WO2008060349A3 - Method for heteroepitaxial growth of high-quality n-face gan, inn, and ain and their alloys by metal organic chemical vapor deposition - Google Patents

Method for heteroepitaxial growth of high-quality n-face gan, inn, and ain and their alloys by metal organic chemical vapor deposition Download PDF

Info

Publication number
WO2008060349A3
WO2008060349A3 PCT/US2007/020037 US2007020037W WO2008060349A3 WO 2008060349 A3 WO2008060349 A3 WO 2008060349A3 US 2007020037 W US2007020037 W US 2007020037W WO 2008060349 A3 WO2008060349 A3 WO 2008060349A3
Authority
WO
WIPO (PCT)
Prior art keywords
face gan
ain
inn
alloys
quality
Prior art date
Application number
PCT/US2007/020037
Other languages
French (fr)
Other versions
WO2008060349A2 (en
Inventor
Stacia Keller
Umesh K Mishra
Nicholas A Fichtenbaum
Original Assignee
Univ California
Stacia Keller
Umesh K Mishra
Nicholas A Fichtenbaum
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Univ California, Stacia Keller, Umesh K Mishra, Nicholas A Fichtenbaum filed Critical Univ California
Priority to JP2009537139A priority Critical patent/JP2010509177A/en
Priority to CA2669228A priority patent/CA2669228C/en
Priority to EP07838270A priority patent/EP2087507A4/en
Publication of WO2008060349A2 publication Critical patent/WO2008060349A2/en
Publication of WO2008060349A3 publication Critical patent/WO2008060349A3/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02Epitaxial-layer growth
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10Inorganic compounds or compositions
    • C30B29/40AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
    • C30B29/403AIII-nitrides
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02367Substrates
    • H01L21/0237Materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02367Substrates
    • H01L21/0237Materials
    • H01L21/02373Group 14 semiconducting materials
    • H01L21/02378Silicon carbide
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02367Substrates
    • H01L21/0237Materials
    • H01L21/02373Group 14 semiconducting materials
    • H01L21/02381Silicon, silicon germanium, germanium
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02367Substrates
    • H01L21/0237Materials
    • H01L21/0242Crystalline insulating materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02367Substrates
    • H01L21/02433Crystal orientation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02436Intermediate layers between substrates and deposited layers
    • H01L21/02439Materials
    • H01L21/02455Group 13/15 materials
    • H01L21/02458Nitrides
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02518Deposited layers
    • H01L21/02521Materials
    • H01L21/02538Group 13/15 materials
    • H01L21/0254Nitrides
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02518Deposited layers
    • H01L21/0257Doping during depositing
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02612Formation types
    • H01L21/02617Deposition types
    • H01L21/0262Reduction or decomposition of gaseous compounds, e.g. CVD

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Chemical Vapour Deposition (AREA)
  • Semiconductor Lasers (AREA)
  • Led Devices (AREA)

Abstract

Methods for the heteroepitaxial growth of smooth, high quality films of N- face GaN film grown by MOCVD are disclosed. Use of a misoriented substrate and possibly nitridizing the substrate allow for the growth of smooth N-face GaN and other Group III nitride films as disclosed herein. The present invention also avoids the typical large (μm sized) hexagonal features which make N-face GaN material unacceptable for device applications. The present invention allows for the growth of smooth, high quality films which makes the development of N-face devices possible.
PCT/US2007/020037 2006-11-15 2007-09-14 Method for heteroepitaxial growth of high-quality n-face gan, inn, and ain and their alloys by metal organic chemical vapor deposition WO2008060349A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2009537139A JP2010509177A (en) 2006-11-15 2007-09-14 Method for heteroepitaxial growth of high quality N-plane GaN, InN and AlN and their alloys by metalorganic chemical vapor deposition
CA2669228A CA2669228C (en) 2006-11-15 2007-09-14 Method for heteroepitaxial growth of high-quality n-face gan, inn, and ain and their alloys by metal organic chemical vapor deposition
EP07838270A EP2087507A4 (en) 2006-11-15 2007-09-14 Method for heteroepitaxial growth of high-quality n-face gan, inn, and ain and their alloys by metal organic chemical vapor deposition

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US86603506P 2006-11-15 2006-11-15
US60/866,035 2006-11-15
US11/855,591 US7566580B2 (en) 2006-11-15 2007-09-14 Method for heteroepitaxial growth of high-quality N-face GaN, InN, and AIN and their alloys by metal organic chemical vapor deposition
US11/855,591 2007-09-14

