WO2007079158A3 - Methods and apparatuses for sensing temperature of multi-via heater chips - Google Patents

Methods and apparatuses for sensing temperature of multi-via heater chips Download PDF

Info

Publication number
WO2007079158A3
WO2007079158A3 PCT/US2006/049455 US2006049455W WO2007079158A3 WO 2007079158 A3 WO2007079158 A3 WO 2007079158A3 US 2006049455 W US2006049455 W US 2006049455W WO 2007079158 A3 WO2007079158 A3 WO 2007079158A3
Authority
WO
WIPO (PCT)
Prior art keywords
heater
apparatuses
methods
sensing temperature
temperature sensing
Prior art date
Application number
PCT/US2006/049455
Other languages
French (fr)
Other versions
WO2007079158A2 (en
Inventor
Lucas David Barkley
Bruce David Gibson
Eric Spencer Hall
George K Parish
Original Assignee
Lexmark Int Inc
Lucas David Barkley
Bruce David Gibson
Eric Spencer Hall
George K Parish
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=38223892&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=WO2007079158(A3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Lexmark Int Inc, Lucas David Barkley, Bruce David Gibson, Eric Spencer Hall, George K Parish filed Critical Lexmark Int Inc
Priority to EP06848262A priority Critical patent/EP1973745A2/en
Publication of WO2007079158A2 publication Critical patent/WO2007079158A2/en
Publication of WO2007079158A3 publication Critical patent/WO2007079158A3/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/17Ink jet characterised by ink handling
    • B41J2/195Ink jet characterised by ink handling for monitoring ink quality
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/015Ink jet characterised by the jet generation process
    • B41J2/04Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B41J2/045Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
    • B41J2/04501Control methods or devices therefor, e.g. driver circuits, control circuits
    • B41J2/04563Control methods or devices therefor, e.g. driver circuits, control circuits detecting head temperature; Ink temperature
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/015Ink jet characterised by the jet generation process
    • B41J2/04Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B41J2/045Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
    • B41J2/04501Control methods or devices therefor, e.g. driver circuits, control circuits
    • B41J2/0458Control methods or devices therefor, e.g. driver circuits, control circuits controlling heads based on heating elements forming bubbles

Abstract

Heater chips for use with a printing device, such as heater chips that include a first heater array, positioned substantially adjacent a first via, and a second heater array, positioned substantially adjacent a second via. The heater chip can also include a region, positioned between the first heater array and the second heater array, and a temperature sensing element operable to sense the temperature of the region, where the temperature sensing element is substantially centrally disposed with respect to the region. According to one embodiment of the invention, the temperature sensing element comprises a temperature sensing resistor.
PCT/US2006/049455 2005-12-30 2006-12-28 Methods and apparatuses for sensing temperature of multi-via heater chips WO2007079158A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP06848262A EP1973745A2 (en) 2005-12-30 2006-12-28 Methods and apparatuses for sensing temperature of multi-via heater chips

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/323,809 US7594708B2 (en) 2005-12-30 2005-12-30 Methods and apparatuses for sensing temperature of multi-via heater chips
US11/323,809 2005-12-30

Publications (2)

Publication Number Publication Date
WO2007079158A2 WO2007079158A2 (en) 2007-07-12
WO2007079158A3 true WO2007079158A3 (en) 2007-12-27

Family

ID=38223892

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2006/049455 WO2007079158A2 (en) 2005-12-30 2006-12-28 Methods and apparatuses for sensing temperature of multi-via heater chips

Country Status (4)

Country Link
US (1) US7594708B2 (en)
EP (1) EP1973745A2 (en)
TW (1) TW200730365A (en)
WO (1) WO2007079158A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7614715B2 (en) * 2007-06-07 2009-11-10 Lexmark International, Inc. Micro-fluid ejection head having adaptive thermal control
WO2020222832A1 (en) * 2019-04-30 2020-11-05 Hewlett-Packard Development Company, L.P. Temperature monitoring of fluidic die zones

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6357863B1 (en) * 1999-12-02 2002-03-19 Lexmark International Inc. Linear substrate heater for ink jet print head chip
US6764163B2 (en) * 2002-05-31 2004-07-20 Lexmark International, Inc. Heater configuration for tri-color heater chip
US20050052500A1 (en) * 2003-09-04 2005-03-10 Lexmark International, Inc. N-well and other implanted temperature sense resistors in inkjet print head chips

