WO2008054504A3 - Patterning of mechanical layer in mems to reduce stresses at supports - Google Patents

Patterning of mechanical layer in mems to reduce stresses at supports Download PDF

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Publication number
WO2008054504A3
WO2008054504A3 PCT/US2007/008910 US2007008910W WO2008054504A3 WO 2008054504 A3 WO2008054504 A3 WO 2008054504A3 US 2007008910 W US2007008910 W US 2007008910W WO 2008054504 A3 WO2008054504 A3 WO 2008054504A3
Authority
WO
WIPO (PCT)
Prior art keywords
mechanical layer
mems
patterning
supports
portions
Prior art date
Application number
PCT/US2007/008910
Other languages
French (fr)
Other versions
WO2008054504A2 (en
Inventor
Ming-Hau Tung
Wonsuk Chung
Original Assignee
Qualcomm Mems Technologies Inc
Ming-Hau Tung
Wonsuk Chung
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qualcomm Mems Technologies Inc, Ming-Hau Tung, Wonsuk Chung filed Critical Qualcomm Mems Technologies Inc
Priority to EP07861284A priority Critical patent/EP2021860A2/en
Publication of WO2008054504A2 publication Critical patent/WO2008054504A2/en
Publication of WO2008054504A3 publication Critical patent/WO2008054504A3/en

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/001—Optical devices or arrangements for the control of light using movable or deformable optical elements based on interference in an adjustable optical cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00642—Manufacture or treatment of devices or systems in or on a substrate for improving the physical properties of a device
    • B81C1/0065—Mechanical properties
    • B81C1/00666—Treatments for controlling internal stress or strain in MEMS structures
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/04—Optical MEMS
    • B81B2201/047—Optical MEMS not provided for in B81B2201/042 - B81B2201/045
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0102—Surface micromachining
    • B81C2201/0105—Sacrificial layer
    • B81C2201/0109—Sacrificial layers not provided for in B81C2201/0107 - B81C2201/0108

Abstract

A method of fabricating a MEMS device includes the formation of support posts having horizontal wing portions at the edges of the post. A mechanical layer is deposited over the support posts and portions of the mechanical layer overlying portions of the support post other than the horizontal wing portions are etched away. A resultant MEMS device includes a mechanical layer overlying at least a portion of the horizontal wing portions of the underlying support structures.
PCT/US2007/008910 2006-06-01 2007-04-09 Patterning of mechanical layer in mems to reduce stresses at supports WO2008054504A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP07861284A EP2021860A2 (en) 2006-06-01 2007-04-09 Patterning of mechanical layer in mems to reduce stresses at supports

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/445,529 US7405863B2 (en) 2006-06-01 2006-06-01 Patterning of mechanical layer in MEMS to reduce stresses at supports
US11/445,529 2006-06-01

Publications (2)

Publication Number Publication Date
WO2008054504A2 WO2008054504A2 (en) 2008-05-08
WO2008054504A3 true WO2008054504A3 (en) 2008-08-28

Family

ID=38789768

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/008910 WO2008054504A2 (en) 2006-06-01 2007-04-09 Patterning of mechanical layer in mems to reduce stresses at supports

Country Status (3)

Country Link
US (1) US7405863B2 (en)
EP (1) EP2021860A2 (en)
WO (1) WO2008054504A2 (en)

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US20070279753A1 (en) 2007-12-06

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