Publications (2)

Publication Number Publication Date
WO2008060349A2 WO2008060349A2 (en) 2008-05-22
WO2008060349A3 true WO2008060349A3 (en) 2008-12-04

Family

ID=39369697

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/020037 WO2008060349A2 (en) 2006-11-15 2007-09-14 Method for heteroepitaxial growth of high-quality n-face gan, inn, and ain and their alloys by metal organic chemical vapor deposition

Country Status (6)

Country Link
US (1) US7566580B2 (en)
EP (1) EP2087507A4 (en)
JP (3) JP2010509177A (en)
CA (1) CA2669228C (en)
TW (1) TWI489668B (en)
WO (1) WO2008060349A2 (en)

Families Citing this family (65)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7018909B2 (en) * 2003-02-28 2006-03-28 S.O.I.Tec Silicon On Insulator Technologies S.A. Forming structures that include a relaxed or pseudo-relaxed layer on a substrate
US7504274B2 (en) 2004-05-10 2009-03-17 The Regents Of The University Of California Fabrication of nonpolar indium gallium nitride thin films, heterostructures and devices by metalorganic chemical vapor deposition
US8157914B1 (en) 2007-02-07 2012-04-17 Chien-Min Sung Substrate surface modifications for compositional gradation of crystalline materials and associated products
US7799600B2 (en) * 2007-05-31 2010-09-21 Chien-Min Sung Doped diamond LED devices and associated methods
JP2008311579A (en) * 2007-06-18 2008-12-25 Sharp Corp Method of manufacturing nitride semiconductor light emitting element
KR101374090B1 (en) * 2007-07-26 2014-03-17 아리조나 보드 오브 리젠츠 퍼 앤 온 비하프 오브 아리조나 스테이트 유니버시티 Epitaxial methods and templates grown by the methods
FR2931293B1 (en) * 2008-05-15 2010-09-03 Soitec Silicon On Insulator PROCESS FOR MANUFACTURING AN EPITAXIA SUPPORT HETEROSTRUCTURE AND CORRESPONDING HETEROSTRUCTURE
WO2009141724A1 (en) 2008-05-23 2009-11-26 S.O.I.Tec Silicon On Insulator Technologies Formation of substantially pit free indium gallium nitride
EP2151852B1 (en) 2008-08-06 2020-01-15 Soitec Relaxation and transfer of strained layers
EP2151856A1 (en) * 2008-08-06 2010-02-10 S.O.I. TEC Silicon Relaxation of strained layers
EP2151861A1 (en) * 2008-08-06 2010-02-10 S.O.I. TEC Silicon Passivation of etched semiconductor structures
TWI457984B (en) 2008-08-06 2014-10-21 Soitec Silicon On Insulator Relaxation of strained layers
EP2159836B1 (en) * 2008-08-25 2017-05-31 Soitec Stiffening layers for the relaxation of strained layers
US20100072484A1 (en) * 2008-09-23 2010-03-25 Triquint Semiconductor, Inc. Heteroepitaxial gallium nitride-based device formed on an off-cut substrate
JP2010232297A (en) * 2009-03-26 2010-10-14 Sumitomo Electric Device Innovations Inc Semiconductor device
JP5401145B2 (en) * 2009-03-26 2014-01-29 株式会社トクヤマ Method for producing group III nitride laminate
US8344420B1 (en) 2009-07-24 2013-01-01 Triquint Semiconductor, Inc. Enhancement-mode gallium nitride high electron mobility transistor
US9525117B2 (en) 2009-12-08 2016-12-20 Lehigh University Thermoelectric materials based on single crystal AlInN—GaN grown by metalorganic vapor phase epitaxy
