WO2007056599A3 - Liquid cooling for backlit displays - Google Patents

Liquid cooling for backlit displays Download PDF

Info

Publication number
WO2007056599A3
WO2007056599A3 PCT/US2006/043999 US2006043999W WO2007056599A3 WO 2007056599 A3 WO2007056599 A3 WO 2007056599A3 US 2006043999 W US2006043999 W US 2006043999W WO 2007056599 A3 WO2007056599 A3 WO 2007056599A3
Authority
WO
WIPO (PCT)
Prior art keywords
cooling system
radiator
pump
heat collector
liquid cooling
Prior art date
Application number
PCT/US2006/043999
Other languages
French (fr)
Other versions
WO2007056599A2 (en
Inventor
Mark Munch
Girish Upadhya
Original Assignee
Cooligy Inc
Mark Munch
Girish Upadhya
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cooligy Inc, Mark Munch, Girish Upadhya filed Critical Cooligy Inc
Priority to EP06837451A priority Critical patent/EP1949439A2/en
Publication of WO2007056599A2 publication Critical patent/WO2007056599A2/en
Publication of WO2007056599A3 publication Critical patent/WO2007056599A3/en

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1335Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336Illuminating devices
    • G02F1/133602Direct backlight
    • G02F1/133603Direct backlight with LEDs
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/1601Constructional details related to the housing of computer displays, e.g. of CRT monitors, of flat displays
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1335Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336Illuminating devices
    • G02F1/133628Illuminating devices with cooling means
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/16Indexing scheme relating to G06F1/16 - G06F1/18
    • G06F2200/161Indexing scheme relating to constructional details of the monitor
    • G06F2200/1612Flat panel monitor
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20Indexing scheme relating to G06F1/20
    • G06F2200/201Cooling arrangements using cooling fluid

Abstract

The present invention provides a cooling system for a backlit device. The cooling system has a first heat collector that comprises a micro tube. The first heat collector is for maintaining contact with the backlit device. The cooling system also has a first radiator, a first pump, an interconnecting tubing, a fluid, and optionally a fan and/or a reservoir. The first radiator is for distributing and/or dispersing heat, the first pump is for driving a fluid flow, and the reservoir is for storing the fluid. The interconnect tubing is interposed between the first heat collector, the first radiator, and the first pump to form a closed cooling loop. Some embodiments further provide a method of cooling a backlit device by using such a cooling system.
PCT/US2006/043999 2005-11-09 2006-11-09 Liquid cooling for backlit displays WO2007056599A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP06837451A EP1949439A2 (en) 2005-11-09 2006-11-09 Liquid cooling for backlit displays

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US73575705P 2005-11-09 2005-11-09
US60/735,757 2005-11-09
US11/595,489 US20070114010A1 (en) 2005-11-09 2006-11-08 Liquid cooling for backlit displays
US11/595,489 2006-11-08

Publications (2)

Publication Number Publication Date
WO2007056599A2 WO2007056599A2 (en) 2007-05-18
WO2007056599A3 true WO2007056599A3 (en) 2007-11-15

Family

ID=38024024

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2006/043999 WO2007056599A2 (en) 2005-11-09 2006-11-09 Liquid cooling for backlit displays

Country Status (4)

Country Link
US (1) US20070114010A1 (en)
EP (1) EP1949439A2 (en)
KR (1) KR20080070001A (en)
WO (1) WO2007056599A2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109257913A (en) * 2018-11-05 2019-01-22 温州职业技术学院 A kind of water proof radiating base station equipment based on 5G communication