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5594488A (en) 1994-05-12 1997-01-14 Alps Electric Co., Ltd. Thermal head
US5646660A (en) 1994-08-09 1997-07-08 Encad, Inc. Printer ink cartridge with drive logic integrated circuit
JPH08118641A (en) 1994-10-20 1996-05-14 Canon Inc Ink jet head, ink jet head cartridge, ink jet device and ink container for ink jet head cartridge into which ink is re-injected
US5812162A (en) 1995-04-12 1998-09-22 Eastman Kodak Company Power supply connection for monolithic print heads
US6386674B1 (en) 1997-10-28 2002-05-14 Hewlett-Packard Company Independent power supplies for color inkjet printers
JPH11254409A (en) 1998-03-12 1999-09-21 Crystallizer:Kk Paper solidified product and manufacture thereof
US6951378B1 (en) 1998-05-04 2005-10-04 Canon Kabushiki Kaisha Print control based on print head temperature
US7101099B1 (en) 1998-08-19 2006-09-05 Canon Kabushiki Kaisha Printing head, head cartridge having printing head, printing apparatus using printing head, and printing head substrate
US6331048B1 (en) 1998-08-19 2001-12-18 Canon Kabushiki Kaisha Inkjet printhead having multiple ink supply holes
US6260952B1 (en) 1999-04-22 2001-07-17 Hewlett-Packard Company Apparatus and method for routing power and ground lines in a ink-jet printhead
US6474782B1 (en) 1999-08-24 2002-11-05 Canon Kabushiki Kaisha Printhead and printing apparatus using the same
TW446644B (en) 2000-01-29 2001-07-21 Ind Tech Res Inst Method and structure for precise temperature measurement of ink-jet printhead heating element
AU6199001A (en) * 2000-06-14 2001-12-24 Elion Ag Battery, especially a flat cell
US6601941B1 (en) 2000-07-14 2003-08-05 Christopher Dane Jones Method and apparatus for predicting and limiting maximum printhead chip temperature in an ink jet printer
US6398347B1 (en) 2000-07-24 2002-06-04 Hewlett-Packard Company Energy balanced ink jet printhead
US6663227B2 (en) 2001-01-26 2003-12-16 Fuji Photo Film Co., Ltd. Semiconductor device and process for producing the same
US6412917B1 (en) 2001-01-30 2002-07-02 Hewlett-Packard Company Energy balanced printhead design
US6871929B2 (en) 2001-04-12 2005-03-29 Hewlett-Packard Development Company, L.P. System and method for optimizing temperature operating ranges for a thermal inkjet printhead
US6641242B2 (en) 2001-06-06 2003-11-04 Hewlett-Packard Development Company, L.P. Method and systems for controlling printer temperature
US20030142159A1 (en) 2002-01-31 2003-07-31 Askeland Ronald A. Estimating local ejection chamber temperature to improve printhead performance
US6883904B2 (en) 2002-04-24 2005-04-26 Eastman Kodak Company Apparatus and method for maintaining constant drop volumes in a continuous stream ink jet printer
US6644774B1 (en) 2002-08-22 2003-11-11 Xerox Corporation Ink jet printhead having out-of-ink detection using temperature monitoring system
US6808243B1 (en) 2003-05-20 2004-10-26 Xerox Corporation Thermal inkjet print head with blended enable trains
JP4546102B2 (en) 2004-01-23 2010-09-15 キヤノン株式会社 Recording head substrate, recording head using the recording head substrate, recording apparatus including the recording head, and head cartridge including the recording head
US7484823B2 (en) 2005-12-30 2009-02-03 Lexmark International, Inc. Methods and apparatuses for regulating the temperature of multi-via heater chips

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6357863B1 (en) * 1999-12-02 2002-03-19 Lexmark International Inc. Linear substrate heater for ink jet print head chip
US6764163B2 (en) * 2002-05-31 2004-07-20 Lexmark International, Inc. Heater configuration for tri-color heater chip
US20050052500A1 (en) * 2003-09-04 2005-03-10 Lexmark International, Inc. N-well and other implanted temperature sense resistors in inkjet print head chips

Also Published As

Publication number Publication date
EP1973745A2 (en) 2008-10-01
WO2007079158A2 (en) 2007-07-12
US20070153044A1 (en) 2007-07-05
TW200730365A (en) 2007-08-16
US7594708B2 (en) 2009-09-29

Similar Documents

Publication Publication Date Title
DE10349163B8 (en) Pressure sensor device with temperature sensor
WO2006034668A3 (en) Led array with temperature sensor
WO2007071383A3 (en) Magnetic field sensor arrangement and method for non-contact measurement of a magnetic field
WO2006114394A8 (en) Thermoanalytic sensor
DE602006018568D1 (en) Heating resistor element, manufacturing method therefor, thermal head, printer
FR2868162B1 (en) PRESSURE SENSOR HAVING AN INTEGRATED TEMPERATURE SENSOR
DE602004017911D1 (en) FINGERPRINT SENSOR ELEMENT
DE502006007130D1 (en) COMBINED PRESSURE TEMPERATURE SENSOR WITH CENTRIC TEMPERATURE MEASUREMENT
EP1775274A4 (en) Sintered electroconductive oxide, thermister element using sintered electroconductive oxide, and temperature sensor using thermister element
DE602006001310D1 (en) Piezoelectric element, liquid jet head and device
EP1866964A4 (en) Memory element, memory device, and semiconductor device
WO2007139648A3 (en) Method for improving the precision of a temperature-sensor circuit
FR2890168B1 (en) TEMPERATURE SENSOR CONTROL DEVICE.
WO2007067607A3 (en) Thermal isolation between heating and sensing for flow sensors
WO2007079205A3 (en) Methods and apparatuses for regulating the temperature of multi-via heater chips
WO2009015323A3 (en) Heating element
EP2172415A4 (en) Silicon structure, method for manufacturing the same, and sensor chip
ATE540298T1 (en) ELECTRONIC HEATING COST ALLOCATOR
WO2006081135A3 (en) Temperature controller for small fluid samples having different heat capacities
DE60121910T8 (en) Pressure sensor with semiconductor sensor chip
TW200705582A (en) Semiconductor device and manufacturing method therefor
DE502005007026D1 (en) Sensor arrangement with thermal decoupling of the sensor from the sensed medium
TWI348834B (en) Communication semiconductor chip, calibration device, calibration method, computer-readable recording medium, and calibration program
DE502006000104D1 (en) sensor arrangement
WO2007079158A3 (en) Methods and apparatuses for sensing temperature of multi-via heater chips

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application
NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 2006848262

Country of ref document: EP