US8541252B2 (en) * 2009-12-17 2013-09-24 Lehigh University Abbreviated epitaxial growth mode (AGM) method for reducing cost and improving quality of LEDs and lasers
US9705028B2 (en) * 2010-02-26 2017-07-11 Micron Technology, Inc. Light emitting diodes with N-polarity and associated methods of manufacturing
CN101831628B (en) * 2010-04-21 2011-10-05 中国科学院半导体研究所 Method for growing high-quality In ingredient enriched InGaN thin film material
CN101831613B (en) * 2010-04-21 2011-10-19 中国科学院半导体研究所 Method for growing nonpolar InN film by utilizing nonpolar ZnO buffer layer
JP5668339B2 (en) * 2010-06-30 2015-02-12 住友電気工業株式会社 Manufacturing method of semiconductor device
US8742460B2 (en) 2010-12-15 2014-06-03 Transphorm Inc. Transistors with isolation regions
US8975165B2 (en) 2011-02-17 2015-03-10 Soitec III-V semiconductor structures with diminished pit defects and methods for forming the same
US20130026480A1 (en) * 2011-07-25 2013-01-31 Bridgelux, Inc. Nucleation of Aluminum Nitride on a Silicon Substrate Using an Ammonia Preflow
US8901604B2 (en) 2011-09-06 2014-12-02 Transphorm Inc. Semiconductor devices with guard rings
US9257547B2 (en) 2011-09-13 2016-02-09 Transphorm Inc. III-N device structures having a non-insulating substrate
JP5987288B2 (en) * 2011-09-28 2016-09-07 富士通株式会社 Semiconductor device
US8598937B2 (en) 2011-10-07 2013-12-03 Transphorm Inc. High power semiconductor electronic components with increased reliability
JP5744784B2 (en) * 2012-03-30 2015-07-08 日立金属株式会社 Manufacturing method of nitride semiconductor epitaxial wafer
US8603898B2 (en) 2012-03-30 2013-12-10 Applied Materials, Inc. Method for forming group III/V conformal layers on silicon substrates
US9093366B2 (en) 2012-04-09 2015-07-28 Transphorm Inc. N-polar III-nitride transistors
US8878249B2 (en) 2012-04-12 2014-11-04 The Regents Of The University Of California Method for heteroepitaxial growth of high channel conductivity and high breakdown voltage nitrogen polar high electron mobility transistors
US9312129B2 (en) 2012-09-05 2016-04-12 Saint-Gobain Cristaux Et Detecteurs Group III-V substrate material with particular crystallographic features and methods of making
JP2014072428A (en) * 2012-09-28 2014-04-21 Fujitsu Ltd Process of manufacturing semiconductor crystal substrate, process of manufacturing semiconductor device, semiconductor crystal substrate, and semiconductor device
US9978904B2 (en) * 2012-10-16 2018-05-22 Soraa, Inc. Indium gallium nitride light emitting devices
US9087718B2 (en) 2013-03-13 2015-07-21 Transphorm Inc. Enhancement-mode III-nitride devices
TWI657169B (en) * 2013-04-22 2019-04-21 傲思丹度科技公司 Semi-polar iii-nitride films and materials and method for making the same
US9443938B2 (en) 2013-07-19 2016-09-13 Transphorm Inc. III-nitride transistor including a p-type depleting layer
US9368582B2 (en) * 2013-11-04 2016-06-14 Avogy, Inc. High power gallium nitride electronics using miscut substrates
JP6636459B2 (en) 2014-05-27 2020-01-29 シランナ・ユー・ブイ・テクノロジーズ・プライベート・リミテッドSilanna Uv Technologies Pte Ltd Advanced electronic devices using semiconductor structures and superlattices