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100687926B1 (en) 2005-06-13 2007-02-27 삼성전자주식회사 Liquid crystal display
KR100978045B1 (en) 2006-03-13 2010-08-26 삼성전자주식회사 Lyquid crystal panel assembly and lyquid crystal display having the same
US10655837B1 (en) 2007-11-13 2020-05-19 Silescent Lighting Corporation Light fixture assembly having a heat conductive cover with sufficiently large surface area for improved heat dissipation
US9102857B2 (en) 2008-03-02 2015-08-11 Lumenetix, Inc. Methods of selecting one or more phase change materials to match a working temperature of a light-emitting diode to be cooled
US7810965B2 (en) * 2008-03-02 2010-10-12 Lumenetix, Inc. Heat removal system and method for light emitting diode lighting apparatus
US8651704B1 (en) 2008-12-05 2014-02-18 Musco Corporation Solid state light fixture with cooling system with heat rejection management
US7969075B2 (en) * 2009-02-10 2011-06-28 Lumenetix, Inc. Thermal storage system using encapsulated phase change materials in LED lamps
WO2011089778A1 (en) * 2010-01-25 2011-07-28 シャープ株式会社 Lighting device, display device, and television reception device
US8123389B2 (en) 2010-02-12 2012-02-28 Lumenetix, Inc. LED lamp assembly with thermal management system
CN103069472B (en) * 2010-05-31 2016-06-15 日本电气株式会社 Display device
GB2498787A (en) * 2012-01-29 2013-07-31 Guy Hutchins Cooling device for computer displays
KR20140006203A (en) 2012-06-27 2014-01-16 삼성디스플레이 주식회사 Display device
US9313849B2 (en) 2013-01-23 2016-04-12 Silescent Lighting Corporation Dimming control system for solid state illumination source
US9192001B2 (en) 2013-03-15 2015-11-17 Ambionce Systems Llc. Reactive power balancing current limited power supply for driving floating DC loads
US9410688B1 (en) 2014-05-09 2016-08-09 Mark Sutherland Heat dissipating assembly
US9380653B1 (en) 2014-10-31 2016-06-28 Dale Stepps Driver assembly for solid state lighting
KR101652683B1 (en) 2015-03-31 2016-08-31 (주)에스에스테크 Water Cooled Back Light Unit by Convection in Liquid Crystal Display
KR102297410B1 (en) 2016-12-28 2021-09-03 삼성전자주식회사 Outdoor display apparatus
KR102630528B1 (en) * 2021-06-30 2024-01-30 주식회사 엠알케이 Backlight cooling device with cooling channel

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040188064A1 (en) * 2002-11-01 2004-09-30 Cooligy Inc. Channeled flat plate fin heat exchange system, device and method
US6930737B2 (en) * 2001-01-16 2005-08-16 Visteon Global Technologies, Inc. LED backlighting system
US20050211427A1 (en) * 2002-11-01 2005-09-29 Cooligy, Inc. Method and apparatus for flexible fluid delivery for cooling desired hot spots in a heat producing device

