WO2007056599A3 - Liquid cooling for backlit displays - Google Patents
Liquid cooling for backlit displays Download PDFInfo
- Publication number
- WO2007056599A3 WO2007056599A3 PCT/US2006/043999 US2006043999W WO2007056599A3 WO 2007056599 A3 WO2007056599 A3 WO 2007056599A3 US 2006043999 W US2006043999 W US 2006043999W WO 2007056599 A3 WO2007056599 A3 WO 2007056599A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- cooling system
- radiator
- pump
- heat collector
- liquid cooling
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133603—Direct backlight with LEDs
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1601—Constructional details related to the housing of computer displays, e.g. of CRT monitors, of flat displays
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133628—Illuminating devices with cooling means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/16—Indexing scheme relating to G06F1/16 - G06F1/18
- G06F2200/161—Indexing scheme relating to constructional details of the monitor
- G06F2200/1612—Flat panel monitor
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
Abstract
The present invention provides a cooling system for a backlit device. The cooling system has a first heat collector that comprises a micro tube. The first heat collector is for maintaining contact with the backlit device. The cooling system also has a first radiator, a first pump, an interconnecting tubing, a fluid, and optionally a fan and/or a reservoir. The first radiator is for distributing and/or dispersing heat, the first pump is for driving a fluid flow, and the reservoir is for storing the fluid. The interconnect tubing is interposed between the first heat collector, the first radiator, and the first pump to form a closed cooling loop. Some embodiments further provide a method of cooling a backlit device by using such a cooling system.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP06837451A EP1949439A2 (en) | 2005-11-09 | 2006-11-09 | Liquid cooling for backlit displays |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US73575705P | 2005-11-09 | 2005-11-09 | |
US60/735,757 | 2005-11-09 | ||
US11/595,489 US20070114010A1 (en) | 2005-11-09 | 2006-11-08 | Liquid cooling for backlit displays |
US11/595,489 | 2006-11-08 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2007056599A2 WO2007056599A2 (en) | 2007-05-18 |
WO2007056599A3 true WO2007056599A3 (en) | 2007-11-15 |
Family
ID=38024024
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2006/043999 WO2007056599A2 (en) | 2005-11-09 | 2006-11-09 | Liquid cooling for backlit displays |
Country Status (4)
Country | Link |
---|---|
US (1) | US20070114010A1 (en) |
EP (1) | EP1949439A2 (en) |
KR (1) | KR20080070001A (en) |
WO (1) | WO2007056599A2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109257913A (en) * | 2018-11-05 | 2019-01-22 | 温州职业技术学院 | A kind of water proof radiating base station equipment based on 5G communication |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100687926B1 (en) | 2005-06-13 | 2007-02-27 | 삼성전자주식회사 | Liquid crystal display |
KR100978045B1 (en) | 2006-03-13 | 2010-08-26 | 삼성전자주식회사 | Lyquid crystal panel assembly and lyquid crystal display having the same |
US10655837B1 (en) | 2007-11-13 | 2020-05-19 | Silescent Lighting Corporation | Light fixture assembly having a heat conductive cover with sufficiently large surface area for improved heat dissipation |
US9102857B2 (en) | 2008-03-02 | 2015-08-11 | Lumenetix, Inc. | Methods of selecting one or more phase change materials to match a working temperature of a light-emitting diode to be cooled |
US7810965B2 (en) * | 2008-03-02 | 2010-10-12 | Lumenetix, Inc. | Heat removal system and method for light emitting diode lighting apparatus |
US8651704B1 (en) | 2008-12-05 | 2014-02-18 | Musco Corporation | Solid state light fixture with cooling system with heat rejection management |
US7969075B2 (en) * | 2009-02-10 | 2011-06-28 | Lumenetix, Inc. | Thermal storage system using encapsulated phase change materials in LED lamps |
WO2011089778A1 (en) * | 2010-01-25 | 2011-07-28 | シャープ株式会社 | Lighting device, display device, and television reception device |