JP6986349B2 (en) 2014-05-27 2021-12-22 シランナ・ユー・ブイ・テクノロジーズ・プライベート・リミテッドSilanna Uv Technologies Pte Ltd Electronic device with n-type superlattice and p-type superlattice
WO2015181648A1 (en) 2014-05-27 2015-12-03 The Silanna Group Pty Limited An optoelectronic device
US11322643B2 (en) 2014-05-27 2022-05-03 Silanna UV Technologies Pte Ltd Optoelectronic device
US9318593B2 (en) 2014-07-21 2016-04-19 Transphorm Inc. Forming enhancement mode III-nitride devices
WO2016051935A1 (en) * 2014-10-03 2016-04-07 日本碍子株式会社 Epitaxial substrate for semiconductor element and method for manufacturing same
CN105719968B (en) * 2014-12-04 2018-12-11 北京北方华创微电子装备有限公司 Epitaxial nitride gallium film and the method for preparing HEMT device on silicon substrate
US9536967B2 (en) 2014-12-16 2017-01-03 Transphorm Inc. Recessed ohmic contacts in a III-N device
US9536966B2 (en) 2014-12-16 2017-01-03 Transphorm Inc. Gate structures for III-N devices
JP6822146B2 (en) * 2015-01-16 2021-01-27 住友電気工業株式会社 Manufacturing method of semiconductor substrate and manufacturing method of composite semiconductor substrate
WO2016132815A1 (en) * 2015-02-18 2016-08-25 国立大学法人東北大学 Nitride semiconductor free-standing substrate production method
US9941295B2 (en) 2015-06-08 2018-04-10 Sandisk Technologies Llc Method of making a three-dimensional memory device having a heterostructure quantum well channel
US9425299B1 (en) 2015-06-08 2016-08-23 Sandisk Technologies Llc Three-dimensional memory device having a heterostructure quantum well channel
US11322599B2 (en) 2016-01-15 2022-05-03 Transphorm Technology, Inc. Enhancement mode III-nitride devices having an Al1-xSixO gate insulator
US9721963B1 (en) 2016-04-08 2017-08-01 Sandisk Technologies Llc Three-dimensional memory device having a transition metal dichalcogenide channel
US10224401B2 (en) 2016-05-31 2019-03-05 Transphorm Inc. III-nitride devices including a graded depleting layer
US9818801B1 (en) 2016-10-14 2017-11-14 Sandisk Technologies Llc Resistive three-dimensional memory device with heterostructure semiconductor local bit line and method of making thereof
JP6824829B2 (en) 2017-06-15 2021-02-03 株式会社サイオクス Nitride semiconductor laminate manufacturing method, nitride semiconductor self-supporting substrate manufacturing method, and semiconductor device manufacturing method
JP6915591B2 (en) * 2018-06-13 2021-08-04 信越化学工業株式会社 Manufacturing method of GaN laminated board
JPWO2020017207A1 (en) * 2018-07-20 2021-08-02 ソニーセミコンダクタソリューションズ株式会社 Semiconductor light emitting device
JP7044161B2 (en) * 2018-08-09 2022-03-30 信越化学工業株式会社 Manufacturing method of GaN laminated board
CN109599329B (en) * 2018-12-05 2023-08-08 江西兆驰半导体有限公司 Method for growing nitrogen polar III-nitride semiconductor layer on silicon substrate
JP7181321B2 (en) * 2021-01-13 2022-11-30 株式会社サイオクス nitride semiconductor laminate
CN115863501B (en) * 2023-02-27 2023-05-09 江西兆驰半导体有限公司 Light-emitting diode epitaxial wafer and preparation method thereof