Family Cites Families (98)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2039593A (en) * 1935-06-20 1936-05-05 Theodore N Hubbuch Heat transfer coil
US3361195A (en) * 1966-09-23 1968-01-02 Westinghouse Electric Corp Heat sink member for a semiconductor device
DE2102254B2 (en) * 1971-01-19 1973-05-30 Robert Bosch Gmbh, 7000 Stuttgart COOLING DEVICE FOR POWER SEMICONDUCTOR COMPONENTS
FR2216537B1 (en) * 1973-02-06 1975-03-07 Gaz De France
US4312012A (en) * 1977-11-25 1982-01-19 International Business Machines Corp. Nucleate boiling surface for increasing the heat transfer from a silicon device to a liquid coolant
US4203488A (en) * 1978-03-01 1980-05-20 Aavid Engineering, Inc. Self-fastened heat sinks
US4332291A (en) * 1979-12-21 1982-06-01 D. Mulock-Bentley And Associates (Proprietary) Limited Heat exchanger with slotted fin strips
US4450472A (en) * 1981-03-02 1984-05-22 The Board Of Trustees Of The Leland Stanford Junior University Method and means for improved heat removal in compact semiconductor integrated circuits and similar devices utilizing coolant chambers and microscopic channels
US4573067A (en) * 1981-03-02 1986-02-25 The Board Of Trustees Of The Leland Stanford Junior University Method and means for improved heat removal in compact semiconductor integrated circuits
US4574876A (en) * 1981-05-11 1986-03-11 Extracorporeal Medical Specialties, Inc. Container with tapered walls for heating or cooling fluids
US4516632A (en) * 1982-08-31 1985-05-14 The United States Of America As Represented By The United States Deparment Of Energy Microchannel crossflow fluid heat exchanger and method for its fabrication
US4567505A (en) * 1983-10-27 1986-01-28 The Board Of Trustees Of The Leland Stanford Junior University Heat sink and method of attaching heat sink to a semiconductor integrated circuit and the like
US4758926A (en) * 1986-03-31 1988-07-19 Microelectronics And Computer Technology Corporation Fluid-cooled integrated circuit package
US4903761A (en) * 1987-06-03 1990-02-27 Lockheed Missiles & Space Company, Inc. Wick assembly for self-regulated fluid management in a pumped two-phase heat transfer system
US5016138A (en) * 1987-10-27 1991-05-14 Woodman John K Three dimensional integrated circuit package
US4894709A (en) * 1988-03-09 1990-01-16 Massachusetts Institute Of Technology Forced-convection, liquid-cooled, microchannel heat sinks
US4896719A (en) * 1988-05-11 1990-01-30 Mcdonnell Douglas Corporation Isothermal panel and plenum
US4908112A (en) * 1988-06-16 1990-03-13 E. I. Du Pont De Nemours & Co. Silicon semiconductor wafer for analyzing micronic biological samples
US4938280A (en) * 1988-11-07 1990-07-03 Clark William E Liquid-cooled, flat plate heat exchanger
US5009760A (en) * 1989-07-28 1991-04-23 Board Of Trustees Of The Leland Stanford Junior University System for measuring electrokinetic properties and for characterizing electrokinetic separations by monitoring current in electrophoresis
US5083194A (en) * 1990-01-16 1992-01-21 Cray Research, Inc. Air jet impingement on miniature pin-fin heat sinks for cooling electronic components
US4987996A (en) * 1990-03-15 1991-01-29 Atco Rubber Products, Inc. Flexible duct and carton
US5016090A (en) * 1990-03-21 1991-05-14 International Business Machines Corporation Cross-hatch flow distribution and applications thereof
US5265670A (en) * 1990-04-27 1993-11-30 International Business Machines Corporation Convection transfer system
JPH07114250B2 (en) * 1990-04-27 1995-12-06 インターナショナル・ビジネス・マシーンズ・コーポレイション Heat transfer system
US5088005A (en) * 1990-05-08 1992-02-11 Sundstrand Corporation Cold plate for cooling electronics
US5203401A (en) * 1990-06-29 1993-04-20 Digital Equipment Corporation Wet micro-channel wafer chuck and cooling method
US5285347A (en) * 1990-07-02 1994-02-08 Digital Equipment Corporation Hybird cooling system for electronic components
US5099910A (en) * 1991-01-15 1992-03-31 Massachusetts Institute Of Technology Microchannel heat sink with alternating flow directions
US5099311A (en) * 1991-01-17 1992-03-24 The United States Of America As Represented By The United States Department Of Energy Microchannel heat sink assembly