US8123389B2 (en) | 2010-02-12 | 2012-02-28 | Lumenetix, Inc. | LED lamp assembly with thermal management system |
CN103069472B (en) * | 2010-05-31 | 2016-06-15 | 日本电气株式会社 | Display device |
GB2498787A (en) * | 2012-01-29 | 2013-07-31 | Guy Hutchins | Cooling device for computer displays |
KR20140006203A (en) | 2012-06-27 | 2014-01-16 | 삼성디스플레이 주식회사 | Display device |
US9313849B2 (en) | 2013-01-23 | 2016-04-12 | Silescent Lighting Corporation | Dimming control system for solid state illumination source |
US9192001B2 (en) | 2013-03-15 | 2015-11-17 | Ambionce Systems Llc. | Reactive power balancing current limited power supply for driving floating DC loads |
US9410688B1 (en) | 2014-05-09 | 2016-08-09 | Mark Sutherland | Heat dissipating assembly |
US9380653B1 (en) | 2014-10-31 | 2016-06-28 | Dale Stepps | Driver assembly for solid state lighting |
KR101652683B1 (en) | 2015-03-31 | 2016-08-31 | (주)에스에스테크 | Water Cooled Back Light Unit by Convection in Liquid Crystal Display |
KR102297410B1 (en) | 2016-12-28 | 2021-09-03 | 삼성전자주식회사 | Outdoor display apparatus |
KR102630528B1 (en) * | 2021-06-30 | 2024-01-30 | 주식회사 엠알케이 | Backlight cooling device with cooling channel |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040188064A1 (en) * | 2002-11-01 | 2004-09-30 | Cooligy Inc. | Channeled flat plate fin heat exchange system, device and method |
US6930737B2 (en) * | 2001-01-16 | 2005-08-16 | Visteon Global Technologies, Inc. | LED backlighting system |
US20050211427A1 (en) * | 2002-11-01 | 2005-09-29 | Cooligy, Inc. | Method and apparatus for flexible fluid delivery for cooling desired hot spots in a heat producing device |
Family Cites Families (98)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2039593A (en) * | 1935-06-20 | 1936-05-05 | Theodore N Hubbuch | Heat transfer coil |
US3361195A (en) * | 1966-09-23 | 1968-01-02 | Westinghouse Electric Corp | Heat sink member for a semiconductor device |
DE2102254B2 (en) * | 1971-01-19 | 1973-05-30 | Robert Bosch Gmbh, 7000 Stuttgart | COOLING DEVICE FOR POWER SEMICONDUCTOR COMPONENTS |
FR2216537B1 (en) * | 1973-02-06 | 1975-03-07 | Gaz De France | |
US4312012A (en) * | 1977-11-25 | 1982-01-19 | International Business Machines Corp. | Nucleate boiling surface for increasing the heat transfer from a silicon device to a liquid coolant |
US4203488A (en) * | 1978-03-01 | 1980-05-20 | Aavid Engineering, Inc. | Self-fastened heat sinks |
US4332291A (en) * | 1979-12-21 | 1982-06-01 | D. Mulock-Bentley And Associates (Proprietary) Limited | Heat exchanger with slotted fin strips |
US4450472A (en) * | 1981-03-02 | 1984-05-22 | The Board Of Trustees Of The Leland Stanford Junior University | Method and means for improved heat removal in compact semiconductor integrated circuits and similar devices utilizing coolant chambers and microscopic channels |
US4573067A (en) * | 1981-03-02 | 1986-02-25 | The Board Of Trustees Of The Leland Stanford Junior University | Method and means for improved heat removal in compact semiconductor integrated circuits |
US4574876A (en) * | 1981-05-11 | 1986-03-11 | Extracorporeal Medical Specialties, Inc. | Container with tapered walls for heating or cooling fluids |
US4516632A (en) * | 1982-08-31 | 1985-05-14 | The United States Of America As Represented By The United States Deparment Of Energy | Microchannel crossflow fluid heat exchanger and method for its fabrication |
US4567505A (en) * | 1983-10-27 | 1986-01-28 | The Board Of Trustees Of The Leland Stanford Junior University | Heat sink and method of attaching heat sink to a semiconductor integrated circuit and the like |
US4758926A (en) * | 1986-03-31 | 1988-07-19 | Microelectronics And Computer Technology Corporation | Fluid-cooled integrated circuit package |
US4903761A (en) * | 1987-06-03 | 1990-02-27 | Lockheed Missiles & Space Company, Inc. | Wick assembly for self-regulated fluid management in a pumped two-phase heat transfer system |
US5016138A (en) * | 1987-10-27 | 1991-05-14 | Woodman John K | Three dimensional integrated circuit package |
US4894709A (en) * | 1988-03-09 | 1990-01-16 | Massachusetts Institute Of Technology | Forced-convection, liquid-cooled, microchannel heat sinks |