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010030329A1 (en) * 2000-01-14 2001-10-18 Yoshihiro Ueta Nitride compound semiconductor light emitting device and method for producing the same
US6391748B1 (en) * 2000-10-03 2002-05-21 Texas Tech University Method of epitaxial growth of high quality nitride layers on silicon substrates

Family Cites Families (90)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US606078A (en) * 1898-06-21 Christian pattberg
JPS62119196A (en) * 1985-11-18 1987-05-30 Univ Nagoya Method for growing compound semiconductor
US6440823B1 (en) * 1994-01-27 2002-08-27 Advanced Technology Materials, Inc. Low defect density (Ga, Al, In)N and HVPE process for making same
US5679152A (en) * 1994-01-27 1997-10-21 Advanced Technology Materials, Inc. Method of making a single crystals Ga*N article
US6072197A (en) * 1996-02-23 2000-06-06 Fujitsu Limited Semiconductor light emitting device with an active layer made of semiconductor having uniaxial anisotropy
US5923950A (en) * 1996-06-14 1999-07-13 Matsushita Electric Industrial Co., Inc. Method of manufacturing a semiconductor light-emitting device
US6849866B2 (en) * 1996-10-16 2005-02-01 The University Of Connecticut High performance optoelectronic and electronic inversion channel quantum well devices suitable for monolithic integration
JPH111399A (en) * 1996-12-05 1999-01-06 Lg Electron Inc Production of gallium nitride semiconductor single crystal substrate and gallium nitride diode produced by using the substrate
US5741724A (en) * 1996-12-27 1998-04-21 Motorola Method of growing gallium nitride on a spinel substrate
ATE550461T1 (en) * 1997-04-11 2012-04-15 Nichia Corp GROWTH METHOD FOR A NITRIDE SEMICONDUCTOR
US6069021A (en) * 1997-05-14 2000-05-30 Showa Denko K.K. Method of growing group III nitride semiconductor crystal layer and semiconductor device incorporating group III nitride semiconductor crystal layer
JPH10335637A (en) * 1997-05-30 1998-12-18 Sony Corp Hetero-junction field effect transistor
JP3813740B2 (en) * 1997-07-11 2006-08-23 Tdk株式会社 Substrates for electronic devices
US5926726A (en) * 1997-09-12 1999-07-20 Sdl, Inc. In-situ acceptor activation in group III-v nitride compound semiconductors
JP3955367B2 (en) * 1997-09-30 2007-08-08 フィリップス ルミレッズ ライティング カンパニー リミテッド ライアビリティ カンパニー Optical semiconductor device and manufacturing method thereof
US6849472B2 (en) * 1997-09-30 2005-02-01 Lumileds Lighting U.S., Llc Nitride semiconductor device with reduced polarization fields
US6201262B1 (en) * 1997-10-07 2001-03-13 Cree, Inc. Group III nitride photonic devices on silicon carbide substrates with conductive buffer interlay structure
US6051849A (en) * 1998-02-27 2000-04-18 North Carolina State University Gallium nitride semiconductor structures including a lateral gallium nitride layer that extends from an underlying gallium nitride layer
US6294440B1 (en) * 1998-04-10 2001-09-25 Sharp Kabushiki Kaisha Semiconductor substrate, light-emitting device, and method for producing the same
US6180270B1 (en) * 1998-04-24 2001-01-30 The United States Of America As Represented By The Secretary Of The Army Low defect density gallium nitride epilayer and method of preparing the same
US6064078A (en) 1998-05-22 2000-05-16 Xerox Corporation Formation of group III-V nitride films on sapphire substrates with reduced dislocation densities
TW417315B (en) * 1998-06-18 2001-01-01 Sumitomo Electric Industries GaN single crystal substrate and its manufacture method of the same
WO1999066565A1 (en) * 1998-06-18 1999-12-23 University Of Florida Method and apparatus for producing group-iii nitrides
JP3976294B2 (en) * 1998-06-26 2007-09-12 シャープ株式会社 Method for manufacturing nitride-based compound semiconductor light-emitting device
JP3201475B2 (en) * 1998-09-14 2001-08-20 松下電器産業株式会社 Semiconductor device and method of manufacturing the same
JP3592553B2 (en) * 1998-10-15 2004-11-24 株式会社東芝 Gallium nitride based semiconductor device
WO2000033388A1 (en) * 1998-11-24 2000-06-08 Massachusetts Institute Of Technology METHOD OF PRODUCING DEVICE QUALITY (Al)InGaP ALLOYS ON LATTICE-MISMATCHED SUBSTRATES
US6177057B1 (en) * 1999-02-09 2001-01-23 The United States Of America As Represented By The Secretary Of The Navy Process for preparing bulk cubic gallium nitride
US20010042503A1 (en) * 1999-02-10 2001-11-22 Lo Yu-Hwa Method for design of epitaxial layer and substrate structures for high-quality epitaxial growth on lattice-mismatched substrates