JPH06342990A (en) * 1991-02-04 1994-12-13 Internatl Business Mach Corp <Ibm> Integrated cooling system
US5131233A (en) * 1991-03-08 1992-07-21 Cray Computer Corporation Gas-liquid forced turbulence cooling
US5125451A (en) * 1991-04-02 1992-06-30 Microunity Systems Engineering, Inc. Heat exchanger for solid-state electronic devices
US5105430A (en) * 1991-04-09 1992-04-14 The United States Of America As Represented By The United States Department Of Energy Thin planar package for cooling an array of edge-emitting laser diodes
FR2679729B1 (en) * 1991-07-23 1994-04-29 Alcatel Telspace HEATSINK.
US5228502A (en) * 1991-09-04 1993-07-20 International Business Machines Corporation Cooling by use of multiple parallel convective surfaces
DE69305667T2 (en) * 1992-03-09 1997-05-28 Sumitomo Metal Ind Heat sink with good heat dissipating properties and manufacturing processes
US5218515A (en) * 1992-03-13 1993-06-08 The United States Of America As Represented By The United States Department Of Energy Microchannel cooling of face down bonded chips
US5317805A (en) * 1992-04-28 1994-06-07 Minnesota Mining And Manufacturing Company Method of making microchanneled heat exchangers utilizing sacrificial cores
US5294834A (en) * 1992-06-01 1994-03-15 Sverdrup Technology, Inc. Low resistance contacts for shallow junction semiconductors
US5275237A (en) * 1992-06-12 1994-01-04 Micron Technology, Inc. Liquid filled hot plate for precise temperature control
US5308429A (en) * 1992-09-29 1994-05-03 Digital Equipment Corporation System for bonding a heatsink to a semiconductor chip package
US5316077A (en) * 1992-12-09 1994-05-31 Eaton Corporation Heat sink for electrical circuit components
US5520244A (en) * 1992-12-16 1996-05-28 Sdl, Inc. Micropost waste heat removal system
US5299635A (en) * 1993-03-05 1994-04-05 Wynn's Climate Systems, Inc. Parallel flow condenser baffle
US5427174A (en) * 1993-04-30 1995-06-27 Heat Transfer Devices, Inc. Method and apparatus for a self contained heat exchanger
US5424918A (en) * 1994-03-31 1995-06-13 Hewlett-Packard Company Universal hybrid mounting system
US5731954A (en) * 1996-08-22 1998-03-24 Cheon; Kioan Cooling system for computer
US5927390A (en) * 1996-12-13 1999-07-27 Caterpillar Inc. Radiator arrangement with offset modular cores
US5901037A (en) * 1997-06-18 1999-05-04 Northrop Grumman Corporation Closed loop liquid cooling for semiconductor RF amplifier modules
US6049040A (en) * 1997-09-17 2000-04-11 Biles; Scott Douglas Universal cable guide
US6084178A (en) * 1998-02-27 2000-07-04 Hewlett-Packard Company Perimeter clamp for mounting and aligning a semiconductor component as part of a field replaceable unit (FRU)
US6019165A (en) * 1998-05-18 2000-02-01 Batchelder; John Samuel Heat exchange apparatus
US6227287B1 (en) * 1998-05-25 2001-05-08 Denso Corporation Cooling apparatus by boiling and cooling refrigerant
US6086330A (en) * 1998-12-21 2000-07-11 Motorola, Inc. Low-noise, high-performance fan
JP3518434B2 (en) * 1999-08-11 2004-04-12 株式会社日立製作所 Multi-chip module cooling system
US6360814B1 (en) * 1999-08-31 2002-03-26 Denso Corporation Cooling device boiling and condensing refrigerant
GB9922124D0 (en) * 1999-09-17 1999-11-17 Pfizer Ltd Phosphodiesterase enzymes
JP2001185306A (en) * 1999-12-28 2001-07-06 Jst Mfg Co Ltd Connector for module
US6570764B2 (en) * 1999-12-29 2003-05-27 Intel Corporation Low thermal resistance interface for attachment of thermal materials to a processor die
US6253835B1 (en) * 2000-02-11 2001-07-03 International Business Machines Corporation Isothermal heat sink with converging, diverging channels
US6366462B1 (en) * 2000-07-18 2002-04-02 International Business Machines Corporation Electronic module with integral refrigerant evaporator assembly and control system therefore
US6469893B1 (en) * 2000-09-29 2002-10-22 Intel Corporation Direct heatpipe attachment to die using center point loading
US6367544B1 (en) * 2000-11-21 2002-04-09 Thermal Corp. Thermal jacket for reducing condensation and method for making same
US6367543B1 (en) * 2000-12-11 2002-04-09 Thermal Corp. Liquid-cooled heat sink with thermal jacket