US4896719A (en) * | 1988-05-11 | 1990-01-30 | Mcdonnell Douglas Corporation | Isothermal panel and plenum |
US4908112A (en) * | 1988-06-16 | 1990-03-13 | E. I. Du Pont De Nemours & Co. | Silicon semiconductor wafer for analyzing micronic biological samples |
US4938280A (en) * | 1988-11-07 | 1990-07-03 | Clark William E | Liquid-cooled, flat plate heat exchanger |
US5009760A (en) * | 1989-07-28 | 1991-04-23 | Board Of Trustees Of The Leland Stanford Junior University | System for measuring electrokinetic properties and for characterizing electrokinetic separations by monitoring current in electrophoresis |
US5083194A (en) * | 1990-01-16 | 1992-01-21 | Cray Research, Inc. | Air jet impingement on miniature pin-fin heat sinks for cooling electronic components |
US4987996A (en) * | 1990-03-15 | 1991-01-29 | Atco Rubber Products, Inc. | Flexible duct and carton |
US5016090A (en) * | 1990-03-21 | 1991-05-14 | International Business Machines Corporation | Cross-hatch flow distribution and applications thereof |
US5265670A (en) * | 1990-04-27 | 1993-11-30 | International Business Machines Corporation | Convection transfer system |
JPH07114250B2 (en) * | 1990-04-27 | 1995-12-06 | インターナショナル・ビジネス・マシーンズ・コーポレイション | Heat transfer system |
US5088005A (en) * | 1990-05-08 | 1992-02-11 | Sundstrand Corporation | Cold plate for cooling electronics |
US5203401A (en) * | 1990-06-29 | 1993-04-20 | Digital Equipment Corporation | Wet micro-channel wafer chuck and cooling method |
US5285347A (en) * | 1990-07-02 | 1994-02-08 | Digital Equipment Corporation | Hybird cooling system for electronic components |
US5099910A (en) * | 1991-01-15 | 1992-03-31 | Massachusetts Institute Of Technology | Microchannel heat sink with alternating flow directions |
US5099311A (en) * | 1991-01-17 | 1992-03-24 | The United States Of America As Represented By The United States Department Of Energy | Microchannel heat sink assembly |
JPH06342990A (en) * | 1991-02-04 | 1994-12-13 | Internatl Business Mach Corp <Ibm> | Integrated cooling system |
US5131233A (en) * | 1991-03-08 | 1992-07-21 | Cray Computer Corporation | Gas-liquid forced turbulence cooling |
US5125451A (en) * | 1991-04-02 | 1992-06-30 | Microunity Systems Engineering, Inc. | Heat exchanger for solid-state electronic devices |
US5105430A (en) * | 1991-04-09 | 1992-04-14 | The United States Of America As Represented By The United States Department Of Energy | Thin planar package for cooling an array of edge-emitting laser diodes |
FR2679729B1 (en) * | 1991-07-23 | 1994-04-29 | Alcatel Telspace | HEATSINK. |
US5228502A (en) * | 1991-09-04 | 1993-07-20 | International Business Machines Corporation | Cooling by use of multiple parallel convective surfaces |
DE69305667T2 (en) * | 1992-03-09 | 1997-05-28 | Sumitomo Metal Ind | Heat sink with good heat dissipating properties and manufacturing processes |
US5218515A (en) * | 1992-03-13 | 1993-06-08 | The United States Of America As Represented By The United States Department Of Energy | Microchannel cooling of face down bonded chips |
US5317805A (en) * | 1992-04-28 | 1994-06-07 | Minnesota Mining And Manufacturing Company | Method of making microchanneled heat exchangers utilizing sacrificial cores |
US5294834A (en) * | 1992-06-01 | 1994-03-15 | Sverdrup Technology, Inc. | Low resistance contacts for shallow junction semiconductors |
US5275237A (en) * | 1992-06-12 | 1994-01-04 | Micron Technology, Inc. | Liquid filled hot plate for precise temperature control |
US5308429A (en) * | 1992-09-29 | 1994-05-03 | Digital Equipment Corporation | System for bonding a heatsink to a semiconductor chip package |
US5316077A (en) * | 1992-12-09 | 1994-05-31 | Eaton Corporation | Heat sink for electrical circuit components |
US5520244A (en) * | 1992-12-16 | 1996-05-28 | Sdl, Inc. | Micropost waste heat removal system |
US5299635A (en) * | 1993-03-05 | 1994-04-05 | Wynn's Climate Systems, Inc. | Parallel flow condenser baffle |
US5427174A (en) * | 1993-04-30 | 1995-06-27 | Heat Transfer Devices, Inc. | Method and apparatus for a self contained heat exchanger |