JP3587081B2 (en) * 1999-05-10 2004-11-10 豊田合成株式会社 Method of manufacturing group III nitride semiconductor and group III nitride semiconductor light emitting device
US6133593A (en) * 1999-07-23 2000-10-17 The United States Of America As Represented By The Secretary Of The Navy Channel design to reduce impact ionization in heterostructure field-effect transistors
US6268621B1 (en) * 1999-08-03 2001-07-31 International Business Machines Corporation Vertical channel field effect transistor
US6812053B1 (en) * 1999-10-14 2004-11-02 Cree, Inc. Single step pendeo- and lateral epitaxial overgrowth of Group III-nitride epitaxial layers with Group III-nitride buffer layer and resulting structures
CA2287760C (en) * 1999-10-29 2004-08-10 Leader Industries Inc. Sport eyeglasses having removable lenses
JP3393602B2 (en) * 2000-01-13 2003-04-07 松下電器産業株式会社 Semiconductor device
US20010015437A1 (en) * 2000-01-25 2001-08-23 Hirotatsu Ishii GaN field-effect transistor, inverter device, and production processes therefor
US6566231B2 (en) * 2000-02-24 2003-05-20 Matsushita Electric Industrial Co., Ltd. Method of manufacturing high performance semiconductor device with reduced lattice defects in the active region
JP3557441B2 (en) 2000-03-13 2004-08-25 日本電信電話株式会社 Nitride semiconductor substrate and method of manufacturing the same
JP3946427B2 (en) 2000-03-29 2007-07-18 株式会社東芝 Epitaxial growth substrate manufacturing method and semiconductor device manufacturing method using this epitaxial growth substrate
TW472400B (en) * 2000-06-23 2002-01-11 United Epitaxy Co Ltd Method for roughing semiconductor device surface to increase the external quantum efficiency
JP3968968B2 (en) * 2000-07-10 2007-08-29 住友電気工業株式会社 Manufacturing method of single crystal GaN substrate
JP4556300B2 (en) * 2000-07-18 2010-10-06 ソニー株式会社 Crystal growth method
US6624452B2 (en) * 2000-07-28 2003-09-23 The Regents Of The University Of California Gallium nitride-based HFET and a method for fabricating a gallium nitride-based HFET
WO2002013245A1 (en) * 2000-08-04 2002-02-14 The Regents Of The University Of California Method of controlling stress in gallium nitride films deposited on substrates
JP2002076521A (en) 2000-08-30 2002-03-15 Nippon Telegr & Teleph Corp <Ntt> Nitride semiconductor light emitting element
JP4154558B2 (en) 2000-09-01 2008-09-24 日本電気株式会社 Semiconductor device
US6690042B2 (en) * 2000-09-27 2004-02-10 Sensor Electronic Technology, Inc. Metal oxide semiconductor heterostructure field effect transistor
US6649287B2 (en) * 2000-12-14 2003-11-18 Nitronex Corporation Gallium nitride materials and methods
US6635901B2 (en) * 2000-12-15 2003-10-21 Nobuhiko Sawaki Semiconductor device including an InGaAIN layer
US6599362B2 (en) * 2001-01-03 2003-07-29 Sandia Corporation Cantilever epitaxial process
US6849882B2 (en) * 2001-05-11 2005-02-01 Cree Inc. Group-III nitride based high electron mobility transistor (HEMT) with barrier/spacer layer
US7501023B2 (en) * 2001-07-06 2009-03-10 Technologies And Devices, International, Inc. Method and apparatus for fabricating crack-free Group III nitride semiconductor materials
US7105865B2 (en) * 2001-09-19 2006-09-12 Sumitomo Electric Industries, Ltd. AlxInyGa1−x−yN mixture crystal substrate
KR100904501B1 (en) * 2001-10-26 2009-06-25 암모노 에스피. 제트오. 오. Substrate for epitaxy
WO2003036771A1 (en) * 2001-10-26 2003-05-01 Ammono Sp.Zo.O. Nitride semiconductor laser element, and production method therefor
US6617261B2 (en) * 2001-12-18 2003-09-09 Xerox Corporation Structure and method for fabricating GaN substrates from trench patterned GaN layers on sapphire substrates
US6878975B2 (en) * 2002-02-08 2005-04-12 Agilent Technologies, Inc. Polarization field enhanced tunnel structures
US6791120B2 (en) * 2002-03-26 2004-09-14 Sanyo Electric Co., Ltd. Nitride-based semiconductor device and method of fabricating the same
US7208393B2 (en) * 2002-04-15 2007-04-24 The Regents Of The University Of California Growth of planar reduced dislocation density m-plane gallium nitride by hydride vapor phase epitaxy
WO2003089696A1 (en) * 2002-04-15 2003-10-30 The Regents Of The University Of California Dislocation reduction in non-polar gallium nitride thin films
US8809867B2 (en) * 2002-04-15 2014-08-19 The Regents Of The University Of California Dislocation reduction in non-polar III-nitride thin films