US6519151B2 (en) * 2001-06-27 2003-02-11 International Business Machines Corporation Conic-sectioned plate and jet nozzle assembly for use in cooling an electronic module, and methods of fabrication thereof
US6536510B2 (en) * 2001-07-10 2003-03-25 Thermal Corp. Thermal bus for cabinets housing high power electronics equipment
US6385044B1 (en) * 2001-07-27 2002-05-07 International Business Machines Corporation Heat pipe heat sink assembly for cooling semiconductor chips
JP3636118B2 (en) * 2001-09-04 2005-04-06 株式会社日立製作所 Water cooling device for electronic equipment
US6942018B2 (en) * 2001-09-28 2005-09-13 The Board Of Trustees Of The Leland Stanford Junior University Electroosmotic microchannel cooling system
US6581388B2 (en) * 2001-11-27 2003-06-24 Sun Microsystems, Inc. Active temperature gradient reducer
US6700785B2 (en) * 2002-01-04 2004-03-02 Intel Corporation Computer system which locks a server unit subassembly in a selected position in a support frame
US6679315B2 (en) * 2002-01-14 2004-01-20 Marconi Communications, Inc. Small scale chip cooler assembly
US7209355B2 (en) * 2002-05-15 2007-04-24 Matsushita Electric Industrial Co., Ltd. Cooling device and an electronic apparatus including the same
US6674642B1 (en) * 2002-06-27 2004-01-06 International Business Machines Corporation Liquid-to-air cooling system for portable electronic and computer devices
US20040008483A1 (en) * 2002-07-13 2004-01-15 Kioan Cheon Water cooling type cooling system for electronic device
TW578992U (en) * 2002-09-09 2004-03-01 Hon Hai Prec Ind Co Ltd Heat sink assembly
US6894899B2 (en) * 2002-09-13 2005-05-17 Hong Kong Cheung Tat Electrical Co. Ltd. Integrated fluid cooling system for electronic components
DE10243026B3 (en) * 2002-09-13 2004-06-03 Oliver Laing Device for local cooling or heating of an object
US7000684B2 (en) * 2002-11-01 2006-02-21 Cooligy, Inc. Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device
US6986382B2 (en) * 2002-11-01 2006-01-17 Cooligy Inc. Interwoven manifolds for pressure drop reduction in microchannel heat exchangers
JP2006516068A (en) * 2002-11-01 2006-06-15 クーリギー インコーポレイテッド Method and apparatus for achieving temperature uniformity and hot spot cooling in a heat generating device
US20060060333A1 (en) * 2002-11-05 2006-03-23 Lalit Chordia Methods and apparatuses for electronics cooling
US7210227B2 (en) * 2002-11-26 2007-05-01 Intel Corporation Decreasing thermal contact resistance at a material interface
US6903929B2 (en) * 2003-03-31 2005-06-07 Intel Corporation Two-phase cooling utilizing microchannel heat exchangers and channeled heat sink
US6992891B2 (en) * 2003-04-02 2006-01-31 Intel Corporation Metal ball attachment of heat dissipation devices
CN100579348C (en) * 2003-06-27 2010-01-06 日本电气株式会社 Cooler for electronic equipment
US7508672B2 (en) * 2003-09-10 2009-03-24 Qnx Cooling Systems Inc. Cooling system
TWM248227U (en) * 2003-10-17 2004-10-21 Hon Hai Prec Ind Co Ltd Liquid cooling apparatus
US7273088B2 (en) * 2003-12-17 2007-09-25 Hewlett-Packard Development Company, L.P. One or more heat exchanger components in major part operably locatable outside computer chassis
US6980435B2 (en) * 2004-01-28 2005-12-27 Hewlett-Packard Development Company, L.P. Modular electronic enclosure with cooling design
JP4056504B2 (en) * 2004-08-18 2008-03-05 Necディスプレイソリューションズ株式会社 COOLING DEVICE AND ELECTRONIC DEVICE HAVING THE SAME
US7239516B2 (en) * 2004-09-10 2007-07-03 International Business Machines Corporation Flexure plate for maintaining contact between a cooling plate/heat sink and a microchip
US7243704B2 (en) * 2004-11-18 2007-07-17 Delta Design, Inc. Mechanical assembly for regulating the temperature of an electronic device, having a spring with one slideable end
US7184269B2 (en) * 2004-12-09 2007-02-27 International Business Machines Company Cooling apparatus and method for an electronics module employing an integrated heat exchange assembly
US7327570B2 (en) * 2004-12-22 2008-02-05 Hewlett-Packard Development Company, L.P. Fluid cooled integrated circuit module
US7719837B2 (en) * 2005-08-22 2010-05-18 Shan Ping Wu Method and apparatus for cooling a blade server
US20080013283A1 (en) * 2006-07-17 2008-01-17 Gilbert Gary L Mechanism for cooling electronic components