US5424918A (en) * | 1994-03-31 | 1995-06-13 | Hewlett-Packard Company | Universal hybrid mounting system |
US5731954A (en) * | 1996-08-22 | 1998-03-24 | Cheon; Kioan | Cooling system for computer |
US5927390A (en) * | 1996-12-13 | 1999-07-27 | Caterpillar Inc. | Radiator arrangement with offset modular cores |
US5901037A (en) * | 1997-06-18 | 1999-05-04 | Northrop Grumman Corporation | Closed loop liquid cooling for semiconductor RF amplifier modules |
US6049040A (en) * | 1997-09-17 | 2000-04-11 | Biles; Scott Douglas | Universal cable guide |
US6084178A (en) * | 1998-02-27 | 2000-07-04 | Hewlett-Packard Company | Perimeter clamp for mounting and aligning a semiconductor component as part of a field replaceable unit (FRU) |
US6019165A (en) * | 1998-05-18 | 2000-02-01 | Batchelder; John Samuel | Heat exchange apparatus |
US6227287B1 (en) * | 1998-05-25 | 2001-05-08 | Denso Corporation | Cooling apparatus by boiling and cooling refrigerant |
US6086330A (en) * | 1998-12-21 | 2000-07-11 | Motorola, Inc. | Low-noise, high-performance fan |
JP3518434B2 (en) * | 1999-08-11 | 2004-04-12 | 株式会社日立製作所 | Multi-chip module cooling system |
US6360814B1 (en) * | 1999-08-31 | 2002-03-26 | Denso Corporation | Cooling device boiling and condensing refrigerant |
GB9922124D0 (en) * | 1999-09-17 | 1999-11-17 | Pfizer Ltd | Phosphodiesterase enzymes |
JP2001185306A (en) * | 1999-12-28 | 2001-07-06 | Jst Mfg Co Ltd | Connector for module |
US6570764B2 (en) * | 1999-12-29 | 2003-05-27 | Intel Corporation | Low thermal resistance interface for attachment of thermal materials to a processor die |
US6253835B1 (en) * | 2000-02-11 | 2001-07-03 | International Business Machines Corporation | Isothermal heat sink with converging, diverging channels |
US6366462B1 (en) * | 2000-07-18 | 2002-04-02 | International Business Machines Corporation | Electronic module with integral refrigerant evaporator assembly and control system therefore |
US6469893B1 (en) * | 2000-09-29 | 2002-10-22 | Intel Corporation | Direct heatpipe attachment to die using center point loading |
US6367544B1 (en) * | 2000-11-21 | 2002-04-09 | Thermal Corp. | Thermal jacket for reducing condensation and method for making same |
US6367543B1 (en) * | 2000-12-11 | 2002-04-09 | Thermal Corp. | Liquid-cooled heat sink with thermal jacket |
US6519151B2 (en) * | 2001-06-27 | 2003-02-11 | International Business Machines Corporation | Conic-sectioned plate and jet nozzle assembly for use in cooling an electronic module, and methods of fabrication thereof |
US6536510B2 (en) * | 2001-07-10 | 2003-03-25 | Thermal Corp. | Thermal bus for cabinets housing high power electronics equipment |
US6385044B1 (en) * | 2001-07-27 | 2002-05-07 | International Business Machines Corporation | Heat pipe heat sink assembly for cooling semiconductor chips |
JP3636118B2 (en) * | 2001-09-04 | 2005-04-06 | 株式会社日立製作所 | Water cooling device for electronic equipment |
US6942018B2 (en) * | 2001-09-28 | 2005-09-13 | The Board Of Trustees Of The Leland Stanford Junior University | Electroosmotic microchannel cooling system |
US6581388B2 (en) * | 2001-11-27 | 2003-06-24 | Sun Microsystems, Inc. | Active temperature gradient reducer |
US6700785B2 (en) * | 2002-01-04 | 2004-03-02 | Intel Corporation | Computer system which locks a server unit subassembly in a selected position in a support frame |
US6679315B2 (en) * | 2002-01-14 | 2004-01-20 | Marconi Communications, Inc. | Small scale chip cooler assembly |
US7209355B2 (en) * | 2002-05-15 | 2007-04-24 | Matsushita Electric Industrial Co., Ltd. | Cooling device and an electronic apparatus including the same |
US6674642B1 (en) * | 2002-06-27 | 2004-01-06 | International Business Machines Corporation | Liquid-to-air cooling system for portable electronic and computer devices |
US20040008483A1 (en) * | 2002-07-13 | 2004-01-15 | Kioan Cheon | Water cooling type cooling system for electronic device |
TW578992U (en) * | 2002-09-09 | 2004-03-01 | Hon Hai Prec Ind Co Ltd | Heat sink assembly |
US6894899B2 (en) * | 2002-09-13 | 2005-05-17 | Hong Kong Cheung Tat Electrical Co. Ltd. | Integrated fluid cooling system for electronic components |