US20060138431A1 (en) * 2002-05-17 2006-06-29 Robert Dwilinski Light emitting device structure having nitride bulk single crystal layer
JP4201541B2 (en) 2002-07-19 2008-12-24 豊田合成株式会社 Semiconductor crystal manufacturing method and group III nitride compound semiconductor light emitting device manufacturing method
US6876009B2 (en) * 2002-12-09 2005-04-05 Nichia Corporation Nitride semiconductor device and a process of manufacturing the same
US7186302B2 (en) * 2002-12-16 2007-03-06 The Regents Of The University Of California Fabrication of nonpolar indium gallium nitride thin films, heterostructures and devices by metalorganic chemical vapor deposition
US7427555B2 (en) * 2002-12-16 2008-09-23 The Regents Of The University Of California Growth of planar, non-polar gallium nitride by hydride vapor phase epitaxy
EP1576671A4 (en) 2002-12-16 2006-10-25 Univ California Growth of planar, non-polar a-plane gallium nitride by hydride vapor phase epitaxy
JP5096677B2 (en) 2003-04-15 2012-12-12 ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア Nonpolar (Al, B, In, Ga) N quantum well
US6847057B1 (en) * 2003-08-01 2005-01-25 Lumileds Lighting U.S., Llc Semiconductor light emitting devices
US6958494B2 (en) * 2003-08-14 2005-10-25 Dicon Fiberoptics, Inc. Light emitting diodes with current spreading layer
US7009215B2 (en) * 2003-10-24 2006-03-07 General Electric Company Group III-nitride based resonant cavity light emitting devices fabricated on single crystal gallium nitride substrates
US7612390B2 (en) * 2004-02-05 2009-11-03 Cree, Inc. Heterojunction transistors including energy barriers
US7808011B2 (en) * 2004-03-19 2010-10-05 Koninklijke Philips Electronics N.V. Semiconductor light emitting devices including in-plane light emitting layers
US20050253222A1 (en) * 2004-05-17 2005-11-17 Caneau Catherine G Semiconductor devices on misoriented substrates
US7432142B2 (en) * 2004-05-20 2008-10-07 Cree, Inc. Methods of fabricating nitride-based transistors having regrown ohmic contact regions
TWI308397B (en) * 2004-06-28 2009-04-01 Epistar Corp Flip-chip light emitting diode and fabricating method thereof
US7547928B2 (en) * 2004-06-30 2009-06-16 Interuniversitair Microelektronica Centrum (Imec) AlGaN/GaN high electron mobility transistor devices
US20060073621A1 (en) * 2004-10-01 2006-04-06 Palo Alto Research Center Incorporated Group III-nitride based HEMT device with insulating GaN/AlGaN buffer layer
KR101145755B1 (en) * 2005-03-10 2012-05-16 재팬 사이언스 앤드 테크놀로지 에이젼시 Technique for the growth of planar semi-polar gallium nitride
US7341878B2 (en) * 2005-03-14 2008-03-11 Philips Lumileds Lighting Company, Llc Wavelength-converted semiconductor light emitting device
US7804100B2 (en) * 2005-03-14 2010-09-28 Philips Lumileds Lighting Company, Llc Polarization-reversed III-nitride light emitting device
JP2006269534A (en) * 2005-03-22 2006-10-05 Eudyna Devices Inc Semiconductor device and its manufacturing method, substrate for manufacturing semiconductor device and its manufacturing method, and substrate for semiconductor growth
TW200703463A (en) * 2005-05-31 2007-01-16 Univ California Defect reduction of non-polar and semi-polar III-nitrides with sidewall lateral epitaxial overgrowth (SLEO)
JP5743127B2 (en) * 2005-06-01 2015-07-01 ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア Method and apparatus for growth and fabrication of semipolar (Ga, Al, In, B) N thin films, heterostructures and devices
JP5043835B2 (en) * 2005-06-17 2012-10-10 ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア (Al, Ga, In) N and ZnO direct wafer bonding structure for optoelectronic applications and its fabrication method
US8148244B2 (en) * 2005-07-13 2012-04-03 The Regents Of The University Of California Lateral growth method for defect reduction of semipolar nitride films
JP4696886B2 (en) * 2005-12-08 2011-06-08 日立電線株式会社 Method for manufacturing self-supporting gallium nitride single crystal substrate and method for manufacturing nitride semiconductor device
US7691658B2 (en) * 2006-01-20 2010-04-06 The Regents Of The University Of California Method for improved growth of semipolar (Al,In,Ga,B)N
KR101416838B1 (en) * 2006-02-10 2014-07-08 더 리전츠 오브 더 유니버시티 오브 캘리포니아 Method for conductivity control of (Al,In,Ga,B)N
EP2041794A4 (en) * 2006-06-21 2010-07-21 Univ California Opto-electronic and electronic devices using n-face or m-plane gan substrate prepared with ammonothermal growth