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6930737B2 (en) * 2001-01-16 2005-08-16 Visteon Global Technologies, Inc. LED backlighting system
US20040188064A1 (en) * 2002-11-01 2004-09-30 Cooligy Inc. Channeled flat plate fin heat exchange system, device and method
US20050211427A1 (en) * 2002-11-01 2005-09-29 Cooligy, Inc. Method and apparatus for flexible fluid delivery for cooling desired hot spots in a heat producing device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109257913A (en) * 2018-11-05 2019-01-22 温州职业技术学院 A kind of water proof radiating base station equipment based on 5G communication
CN109257913B (en) * 2018-11-05 2020-01-07 温州职业技术学院 Waterproof heat dissipation type base station equipment based on 5G communication

Also Published As

Publication number Publication date
EP1949439A2 (en) 2008-07-30
KR20080070001A (en) 2008-07-29
US20070114010A1 (en) 2007-05-24
WO2007056599A2 (en) 2007-05-18

Similar Documents

Publication Publication Date Title
WO2007056599A3 (en) Liquid cooling for backlit displays
WO2007114913A3 (en) Multi device cooling
WO2007101197A3 (en) A thermoelectric fluid heat exchange system
WO2006019219A3 (en) Cooling apparatus of looped heat pipe structure
WO2017223232A3 (en) Integrated coolant bottle assembly
FR2903222B1 (en) PASSIVE THERMAL CONTROL ARRANGEMENT BASED ON DIPHASIC FLUID LOOP WITH CAPILLARY PUMPING WITH THERMAL CAPACITY.
WO2008042193A3 (en) Cold plate and mating manifold plate for ic device cooling system enabling the shipment of cooling system pre-charged with liquid coolant
EP2012017A3 (en) Capacity modulated compressor
WO2007098077A3 (en) Liquid cooling loops for server applications
WO2006071930A3 (en) Fluidic pump for heat management
TW200708237A (en) Integrated liquid cooling system
WO2008005320A3 (en) Heat pump liquid heater
WO2009053726A3 (en) Heat pump
EP2133735A3 (en) Liquid crystal display device with means for cooling the display panel
EP2518585A3 (en) Thermosiphon Systems for Electronic Devices
WO2007048942A3 (en) Variable pressure drop and/or closing and sealing devices with internal cartridge and mobile tube
WO2004064622A3 (en) Method and apparatus for managing temperature in a patient
WO2007121997A3 (en) Discharge device and method for evaporating a liquid and evaporator
WO2007002939A3 (en) System for liquid cooling of electrical components
SE0402206D0 (en) Device for flow control of a medium in a heating and cooling system
EP2757584A3 (en) Integrated thin film evaporation thermal spreader and planar heat pipe heat sink
WO2007033165A3 (en) Liquid dispensing system and method
WO2010010102A3 (en) Device for varying the pressure of a pneumatic fluid by displacing drops of liquid and heat pump using such a device
ATE391241T1 (en) FLUID COOLING DEVICE
FR2974624B1 (en) ASSEMBLY COMPRISING A REFRIGERANT FLUID CIRCUIT AND A HEAT TRANSFER CIRCUIT

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application
NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 1020087011560

Country of ref document: KR

WWE Wipo information: entry into national phase

Ref document number: 2006837451

Country of ref document: EP