DE10243026B3 (en) * | 2002-09-13 | 2004-06-03 | Oliver Laing | Device for local cooling or heating of an object |
US7000684B2 (en) * | 2002-11-01 | 2006-02-21 | Cooligy, Inc. | Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device |
US6986382B2 (en) * | 2002-11-01 | 2006-01-17 | Cooligy Inc. | Interwoven manifolds for pressure drop reduction in microchannel heat exchangers |
JP2006516068A (en) * | 2002-11-01 | 2006-06-15 | クーリギー インコーポレイテッド | Method and apparatus for achieving temperature uniformity and hot spot cooling in a heat generating device |
US20060060333A1 (en) * | 2002-11-05 | 2006-03-23 | Lalit Chordia | Methods and apparatuses for electronics cooling |
US7210227B2 (en) * | 2002-11-26 | 2007-05-01 | Intel Corporation | Decreasing thermal contact resistance at a material interface |
US6903929B2 (en) * | 2003-03-31 | 2005-06-07 | Intel Corporation | Two-phase cooling utilizing microchannel heat exchangers and channeled heat sink |
US6992891B2 (en) * | 2003-04-02 | 2006-01-31 | Intel Corporation | Metal ball attachment of heat dissipation devices |
CN100579348C (en) * | 2003-06-27 | 2010-01-06 | 日本电气株式会社 | Cooler for electronic equipment |
US7508672B2 (en) * | 2003-09-10 | 2009-03-24 | Qnx Cooling Systems Inc. | Cooling system |
TWM248227U (en) * | 2003-10-17 | 2004-10-21 | Hon Hai Prec Ind Co Ltd | Liquid cooling apparatus |
US7273088B2 (en) * | 2003-12-17 | 2007-09-25 | Hewlett-Packard Development Company, L.P. | One or more heat exchanger components in major part operably locatable outside computer chassis |
US6980435B2 (en) * | 2004-01-28 | 2005-12-27 | Hewlett-Packard Development Company, L.P. | Modular electronic enclosure with cooling design |
JP4056504B2 (en) * | 2004-08-18 | 2008-03-05 | Necディスプレイソリューションズ株式会社 | COOLING DEVICE AND ELECTRONIC DEVICE HAVING THE SAME |
US7239516B2 (en) * | 2004-09-10 | 2007-07-03 | International Business Machines Corporation | Flexure plate for maintaining contact between a cooling plate/heat sink and a microchip |
US7243704B2 (en) * | 2004-11-18 | 2007-07-17 | Delta Design, Inc. | Mechanical assembly for regulating the temperature of an electronic device, having a spring with one slideable end |
US7184269B2 (en) * | 2004-12-09 | 2007-02-27 | International Business Machines Company | Cooling apparatus and method for an electronics module employing an integrated heat exchange assembly |
US7327570B2 (en) * | 2004-12-22 | 2008-02-05 | Hewlett-Packard Development Company, L.P. | Fluid cooled integrated circuit module |
US7719837B2 (en) * | 2005-08-22 | 2010-05-18 | Shan Ping Wu | Method and apparatus for cooling a blade server |
US20080013283A1 (en) * | 2006-07-17 | 2008-01-17 | Gilbert Gary L | Mechanism for cooling electronic components |
-
2006
- 2006-11-08 US US11/595,489 patent/US20070114010A1/en not_active Abandoned
- 2006-11-09 EP EP06837451A patent/EP1949439A2/en not_active Withdrawn
- 2006-11-09 WO PCT/US2006/043999 patent/WO2007056599A2/en active Application Filing
- 2006-11-09 KR KR1020087011560A patent/KR20080070001A/en not_active Application Discontinuation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6930737B2 (en) * | 2001-01-16 | 2005-08-16 | Visteon Global Technologies, Inc. | LED backlighting system |
US20040188064A1 (en) * | 2002-11-01 | 2004-09-30 | Cooligy Inc. | Channeled flat plate fin heat exchange system, device and method |
US20050211427A1 (en) * | 2002-11-01 | 2005-09-29 | Cooligy, Inc. | Method and apparatus for flexible fluid delivery for cooling desired hot spots in a heat producing device |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109257913A (en) * | 2018-11-05 | 2019-01-22 | 温州职业技术学院 | A kind of water proof radiating base station equipment based on 5G communication |
CN109257913B (en) * | 2018-11-05 | 2020-01-07 | 温州职业技术学院 | Waterproof heat dissipation type base station equipment based on 5G communication |
Also Published As
Publication number | Publication date |
---|---|
EP1949439A2 (en) | 2008-07-30 |
KR20080070001A (en) | 2008-07-29 |
US20070114010A1 (en) | 2007-05-24 |
WO2007056599A2 (en) | 2007-05-18 |
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