WO2008094838A3 - Apparatus and methods for electrochemical processing of wafers - Google Patents

Apparatus and methods for electrochemical processing of wafers Download PDF

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Publication number
WO2008094838A3
WO2008094838A3 PCT/US2008/052104 US2008052104W WO2008094838A3 WO 2008094838 A3 WO2008094838 A3 WO 2008094838A3 US 2008052104 W US2008052104 W US 2008052104W WO 2008094838 A3 WO2008094838 A3 WO 2008094838A3
Authority
WO
WIPO (PCT)
Prior art keywords
wafer
agitator
support
processing
wafers
Prior art date
Application number
PCT/US2008/052104
Other languages
French (fr)
Other versions
WO2008094838A2 (en
Inventor
Daniel J Woodruff
David P Mattson
Paul R Mchugh
Gregory J Wilson
James J Erickson
Original Assignee
Semitool Inc
Daniel J Woodruff
David P Mattson
Paul R Mchugh
Gregory J Wilson
James J Erickson
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/700,263 external-priority patent/US20080178460A1/en
Priority claimed from US11/699,762 external-priority patent/US20080181758A1/en
Priority claimed from US11/699,763 external-priority patent/US20070144912A1/en
Priority claimed from US11/699,768 external-priority patent/US7842173B2/en
Application filed by Semitool Inc, Daniel J Woodruff, David P Mattson, Paul R Mchugh, Gregory J Wilson, James J Erickson filed Critical Semitool Inc
Publication of WO2008094838A2 publication Critical patent/WO2008094838A2/en
Publication of WO2008094838A3 publication Critical patent/WO2008094838A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
    • B23H5/00—Combined machining
    • B23H5/06—Electrochemical machining combined with mechanical working, e.g. grinding or honing
    • B23H5/08—Electrolytic grinding
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/004—Sealing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/007—Current directing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/008—Current shielding devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer

Abstract

In an apparatus for electrochemically processing wafers, a supplemental virtual electrode counteracts an electric field offset relative to the wafer resulting from misalignment between the wafer and the anode in the vessel. The apparatus may include an agitator having an elongated agitator element(s) with each end attached to a support. A motor is coupled to one support drives the agitator along a linear path. A linear guide is engaged with the other support to guide the motion of the agitator. A robotic in a processing system Includes a position sensor located to identify a rotational orientation of the wafer while the wafer is carried by an end effector on the robot. The rotational orientation of the wafer is corrected by appropriately moving artlculatable links of the robot device, and/or by rotating a rotor support holding the workplece for processing at a process chamber.
PCT/US2008/052104 2007-01-29 2008-01-25 Apparatus and methods for electrochemical processing of wafers WO2008094838A2 (en)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
US11/700,263 US20080178460A1 (en) 2007-01-29 2007-01-29 Protected magnets and magnet shielding for processing microfeature workpieces, and associated systems and methods
US11/700,263 2007-01-29
US11/699,763 2007-01-29
US11/699,762 US20080181758A1 (en) 2007-01-29 2007-01-29 Microfeature workpiece transfer devices with rotational orientation sensors, and associated systems and methods
US11/699,763 US20070144912A1 (en) 2003-07-01 2007-01-29 Linearly translating agitators for processing microfeature workpieces, and associated methods
US11/699,768 US7842173B2 (en) 2007-01-29 2007-01-29 Apparatus and methods for electrochemical processing of microfeature wafers
US11/699,762 2007-01-29
US11/699,768 2007-01-29

Publications (2)

Publication Number Publication Date
WO2008094838A2 WO2008094838A2 (en) 2008-08-07
WO2008094838A3 true WO2008094838A3 (en) 2008-11-06

Family

ID=39674743

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2008/052104 WO2008094838A2 (en) 2007-01-29 2008-01-25 Apparatus and methods for electrochemical processing of wafers

Country Status (2)

Country Link
TW (1) TWI384095B (en)
WO (1) WO2008094838A2 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8968531B2 (en) 2011-12-07 2015-03-03 Applied Materials, Inc. Electro processor with shielded contact ring
US10240248B2 (en) * 2015-08-18 2019-03-26 Applied Materials, Inc. Adaptive electric field shielding in an electroplating processor using agitator geometry and motion control
CN110512248B (en) * 2018-05-21 2022-04-12 盛美半导体设备(上海)股份有限公司 Electroplating apparatus and electroplating method
JP7196337B2 (en) * 2019-12-24 2022-12-26 Ykk株式会社 electroplating system
CN112051450B (en) * 2020-08-31 2023-09-12 华虹半导体(无锡)有限公司 Method for obtaining on-resistance of wafer edge
JP7460504B2 (en) 2020-10-20 2024-04-02 株式会社荏原製作所 Plating Equipment
CN113909601B (en) * 2021-10-15 2023-09-12 盐城工学院 Electrode foil directional reaming device and reaming method thereof
CN116623263B (en) * 2023-07-24 2023-10-31 深圳市顺益丰实业有限公司 Adjusting device for film coating uniformity of semiconductor device

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6103033A (en) * 1998-03-04 2000-08-15 Therasense, Inc. Process for producing an electrochemical biosensor
US6428673B1 (en) * 2000-07-08 2002-08-06 Semitool, Inc. Apparatus and method for electrochemical processing of a microelectronic workpiece, capable of modifying processing based on metrology
US20030020928A1 (en) * 2000-07-08 2003-01-30 Ritzdorf Thomas L. Methods and apparatus for processing microelectronic workpieces using metrology
US6654122B1 (en) * 1996-07-15 2003-11-25 Semitool, Inc. Semiconductor processing apparatus having lift and tilt mechanism
US20050253206A1 (en) * 2002-08-26 2005-11-17 Alchimer S.A. Microstructure comprising a surface which is functionalised through the localised deposit of a thin layer and production method thereof
US7125477B2 (en) * 2000-02-17 2006-10-24 Applied Materials, Inc. Contacts for electrochemical processing

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6654122B1 (en) * 1996-07-15 2003-11-25 Semitool, Inc. Semiconductor processing apparatus having lift and tilt mechanism
US6103033A (en) * 1998-03-04 2000-08-15 Therasense, Inc. Process for producing an electrochemical biosensor
US7125477B2 (en) * 2000-02-17 2006-10-24 Applied Materials, Inc. Contacts for electrochemical processing
US6428673B1 (en) * 2000-07-08 2002-08-06 Semitool, Inc. Apparatus and method for electrochemical processing of a microelectronic workpiece, capable of modifying processing based on metrology
US20030020928A1 (en) * 2000-07-08 2003-01-30 Ritzdorf Thomas L. Methods and apparatus for processing microelectronic workpieces using metrology
US20050253206A1 (en) * 2002-08-26 2005-11-17 Alchimer S.A. Microstructure comprising a surface which is functionalised through the localised deposit of a thin layer and production method thereof

Also Published As

Publication number Publication date
WO2008094838A2 (en) 2008-08-07
TW200835819A (en) 2008-09-01
TWI384095B (en) 2013-02-01

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