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010030329A1 (en) * 2000-01-14 2001-10-18 Yoshihiro Ueta Nitride compound semiconductor light emitting device and method for producing the same
US6391748B1 (en) * 2000-10-03 2002-05-21 Texas Tech University Method of epitaxial growth of high quality nitride layers on silicon substrates

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
See also references of EP2087507A4 *
ZAUNER ET AL.: "Homo-Epitaxial growth on the Misorineted GaN Substrates by MOCVD", MAT. RES. SYMP., vol. 595, pages W6.3.1 - W6.3.6, XP008108993 *

Also Published As

Publication number Publication date
TW200822409A (en) 2008-05-16
US7566580B2 (en) 2009-07-28
JP2013100227A (en) 2013-05-23
JP2010509177A (en) 2010-03-25
JP5792209B2 (en) 2015-10-07
TWI489668B (en) 2015-06-21
CA2669228C (en) 2014-12-16
EP2087507A4 (en) 2010-07-07
JP2015063458A (en) 2015-04-09
EP2087507A2 (en) 2009-08-12
CA2669228A1 (en) 2008-05-22
US20080113496A1 (en) 2008-05-15
WO2008060349A2 (en) 2008-05-22

Similar Documents

Publication Publication Date Title
WO2008060349A3 (en) Method for heteroepitaxial growth of high-quality n-face gan, inn, and ain and their alloys by metal organic chemical vapor deposition
US7273798B2 (en) Gallium nitride device substrate containing a lattice parameter altering element
TW200802958A (en) Group III-nitride semiconductor thin film, method for fabricating the same, and group III-nitride semiconductor light emitting device
EP1883103A3 (en) Deposition of group III-nitrides on Ge
TW200703470A (en) Growth of planar non-polar {1-100} m-plane gallium nitride with metalorganic chemical vapor deposition (MOCVD)
WO2007002028A3 (en) Layer growth using metal film and/or islands
WO2008143166A1 (en) Method for manufacturing semiconductor crystal of nitride of element belonging to group-iii, semiconductor substrate formed of nitride of element belonging to group-iii, and semiconductor light emission device
JP2015167231A5 (en)
GR1008013B (en) Method for heteroepitaxial growth of iii metal-face polarity iii-nitrides on diamond substrates
WO2010009325A3 (en) Growth of semi-polar (11-22) or (10-13) gallium nitride with hydride vapor phase epitaxy
TW200746301A (en) Lateral growth method for defect reduction of semipolar nitride films
CN102549716A (en) Backside stress compensation for gallium nitride or other nitride-based semiconductor devices
TW200610192A (en) Group III nitride semiconductor crystal and manufacturing method of the same, group III nitride semiconductor device and manufacturing method of the same, and light emitting device
WO2006086471A3 (en) A method to grow iii-nitride materials using no buffer layer
EP2086003A3 (en) Method of growing group III-V compound semiconductor, and method of manufacturing light-emitting device and electronic device
EP2243869A3 (en) Method for fabricating semiconductor device
WO2007030709A3 (en) METHOD FOR ENHANCING GROWTH OF SEMI-POLAR (Al, In,Ga,B)N VIA METALORGANIC CHEMICAL VAPOR DEPOSITION
TW200631079A (en) Growth process of a crystalline gallium nitride based compound and semiconductor device including gallium nitride based compound
TW201614083A (en) Method for forming nitride semiconductor layer and method for manufacturing semiconductor device
WO2008067537A3 (en) Method and apparatus for growth of iii-nitride semiconductor epitaxial layers
WO2009136718A3 (en) Semiconductor element and a production method therefor
CN100547734C (en) Multilayered semiconductor substrate, semiconductor free-standing substrate and preparation method thereof and semiconductor device
JP2009067658A (en) Nitride semiconductor ground substrate, nitride semiconductor-stacked substrate, nitride semiconductor self-standing substrate and method for producing nitride semiconductor ground substrate
JP2006261476A (en) Method for growing gallium nitride crystal over silicon substrate crystal
WO2007103419A3 (en) Structures and designs for improved efficiency and reduced strain iii-nitride heterostructure semiconductor devices

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 07838270

Country of ref document: EP

Kind code of ref document: A2

WWE Wipo information: entry into national phase

Ref document number: 2669228

Country of ref document: CA

WWE Wipo information: entry into national phase

Ref document number: 2007838270

Country of ref document: EP

ENP Entry into the national phase

Ref document number: 2009537139

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE