
CN2008800199253A CN101679828B (en) 2007-04-11 2008-04-09 Heat-resistant structural epoxy resins

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US92287707P 2007-04-11 2007-04-11
US60/922,877 2007-04-11

Publications (2)

Publication Number Publication Date
WO2008127923A2 WO2008127923A2 (en) 2008-10-23
WO2008127923A3 true WO2008127923A3 (en) 2009-04-23

Family

ID=39639648

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2008/059696 WO2008127923A2 (en) 2007-04-11 2008-04-09 Heat-resistant structural epoxy resins

Country Status (8)

Country Link
US (2) US8097119B2 (en)
EP (1) EP2137277B1 (en)
JP (1) JP5390505B2 (en)
KR (1) KR101467602B1 (en)
CN (1) CN101679828B (en)
AT (1) ATE510897T1 (en)
BR (1) BRPI0809752B1 (en)
WO (1) WO2008127923A2 (en)

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KR101727345B1 (en) 2009-09-11 2017-04-14 쓰리엠 이노베이티브 프로퍼티즈 컴파니 Curable and cured adhesive compositions
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Also Published As

Publication number Publication date
KR101467602B1 (en) 2014-12-01
JP5390505B2 (en) 2014-01-15
ATE510897T1 (en) 2011-06-15
EP2137277A2 (en) 2009-12-30
WO2008127923A2 (en) 2008-10-23
CN101679828B (en) 2012-07-25
US20080251202A1 (en) 2008-10-16
BRPI0809752A2 (en) 2014-09-30
US20120103517A1 (en) 2012-05-03
US8097119B2 (en) 2012-01-17
US8585861B2 (en) 2013-11-19
BRPI0809752B1 (en) 2017-05-16
KR20100016407A (en) 2010-02-12
EP2137277B1 (en) 2011-05-25
JP2010523800A (en) 2010-07-15
CN101679828A (en) 2010-03-24

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